JPS6355493U - - Google Patents
Info
- Publication number
- JPS6355493U JPS6355493U JP14679286U JP14679286U JPS6355493U JP S6355493 U JPS6355493 U JP S6355493U JP 14679286 U JP14679286 U JP 14679286U JP 14679286 U JP14679286 U JP 14679286U JP S6355493 U JPS6355493 U JP S6355493U
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- circuit board
- printed circuit
- slits
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は、本考案の高周波回路のシールド構造
の一実施例の一部切欠き分解斜視図であり、第２
図は、第１図のＡ―Ａ組立断面図であり、第３図
は、第１図のＢ―Ｂ組立断面図であり、第４図は
、従来の高周波回路のシールド構造の一部切欠き
斜視図である。
１１：プリント基板、１２：スリツト、１３，
１４：区画、１５：連絡部、１６：電極、２０：
シールド板、２１：凸部、２２：凹部、３０：半
田付け。
FIG. 1 is a partially cutaway exploded perspective view of an embodiment of the shielding structure for a high frequency circuit according to the present invention;
The figures are an assembled cross-sectional view taken along line AA in Figure 1, Figure 3 is an assembled cross-sectional view taken along line B-B in Figure 1, and Figure 4 is a partially cut-away view of the shield structure of a conventional high-frequency circuit. It is a cutaway perspective view. 11: Printed circuit board, 12: Slit, 13,
14: Compartment, 15: Communication part, 16: Electrode, 20:
Shield plate, 21: Convex portion, 22: Concave portion, 30: Soldering.
Claims (1)
数の区画に分け、前記スリツトが穿設されずに前
記区画間を連絡する連絡部の上下全面に前記スリ
ツトより幅の広い電極を配設し、前記区画に高周
波的に分離すべき高周波回路をそれぞれ配置し、
前記プリント基板に立設するシールド板の下縁に
前記スリツトを貫通する凸部と前記連絡部の上面
に当接する凹部とを形成し、前記プリント基板に
前記シールド板を立設した状態で前記シールド板
と前記電極を半田付けすることを特徴とした高周
波回路のシールド構造。 A single printed circuit board is divided into a plurality of sections by making slits, and electrodes wider than the slits are provided on the entire upper and lower surfaces of the connecting portions that communicate between the sections without the slits being made. High frequency circuits that should be separated in terms of high frequency are placed in each section,
A convex portion passing through the slit and a concave portion abutting the upper surface of the communication portion are formed on the lower edge of the shield plate erected on the printed circuit board, and when the shield plate is erected on the printed circuit board, the shield A shield structure for a high frequency circuit characterized by soldering a plate and the electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14679286U JPS6355493U (en) | 1986-09-25 | 1986-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14679286U JPS6355493U (en) | 1986-09-25 | 1986-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355493U true JPS6355493U (en) | 1988-04-13 |
Family
ID=31059581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14679286U Pending JPS6355493U (en) | 1986-09-25 | 1986-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355493U (en) |
-
1986
- 1986-09-25 JP JP14679286U patent/JPS6355493U/ja active Pending