JPS6349236U - - Google Patents
Info
- Publication number
- JPS6349236U JPS6349236U JP1986142126U JP14212686U JPS6349236U JP S6349236 U JPS6349236 U JP S6349236U JP 1986142126 U JP1986142126 U JP 1986142126U JP 14212686 U JP14212686 U JP 14212686U JP S6349236 U JPS6349236 U JP S6349236U
- Authority
- JP
- Japan
- Prior art keywords
- lens barrel
- prism
- optical path
- bonding
- changing means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Description
第１図は、本考案の一実施例を示す平面図、第
２図は、第１図の側面図、第３図は、第２図の正
面図、第４図は、反射鏡による光路変更手段の説
明図、第５図は、同軸照明付き鏡筒の説明図、第
６図は、ペンタプリズムを使用した本考案の他の
実施例の説明図、第７図は、アミチ屋根型プリズ
ムを使用した本考案の他の実施例の説明図、第８
図は、ワークの高さと作動距離との関係を示す説
明図、第９図は、ＩＴＶカメラ昇降装置を備えた
本考案の他の実施例を示す平面図、第１０図は、
第９図の側面図、第１１図は、第１０図の正面図
、第１２図は、ＩＴＶカメラ昇降装置の他の実施
例を示す正面図、第１３図は、従来のワイヤボン
デイング装置の側面図、第１４図は、第１２図の
正面図である。
１…ステージ、２…ＸＹテーブル、３…ボンデ
イングヘツド、４…ツール、５…ボンデイングア
ーム、６…ＩＴＶカメラ、７…支持アーム、８…
対物レンズ、９…鏡筒、１０…ランプ、２０…光
路変更手段、２１，２２…反射鏡、２３…鏡筒、
２５…ペンタプリズム、２６…アミチ屋根型プリ
ズム、３０…ＩＴＶカメラ昇降装置、３１…支持
台、３２…軸受、３３…パルスモータ、３４…ね
じ軸、３５…カツプリング、３６…モータ軸、３
７…ローラ、３８…スライダ、３９…ナツト部材
、４０…ＩＴＶカメラ昇降装置、４１…支持台、
４２…軸受、４３…パルスモータ、４４…雄ねじ
軸、４５…カツプリング、４６…スライダ、４７
…ボール、４８…ＩＴＶカメラ支持部材。
Fig. 1 is a plan view showing an embodiment of the present invention, Fig. 2 is a side view of Fig. 1, Fig. 3 is a front view of Fig. 2, and Fig. 4 is an optical path change using a reflecting mirror. 5 is an explanatory diagram of a lens barrel with coaxial illumination, FIG. 6 is an explanatory diagram of another embodiment of the present invention using a pentaprism, and FIG. 7 is an explanatory diagram of an amici roof type prism. Explanatory diagram of another embodiment of the present invention used, No. 8
The figure is an explanatory diagram showing the relationship between the height of the workpiece and the working distance, FIG. 9 is a plan view showing another embodiment of the present invention equipped with an ITV camera lifting device, and FIG.
9 is a side view, FIG. 11 is a front view of FIG. 10, FIG. 12 is a front view showing another embodiment of the ITV camera lifting device, and FIG. 13 is a side view of a conventional wire bonding device. 14 is a front view of FIG. 12. DESCRIPTION OF SYMBOLS 1... Stage, 2... XY table, 3... Bonding head, 4... Tool, 5... Bonding arm, 6... ITV camera, 7... Support arm, 8...
Objective lens, 9... Lens barrel, 10... Lamp, 20... Optical path changing means, 21, 22... Reflector, 23... Lens barrel,
25...Penta prism, 26...Amici roof type prism, 30...ITV camera lifting device, 31...support stand, 32...bearing, 33...pulse motor, 34...screw shaft, 35...coupling, 36...motor shaft, 3
7...Roller, 38...Slider, 39...Nut member, 40...ITV camera lifting device, 41...Support stand,
42...Bearing, 43...Pulse motor, 44...Male thread shaft, 45...Coupling, 46...Slider, 47
...Ball, 48...ITV camera support member.
