JPS6350859B2 - - Google Patents
Info
- Publication number
- JPS6350859B2 JPS6350859B2 JP14954783A JP14954783A JPS6350859B2 JP S6350859 B2 JPS6350859 B2 JP S6350859B2 JP 14954783 A JP14954783 A JP 14954783A JP 14954783 A JP14954783 A JP 14954783A JP S6350859 B2 JPS6350859 B2 JP S6350859B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- block
- wiring layer
- layer
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 26
- 229910052782 aluminium Inorganic materials 0.000 description 26
- 238000009792 diffusion process Methods 0.000 description 21
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14954783A JPS5956742A (ja) | 1983-08-18 | 1983-08-18 | 半導体装置の |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14954783A JPS5956742A (ja) | 1983-08-18 | 1983-08-18 | 半導体装置の |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9541876A Division JPS5321584A (en) | 1976-08-12 | 1976-08-12 | Wiring system of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5956742A JPS5956742A (ja) | 1984-04-02 |
JPS6350859B2 true JPS6350859B2 (de) | 1988-10-12 |
Family
ID=15477534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14954783A Granted JPS5956742A (ja) | 1983-08-18 | 1983-08-18 | 半導体装置の |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5956742A (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07120709B2 (ja) * | 1985-03-22 | 1995-12-20 | 日本電気株式会社 | 半導体集積回路の配線方式 |
-
1983
- 1983-08-18 JP JP14954783A patent/JPS5956742A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5956742A (ja) | 1984-04-02 |
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