JPS635237Y2 - - Google Patents

Info

Publication number
JPS635237Y2
JPS635237Y2 JP1982173735U JP17373582U JPS635237Y2 JP S635237 Y2 JPS635237 Y2 JP S635237Y2 JP 1982173735 U JP1982173735 U JP 1982173735U JP 17373582 U JP17373582 U JP 17373582U JP S635237 Y2 JPS635237 Y2 JP S635237Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
wiring pattern
sealing
semiconductor device
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982173735U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5977231U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17373582U priority Critical patent/JPS5977231U/ja
Publication of JPS5977231U publication Critical patent/JPS5977231U/ja
Application granted granted Critical
Publication of JPS635237Y2 publication Critical patent/JPS635237Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP17373582U 1982-11-16 1982-11-16 半導体装置 Granted JPS5977231U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17373582U JPS5977231U (ja) 1982-11-16 1982-11-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17373582U JPS5977231U (ja) 1982-11-16 1982-11-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS5977231U JPS5977231U (ja) 1984-05-25
JPS635237Y2 true JPS635237Y2 (enrdf_load_stackoverflow) 1988-02-12

Family

ID=30378401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17373582U Granted JPS5977231U (ja) 1982-11-16 1982-11-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS5977231U (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413966A (en) * 1977-07-01 1979-02-01 Nippon Electric Co Substrate for multiilayer wiring
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
JPS5731165A (en) * 1980-07-31 1982-02-19 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS5977231U (ja) 1984-05-25

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