JPS635624U - - Google Patents
Info
- Publication number
- JPS635624U JPS635624U JP9862586U JP9862586U JPS635624U JP S635624 U JPS635624 U JP S635624U JP 9862586 U JP9862586 U JP 9862586U JP 9862586 U JP9862586 U JP 9862586U JP S635624 U JPS635624 U JP S635624U
- Authority
- JP
- Japan
- Prior art keywords
- heat insulating
- insulating plates
- support columns
- wafer
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
Description
第１図は本考案に係る断熱装置の実施例を示す
斜視図、第２図は上記断熱装置を備えた半導体製
造用減圧ＣＶＤ装置の断面図、第３図は本考案の
断熱装置の断熱効果についての実験例を示す線図
である。
１…断熱体、２…真空チヤンバ、３…ウエハ駆
動機構、４…面発熱体、５…ウエハ、１１…断熱
板、１２…支持柱。
Fig. 1 is a perspective view showing an embodiment of the heat insulating device according to the present invention, Fig. 2 is a sectional view of a low pressure CVD equipment for semiconductor manufacturing equipped with the above heat insulating device, and Fig. 3 is the heat insulation effect of the heat insulating device of the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Heat insulating body, 2... Vacuum chamber, 3... Wafer drive mechanism, 4... Surface heating element, 5... Wafer, 11... Heat insulating board, 12... Support column.
Claims (1)
ハを加熱するための面発熱体との間に介在させる
断熱体を、間隔を置いて重積した快削性セラミツ
クからなる多数の断熱板の間に、それらの間隔を
保持させるための断熱材からなる支持柱を、交互
に上記断熱板の面内において離れた位置に配置し
て、それらの断熱板及び支持柱を固定することに
より構成したことを特徴とする半導体製造用ＣＶ
Ｄ装置における断熱装置。 A heat insulating body is interposed between the wafer drive mechanism and the surface heating element for heating the wafer in the vacuum chamber, and the heat insulating body is placed between a number of heat insulating plates made of free-cutting ceramic stacked at intervals. Semiconductor manufacturing, characterized in that support columns made of heat insulating material for holding the heat insulating plates are alternately arranged at separate positions within the plane of the heat insulating plates, and the heat insulating plates and the support columns are fixed. CV for
Insulation device in D device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098625U JPH0525228Y2 (en) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098625U JPH0525228Y2 (en) | 1986-06-27 | 1986-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS635624U true JPS635624U (en) | 1988-01-14 |
| JPH0525228Y2 JPH0525228Y2 (en) | 1993-06-25 |
Family
ID=30966735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986098625U Expired - Lifetime JPH0525228Y2 (en) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525228Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49107676A (en) * | 1973-02-16 | 1974-10-12 |
-
1986
- 1986-06-27 JP JP1986098625U patent/JPH0525228Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49107676A (en) * | 1973-02-16 | 1974-10-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525228Y2 (en) | 1993-06-25 |
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