Claims (1)
ジ１の側方に配置されたＸＹテーブル２と、ＸＹ
テーブル２のＹテーブル２ｂ上に載置固定された
ボンデイングヘツド３と、先端にツール４を取付
け、かつボンデイングヘツド３に下動可能に取付
けられたボンデイングアーム５と、先端部に対物
レンズ８を取付けた鏡筒９を備えたＩＴＶカメラ
６とを有するボンデイング装置において、前記鏡
筒９を、その光軸が水平方向となるように、かつ
ボンデイングアームに対して所定距離Ｈを隔てて
平行となるように配置するとともに、前記鏡筒の
先端部には、少なくともワーク上の位置認識箇所
から発した光を前記鏡筒の対物レンズ８の光軸と
一致させるように反射する光路変更手段２０を取
付け、ワーク上の位置認識箇所から前記光路変更
手段２０を通つて対物レンズ８に至る光路長を対
物レンズ８の作動距離ｐに等しくなるように設定
したことを特徴とするボンデイング装置。 ２ 光路変更手段２０が１個のペンタプリズム２
５及び該プリズムを内包した鏡筒２３ａから成る
ものである実用新案登録請求の範囲第１項記載の
ボンデイング装置。 ３ 光路変更手段２０が１個のアミチ屋根型プリ
ズム２６及び該プリズムを内包した鏡筒２３ｂと
から成るものである実用新案登録請求の範囲第１
項記載のボンデイング装置。 ４ 光路変更手段２０が少なくとも位置認識箇所
から上向きに発する光を水平方向でかつ前記対物
レンズ８の光軸と直角方向に反射する第１の反射
鏡２１もしくはプリズムと、その反射された光を
対物レンズ８の光軸に一致させるように反射する
第２の反射鏡２２もしくはプリズムと、該反射鏡
もしくはプリズムを内包する鏡筒２３とから成る
ものである実用新案登録請求の範囲第１項記載の
ボンデイング装置。[Claims for Utility Model Registration] 1. A stage 1 on which a workpiece W is placed, an XY table 2 arranged on the side of the stage 1, and an XY
A bonding head 3 placed and fixed on the Y table 2b of the table 2, a bonding arm 5 having a tool 4 attached to its tip and movably attached to the bonding head 3, and an objective lens 8 attached to its tip. In a bonding apparatus having an ITV camera 6 equipped with a lens barrel 9, the lens barrel 9 is arranged so that its optical axis is horizontal and parallel to the bonding arm at a predetermined distance H. At the same time, an optical path changing means 20 is attached to the tip of the lens barrel to reflect at least the light emitted from the position recognition location on the workpiece so as to match the optical axis of the objective lens 8 of the lens barrel, A bonding apparatus characterized in that an optical path length from a position recognition point on a workpiece to an objective lens 8 via the optical path changing means 20 is set to be equal to a working distance p of the objective lens 8. 2 Pentaprism 2 with one optical path changing means 20
5 and a lens barrel 23a containing the prism. 3 Utility model registration claim 1 in which the optical path changing means 20 consists of one amici roof-type prism 26 and a lens barrel 23b containing the prism
The bonding device described in Section 1. 4. A first reflecting mirror 21 or prism that reflects the light emitted upward from at least the position recognition part by the optical path changing means 20 in a horizontal direction and in a direction perpendicular to the optical axis of the objective lens 8; A utility model according to claim 1, which comprises a second reflecting mirror 22 or prism that reflects the light so as to match the optical axis of the lens 8, and a lens barrel 23 containing the reflecting mirror or prism. bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986142126U JPH0314047Y2 (en) | 1986-09-17 | 1986-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986142126U JPH0314047Y2 (en) | 1986-09-17 | 1986-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6349236U true JPS6349236U (en) | 1988-04-04 |
| JPH0314047Y2 JPH0314047Y2 (en) | 1991-03-28 |
Family
ID=31050557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986142126U Expired JPH0314047Y2 (en) | 1986-09-17 | 1986-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0314047Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5867033A (en) * | 1981-10-19 | 1983-04-21 | Hitachi Ltd | Wire bonding method |
-
1986
- 1986-09-17 JP JP1986142126U patent/JPH0314047Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5867033A (en) * | 1981-10-19 | 1983-04-21 | Hitachi Ltd | Wire bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0314047Y2 (en) | 1991-03-28 |
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