JPS6353263B2 - - Google Patents
Info
- Publication number
- JPS6353263B2 JPS6353263B2 JP54129147A JP12914779A JPS6353263B2 JP S6353263 B2 JPS6353263 B2 JP S6353263B2 JP 54129147 A JP54129147 A JP 54129147A JP 12914779 A JP12914779 A JP 12914779A JP S6353263 B2 JPS6353263 B2 JP S6353263B2
- Authority
- JP
- Japan
- Prior art keywords
- copper tape
- solder
- tape
- rolls
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12914779A JPS5655559A (en) | 1979-10-05 | 1979-10-05 | Partial solder plating method to copper tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12914779A JPS5655559A (en) | 1979-10-05 | 1979-10-05 | Partial solder plating method to copper tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5655559A JPS5655559A (en) | 1981-05-16 |
| JPS6353263B2 true JPS6353263B2 (fr) | 1988-10-21 |
Family
ID=15002287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12914779A Granted JPS5655559A (en) | 1979-10-05 | 1979-10-05 | Partial solder plating method to copper tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5655559A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105886989B (zh) * | 2016-06-03 | 2018-05-08 | 苏州宇邦新型材料股份有限公司 | 制备焊带的装置及其制备焊带的方法 |
-
1979
- 1979-10-05 JP JP12914779A patent/JPS5655559A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5655559A (en) | 1981-05-16 |
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