JPS635239Y2 - - Google Patents

Info

Publication number
JPS635239Y2
JPS635239Y2 JP1982018360U JP1836082U JPS635239Y2 JP S635239 Y2 JPS635239 Y2 JP S635239Y2 JP 1982018360 U JP1982018360 U JP 1982018360U JP 1836082 U JP1836082 U JP 1836082U JP S635239 Y2 JPS635239 Y2 JP S635239Y2
Authority
JP
Japan
Prior art keywords
lead piece
semiconductor chip
lead
resin
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982018360U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58122457U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1836082U priority Critical patent/JPS58122457U/ja
Publication of JPS58122457U publication Critical patent/JPS58122457U/ja
Application granted granted Critical
Publication of JPS635239Y2 publication Critical patent/JPS635239Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1836082U 1982-02-12 1982-02-12 半導体装置 Granted JPS58122457U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1836082U JPS58122457U (ja) 1982-02-12 1982-02-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1836082U JPS58122457U (ja) 1982-02-12 1982-02-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS58122457U JPS58122457U (ja) 1983-08-20
JPS635239Y2 true JPS635239Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-02-12

Family

ID=30030615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1836082U Granted JPS58122457U (ja) 1982-02-12 1982-02-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS58122457U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2532821B2 (ja) * 1994-07-11 1996-09-11 松下電子工業株式会社 半導体装置
KR100735325B1 (ko) * 2006-04-17 2007-07-04 삼성전기주식회사 발광다이오드 패키지 및 그 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116702Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1977-07-01 1986-05-22
JPS5572065A (en) * 1978-11-25 1980-05-30 Mitsubishi Electric Corp Plastic-molded type semiconductor device

Also Published As

Publication number Publication date
JPS58122457U (ja) 1983-08-20

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