JPS6351798B2 - - Google Patents
Info
- Publication number
- JPS6351798B2 JPS6351798B2 JP57108520A JP10852082A JPS6351798B2 JP S6351798 B2 JPS6351798 B2 JP S6351798B2 JP 57108520 A JP57108520 A JP 57108520A JP 10852082 A JP10852082 A JP 10852082A JP S6351798 B2 JPS6351798 B2 JP S6351798B2
- Authority
- JP
- Japan
- Prior art keywords
- clad
- alloy
- band
- base material
- strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57108520A JPS591078A (ja) | 1982-06-25 | 1982-06-25 | クラツド帯の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57108520A JPS591078A (ja) | 1982-06-25 | 1982-06-25 | クラツド帯の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS591078A JPS591078A (ja) | 1984-01-06 |
| JPS6351798B2 true JPS6351798B2 (enExample) | 1988-10-17 |
Family
ID=14486876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57108520A Granted JPS591078A (ja) | 1982-06-25 | 1982-06-25 | クラツド帯の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS591078A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61254495A (ja) * | 1985-04-30 | 1986-11-12 | 株式会社ナブコ | 遠隔制御装置 |
| US4750262A (en) * | 1986-05-01 | 1988-06-14 | International Business Machines Corp. | Method of fabricating a printed circuitry substrate |
| JP2565847Y2 (ja) * | 1989-10-31 | 1998-03-25 | 株式会社ゼクセル | ブラシレスモータ制御装置 |
| JPH03231839A (ja) * | 1990-02-07 | 1991-10-15 | Sumitomo Special Metals Co Ltd | Cu系リードフレーム材料 |
-
1982
- 1982-06-25 JP JP57108520A patent/JPS591078A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS591078A (ja) | 1984-01-06 |
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