JPS6353263B2 - - Google Patents

Info

Publication number
JPS6353263B2
JPS6353263B2 JP54129147A JP12914779A JPS6353263B2 JP S6353263 B2 JPS6353263 B2 JP S6353263B2 JP 54129147 A JP54129147 A JP 54129147A JP 12914779 A JP12914779 A JP 12914779A JP S6353263 B2 JPS6353263 B2 JP S6353263B2
Authority
JP
Japan
Prior art keywords
copper tape
solder
tape
rolls
roll
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54129147A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5655559A (en
Inventor
Hajime Abe
Katsumi Nakada
Toyohiko Kumakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP12914779A priority Critical patent/JPS5655559A/ja
Publication of JPS5655559A publication Critical patent/JPS5655559A/ja
Publication of JPS6353263B2 publication Critical patent/JPS6353263B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP12914779A 1979-10-05 1979-10-05 Partial solder plating method to copper tape Granted JPS5655559A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12914779A JPS5655559A (en) 1979-10-05 1979-10-05 Partial solder plating method to copper tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12914779A JPS5655559A (en) 1979-10-05 1979-10-05 Partial solder plating method to copper tape

Publications (2)

Publication Number Publication Date
JPS5655559A JPS5655559A (en) 1981-05-16
JPS6353263B2 true JPS6353263B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-10-21

Family

ID=15002287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12914779A Granted JPS5655559A (en) 1979-10-05 1979-10-05 Partial solder plating method to copper tape

Country Status (1)

Country Link
JP (1) JPS5655559A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105886989B (zh) * 2016-06-03 2018-05-08 苏州宇邦新型材料股份有限公司 制备焊带的装置及其制备焊带的方法
PL444253A1 (pl) * 2023-03-29 2024-09-30 Sieć Badawcza Łukasiewicz - Instytut Metali Nieżelaznych Sposób wytwarzania lutowniczych materiałów warstwowych na bazie miedzi i stopu srebra

Also Published As

Publication number Publication date
JPS5655559A (en) 1981-05-16

Similar Documents

Publication Publication Date Title
US3707102A (en) Film perforating apparatus
JPS54138371A (en) Solder supplying method
US3582010A (en) Apparatus for and method of making a coil construction
JPS6353263B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US3696777A (en) Machines for forming wound rolls of sheet material
JPS5582676A (en) Heat-sensitive transfer recording device
GB920135A (en) Marking apparatus
JP3623703B2 (ja) 電子部品半田付け装置
US2087225A (en) Welding apparatus
JPS631385Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS59145191A (ja) インクシ−トの製造方法
CN219074616U (zh) 一种耐高温低烟无卤阻燃插头电源线焊接装置
US3251179A (en) Material twisting apparatus
JP2605517Y2 (ja) プリント基板用印刷機
US1334947A (en) Apparatus for and method of manufacturing mounted gold-leaf
JPS603905B2 (ja) ハンド式はんだ線引き具
JP2700926B2 (ja) 金属短繊維植毛金属板の製造法
JPH0522372Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US3845383A (en) Method and apparatus for inspection of ferro-magnetic billets
JPH0543903Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US2360037A (en) Coating apparatus
SU103061A1 (ru) Станок-автомат дл нанесени сплава
US1804911A (en) Core covering apparatus
JPS55235A (en) Recording
JPS636816Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)