JPS6354035B2 - - Google Patents

Info

Publication number
JPS6354035B2
JPS6354035B2 JP57207504A JP20750482A JPS6354035B2 JP S6354035 B2 JPS6354035 B2 JP S6354035B2 JP 57207504 A JP57207504 A JP 57207504A JP 20750482 A JP20750482 A JP 20750482A JP S6354035 B2 JPS6354035 B2 JP S6354035B2
Authority
JP
Japan
Prior art keywords
sheet
release agent
acrylic resin
release
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57207504A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5998186A (ja
Inventor
Yukio Hosoda
Mitsutoshi Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Oji Paper Co Ltd
Original Assignee
Oji Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oji Paper Co Ltd filed Critical Oji Paper Co Ltd
Priority to JP57207504A priority Critical patent/JPS5998186A/ja
Publication of JPS5998186A publication Critical patent/JPS5998186A/ja
Publication of JPS6354035B2 publication Critical patent/JPS6354035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Adhesive Tapes (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP57207504A 1982-11-29 1982-11-29 剥離シ−ト Granted JPS5998186A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57207504A JPS5998186A (ja) 1982-11-29 1982-11-29 剥離シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57207504A JPS5998186A (ja) 1982-11-29 1982-11-29 剥離シ−ト

Publications (2)

Publication Number Publication Date
JPS5998186A JPS5998186A (ja) 1984-06-06
JPS6354035B2 true JPS6354035B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-10-26

Family

ID=16540809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57207504A Granted JPS5998186A (ja) 1982-11-29 1982-11-29 剥離シ−ト

Country Status (1)

Country Link
JP (1) JPS5998186A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375199A (ja) * 1986-09-10 1988-04-05 新王子製紙株式会社 剥離紙
WO1988003743A1 (en) * 1986-11-13 1988-05-19 Johnston James A Method and apparatus for manufacturing printed circuit boards
JPH0635720B2 (ja) * 1987-12-11 1994-05-11 神崎製紙株式会社 剥離紙
JP2792714B2 (ja) * 1990-05-09 1998-09-03 本田技研工業株式会社 スリップキャスティング製法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5118451B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-12-13 1976-06-10
JPS5442410A (en) * 1977-09-06 1979-04-04 Koyo Sangyo Co Production of release paper
JPS6024224B2 (ja) * 1977-12-20 1985-06-12 三井東圧化学株式会社 被覆加工組成物
JPS6050392B2 (ja) * 1980-09-30 1985-11-08 日東電工株式会社 剥離性被膜形成剤
JPS57105432A (en) * 1980-12-22 1982-06-30 Asahi Chem Ind Co Ltd Aqueous dispersion

Also Published As

Publication number Publication date
JPS5998186A (ja) 1984-06-06

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