JPS6351482U - - Google Patents
Info
- Publication number
- JPS6351482U JPS6351482U JP14621786U JP14621786U JPS6351482U JP S6351482 U JPS6351482 U JP S6351482U JP 14621786 U JP14621786 U JP 14621786U JP 14621786 U JP14621786 U JP 14621786U JP S6351482 U JPS6351482 U JP S6351482U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- layer made
- substrate body
- conductive pattern
- terminal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
Landscapes
- Contacts (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図乃至第３図は本考案の一実施例を示すも
ので、第１図は平面図、第２図は縦断側面図、第
３図は要部の拡大断面図である。また、第４図は
本考案の第２の実施例を示す縦断側面図、第５図
及び第６図は従来例を示す夫々第１図及び第２図
相当図である。
図中、５は基板本体、６は導電パターン層、７
はターミナル部、８はＩＣベアチツプ、９はボン
デイングワイヤ、１０，１３は接点部、１１は中
間層、１２は接点層を示す。
1 to 3 show an embodiment of the present invention, in which FIG. 1 is a plan view, FIG. 2 is a vertical side view, and FIG. 3 is an enlarged sectional view of the main part. Further, FIG. 4 is a longitudinal sectional side view showing a second embodiment of the present invention, and FIGS. 5 and 6 are views corresponding to FIGS. 1 and 2, respectively, showing a conventional example. In the figure, 5 is the substrate body, 6 is a conductive pattern layer, and 7 is a conductive pattern layer.
1 is a terminal portion, 8 is an IC bare chip, 9 is a bonding wire, 10 and 13 are contact portions, 11 is an intermediate layer, and 12 is a contact layer.
Claims (1)
ワイヤを介して接続されるターミナル部及びスイ
ツチ機構の一部を構成する接点部を形成したもの
であつて、前記ターミナル部及び接点部を、前記
基板本体上に形成された銅等の導電材料より成る
導電パターン層と、この導電パターン層上に形成
されたニツケル等の硬度が高い導電材料より成る
中間層と、この中間層上に形成された金等の接触
抵抗が小さい接点材料より成る接点層とから構成
したことを特徴とするプリント配線基板。 A terminal portion to which an IC bare chip is connected via a bonding wire and a contact portion constituting a part of a switch mechanism are formed on the substrate body, and the terminal portion and the contact portion are formed on the substrate body. Contact between a formed conductive pattern layer made of a conductive material such as copper, an intermediate layer formed on this conductive pattern layer made of a hard conductive material such as nickel, and gold etc. formed on this intermediate layer. 1. A printed wiring board comprising a contact layer made of a contact material with low resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14621786U JPS6351482U (en) | 1986-09-24 | 1986-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14621786U JPS6351482U (en) | 1986-09-24 | 1986-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351482U true JPS6351482U (en) | 1988-04-07 |
Family
ID=31058483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14621786U Pending JPS6351482U (en) | 1986-09-24 | 1986-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351482U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58130594A (en) * | 1982-01-29 | 1983-08-04 | 株式会社東芝 | Printed circuit board |
-
1986
- 1986-09-24 JP JP14621786U patent/JPS6351482U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58130594A (en) * | 1982-01-29 | 1983-08-04 | 株式会社東芝 | Printed circuit board |