JPS6351453U - - Google Patents
Info
- Publication number
- JPS6351453U JPS6351453U JP1986146719U JP14671986U JPS6351453U JP S6351453 U JPS6351453 U JP S6351453U JP 1986146719 U JP1986146719 U JP 1986146719U JP 14671986 U JP14671986 U JP 14671986U JP S6351453 U JPS6351453 U JP S6351453U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- copper plate
- solid state
- state relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案のソリツド・ステート・リレー
の一実施例の断面図、第２図及び第３図は夫々異
なる従来のソリツド・ステート・リレーの断面図
である。
１：パワーチツプ、２：点弧用ホトカプラ、３
：受動部品、４′：リードピン、６：アルミ線、
８：絶縁封止材料、１０：プリント配線板（ＰＷ
Ｂ）、１１：銅板。
FIG. 1 is a sectional view of one embodiment of the solid state relay of the present invention, and FIGS. 2 and 3 are sectional views of different conventional solid state relays. 1: Power chip, 2: Ignition photocoupler, 3
: Passive component, 4': Lead pin, 6: Aluminum wire,
8: Insulating sealing material, 10: Printed wiring board (PW
B), 11: Copper plate.
Claims (1)
含むソリツド・ステート・リレーにおいて、プリ
ント配線板と銅板を備えてなり、該銅板に前記パ
ワーチツプをダイボンドするとともに、前記プリ
ント配線板には前記デイスクリート部品を実装し
、前記プリント配線板裏面に前記銅板を少なくと
も一部分を重ねて張合わせてなることを特徴とす
るソリツド・ステート・リレー。 A solid state relay including a power chip and a plurality of discrete components includes a printed wiring board and a copper plate, the power chip is die-bonded to the copper plate, and the discrete components are mounted on the printed wiring board, A solid state relay comprising at least a portion of the copper plate laminated on the back surface of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986146719U JPH0519959Y2 (en) | 1986-09-24 | 1986-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986146719U JPH0519959Y2 (en) | 1986-09-24 | 1986-09-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6351453U true JPS6351453U (en) | 1988-04-07 |
| JPH0519959Y2 JPH0519959Y2 (en) | 1993-05-25 |
Family
ID=31059444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986146719U Expired - Lifetime JPH0519959Y2 (en) | 1986-09-24 | 1986-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519959Y2 (en) |
-
1986
- 1986-09-24 JP JP1986146719U patent/JPH0519959Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519959Y2 (en) | 1993-05-25 |