JPS6351798B2 - - Google Patents

Info

Publication number
JPS6351798B2
JPS6351798B2 JP57108520A JP10852082A JPS6351798B2 JP S6351798 B2 JPS6351798 B2 JP S6351798B2 JP 57108520 A JP57108520 A JP 57108520A JP 10852082 A JP10852082 A JP 10852082A JP S6351798 B2 JPS6351798 B2 JP S6351798B2
Authority
JP
Japan
Prior art keywords
clad
alloy
band
base material
strips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57108520A
Other languages
English (en)
Japanese (ja)
Other versions
JPS591078A (ja
Inventor
Teruo Watanabe
Shoki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP57108520A priority Critical patent/JPS591078A/ja
Publication of JPS591078A publication Critical patent/JPS591078A/ja
Publication of JPS6351798B2 publication Critical patent/JPS6351798B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57108520A 1982-06-25 1982-06-25 クラツド帯の製造方法 Granted JPS591078A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57108520A JPS591078A (ja) 1982-06-25 1982-06-25 クラツド帯の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57108520A JPS591078A (ja) 1982-06-25 1982-06-25 クラツド帯の製造方法

Publications (2)

Publication Number Publication Date
JPS591078A JPS591078A (ja) 1984-01-06
JPS6351798B2 true JPS6351798B2 (enExample) 1988-10-17

Family

ID=14486876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57108520A Granted JPS591078A (ja) 1982-06-25 1982-06-25 クラツド帯の製造方法

Country Status (1)

Country Link
JP (1) JPS591078A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254495A (ja) * 1985-04-30 1986-11-12 株式会社ナブコ 遠隔制御装置
US4750262A (en) * 1986-05-01 1988-06-14 International Business Machines Corp. Method of fabricating a printed circuitry substrate
JP2565847Y2 (ja) * 1989-10-31 1998-03-25 株式会社ゼクセル ブラシレスモータ制御装置
JPH03231839A (ja) * 1990-02-07 1991-10-15 Sumitomo Special Metals Co Ltd Cu系リードフレーム材料

Also Published As

Publication number Publication date
JPS591078A (ja) 1984-01-06

Similar Documents

Publication Publication Date Title
US6845898B2 (en) Bondhead lead clamp apparatus
KR20020060695A (ko) 금속 합성 연마재에 의한 마이크로일렉트로닉 기판의기계적 및 화학-기계적 평탄화를 위한 방법 및 장치
US5913719A (en) Workpiece holding mechanism
JPS591078A (ja) クラツド帯の製造方法
TW200301518A (en) Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive article
JP2538071B2 (ja) 半導体装置の製造方法
US5674352A (en) Process related to a modified polishing pad for polishing
US4437236A (en) Solder bonding process
US3068823A (en) Soldering apparatus
CN116390382A (zh) 一种薄膜电路中侧面图形制作方法
US3768208A (en) Rolling and burnishing of contact surfaces
JPS597489A (ja) クラツド帯の製造方法
JP2537656B2 (ja) ワイヤボンディング装置
JPS5919086A (ja) クラツド帯の製造方法
KR200173174Y1 (ko) 웨이퍼 연마장치
JPS62296978A (ja) クラツド材の製造方法
JPH0211987Y2 (enExample)
JP3300666B2 (ja) ワイヤの巻取方法及びその装置
JPH04322889A (ja) クラッド材とその製造方法
JPS5823493Y2 (ja) 素材押え弾性体を備えた電極
JPS62214885A (ja) クラツド材の製造方法
JPS5851645B2 (ja) 電気接点製造方法
RU1805022C (ru) Торцовый полировальный инструмент
JPS61164726A (ja) ワイヤ電極案内
JPS60246643A (ja) テ−プボンダ