JPS6356706B2 - - Google Patents
Info
- Publication number
- JPS6356706B2 JPS6356706B2 JP50202880A JP50202880A JPS6356706B2 JP S6356706 B2 JPS6356706 B2 JP S6356706B2 JP 50202880 A JP50202880 A JP 50202880A JP 50202880 A JP50202880 A JP 50202880A JP S6356706 B2 JPS6356706 B2 JP S6356706B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- package
- conductive
- chip
- ram
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 description 69
- 239000000758 substrate Substances 0.000 description 37
- 239000011229 interlayer Substances 0.000 description 21
- 239000010410 layer Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 7
- 230000015654 memory Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 230000009977 dual effect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000011529 conductive interlayer Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Dram (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12091780A | 1980-02-12 | 1980-02-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57500220A JPS57500220A (US06312121-20011106-C00033.png) | 1982-02-04 |
JPS6356706B2 true JPS6356706B2 (US06312121-20011106-C00033.png) | 1988-11-09 |
Family
ID=22393267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50202880A Expired JPS6356706B2 (US06312121-20011106-C00033.png) | 1980-02-12 | 1980-05-22 |
Country Status (6)
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58159360A (ja) * | 1982-03-17 | 1983-09-21 | Fujitsu Ltd | 半導体装置 |
US4727410A (en) * | 1983-11-23 | 1988-02-23 | Cabot Technical Ceramics, Inc. | High density integrated circuit package |
DE3476297D1 (en) * | 1983-12-28 | 1989-02-23 | Hughes Aircraft Co | Flat package for integrated circuit memory chips |
US4598308A (en) * | 1984-04-02 | 1986-07-01 | Burroughs Corporation | Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die |
US4630096A (en) * | 1984-05-30 | 1986-12-16 | Motorola, Inc. | High density IC module assembly |
US4734315A (en) * | 1985-06-05 | 1988-03-29 | Joyce Florence Space-Bate | Low power circuitry components |
EP0241236A3 (en) * | 1986-04-11 | 1989-03-08 | AT&T Corp. | Cavity package for saw devices and associated electronics |
GB2199182A (en) * | 1986-12-18 | 1988-06-29 | Marconi Electronic Devices | Multilayer circuit arrangement |
FR2625042B1 (fr) * | 1987-12-22 | 1990-04-20 | Thomson Csf | Structure microelectronique hybride modulaire a haute densite d'integration |
US5150196A (en) * | 1989-07-17 | 1992-09-22 | Hughes Aircraft Company | Hermetic sealing of wafer scale integrated wafer |
FR2772516B1 (fr) * | 1997-12-12 | 2003-07-04 | Ela Medical Sa | Circuit electronique, notamment pour un dispositif medical implantable actif tel qu'un stimulateur ou defibrillateur cardiaque, et son procede de realisation |
GB9915076D0 (en) * | 1999-06-28 | 1999-08-25 | Shen Ming Tung | Integrated circuit packaging structure |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3341649A (en) * | 1964-01-17 | 1967-09-12 | Signetics Corp | Modular package for semiconductor devices |
US3372310A (en) * | 1965-04-30 | 1968-03-05 | Radiation Inc | Universal modular packages for integrated circuits |
US3500440A (en) * | 1968-01-08 | 1970-03-10 | Interamericano Projects Inc | Functional building blocks facilitating mass production of electronic equipment by unskilled labor |
US3555364A (en) * | 1968-01-31 | 1971-01-12 | Drexel Inst Of Technology | Microelectronic modules and assemblies |
JPS5332233B1 (US06312121-20011106-C00033.png) * | 1968-12-25 | 1978-09-07 | ||
US3746934A (en) * | 1971-05-06 | 1973-07-17 | Siemens Ag | Stack arrangement of semiconductor chips |
US3760090A (en) * | 1971-08-19 | 1973-09-18 | Globe Union Inc | Electronic circuit package and method for making same |
US3927815A (en) * | 1971-11-22 | 1975-12-23 | Ngk Insulators Ltd | Method for producing multilayer metallized beryllia ceramics |
US3777220A (en) * | 1972-06-30 | 1973-12-04 | Ibm | Circuit panel and method of construction |
US3777221A (en) * | 1972-12-18 | 1973-12-04 | Ibm | Multi-layer circuit package |
US4012766A (en) * | 1973-08-28 | 1977-03-15 | Western Digital Corporation | Semiconductor package and method of manufacture thereof |
US4038488A (en) * | 1975-05-12 | 1977-07-26 | Cambridge Memories, Inc. | Multilayer ceramic multi-chip, dual in-line packaging assembly |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
US4224637A (en) * | 1978-08-10 | 1980-09-23 | Minnesota Mining And Manufacturing Company | Leaded mounting and connector unit for an electronic device |
-
1980
- 1980-05-22 NL NL8020334A patent/NL8020334A/nl unknown
- 1980-05-22 JP JP50202880A patent/JPS6356706B2/ja not_active Expired
- 1980-05-22 WO PCT/US1980/000662 patent/WO1981002367A1/en active Application Filing
- 1980-05-22 GB GB8129603A patent/GB2083285B/en not_active Expired
-
1981
- 1981-02-11 CA CA000370651A patent/CA1165465A/en not_active Expired
- 1981-02-12 FR FR8102748A patent/FR2476389A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
WO1981002367A1 (en) | 1981-08-20 |
GB2083285B (en) | 1984-08-15 |
GB2083285A (en) | 1982-03-17 |
JPS57500220A (US06312121-20011106-C00033.png) | 1982-02-04 |
CA1165465A (en) | 1984-04-10 |
NL8020334A (US06312121-20011106-C00033.png) | 1982-01-04 |
FR2476389B1 (US06312121-20011106-C00033.png) | 1983-12-16 |
FR2476389A1 (fr) | 1981-08-21 |
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