JP3038560B2 - Light section microscopy - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microscope for light sectioning, and more particularly to a fine measurement of a structure in which a monitor head for recognizing a measurement point and a measurement head for measuring the height of the measurement point are shared. The present invention relates to a device for an object.

[0002]

2. Description of the Related Art At present, there are roughly two types of light-sectioning microscopes that are commercially available. The first type is
In order to specify the measurement point of the object to be measured, a method of projecting white light to specify the position is used. The second type uses a laser sensor as the measurement head, and the monitor head of the measurement point is This is a system using a CCD camera different from the laser sensor.

[0003]

However, in the first type of the conventional apparatus, when the height of the object to be measured is smaller than the shape of the white light of the lamp house used for designating the measuring point. Has the disadvantage that the measurement point cannot be specified by this white light. In the second type, a CCD camera is used as a monitor head for a measurement point, and a laser sensor is used as a measurement head for a measurement point. Therefore, there is a problem that the entire apparatus becomes large and complicated. SUMMARY OF THE INVENTION It is an object of the present invention to provide a light section microscope capable of miniaturizing the entire apparatus, accurately monitoring a measurement point of a work to be measured, and measuring actual height and depth.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and measures a measurement point of a work.
CCD camera equipped with a microscope for
Camera base for fixing D camera and this camera base
And an arc around the measurement point
A first bracket having a through hole formed in the first bracket;
Insert through the through hole of the bracket and
Pin supported by the
And an air cylinder for pushing the fork,
A light source for measurement provided at a predetermined position of one bracket,
The CCD camera moves upward with respect to the measurement point of the work
When the direction is set, the measurement point observation and
Monitor head for
The fork is pushed by the air cylinder from the position of
Move the pin along the through hole to
When the camera is set at an angle, the height of the measurement point
As a measuring head for measuring height or depth dimensions
It was configured as a light section microscope for use.

[0005]

According to the present invention, a camera base is mounted above a workpiece to be measured, and a light receiving CC with a microscope mounted.
The D camera can observe the surface condition of the measured point of the work from the upper surface along the arc-shaped through hole in the first bracket. Next, the pin sandwiched by the fork driven by the air cylinder blowing air moves. Since this pin moves along the through hole centered on the measurement point of the workpiece to be measured, the camera base on which the pin is set also rotates along the arc-shaped through hole centered on the measurement point of the work. The rotation of the camera base also rotates the light receiving CCD camera provided with the microscope on the light receiving side. Accordingly, since the rotation of the light receiving CCD camera which is set at an oblique position of the work to be measured and is used as the measurement head is along the arc-shaped through hole centered on the measurement point of the work,
The measurement point of the workpiece can be observed by changing the measurement direction without changing the focal length of the microscope.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The following is a description of embodiments of the present invention.
FIG. 1A is a cut front view of the present embodiment, and FIG.
FIG. 2B is a side view cut along the line AA of FIG. In the figure, reference numeral 1 denotes a work to be measured placed on a table 2.
You. In the present embodiment , a semiconductor element is used as a work, and the height or depth of a part thereof is to be measured. First bracket 3 of L-type are provided towards opposite on the front Symbol table 2, this first bracket 3, outside the measuring light source 4 was attached a projection microscope 4a is mounted, a work the first hole 5 of the measurement points 1a as two of the same mind arcuate through holes around the second
A hole 6 is formed. Measurement point 1a of work 1
A CCD camera 12 for receiving light is arranged just above
I have. The light receiving CCD camera 12 has a microscope.
Mirror 13 is provided and attached to camera base 11
Have been. In the first hole 5 and the second hole 6, a first bearing is provided.
And the second bearing 8 are movably supported.
I have. The camera base 11 is provided with the first bearing 7
Supported by the first pin 9 and the second bearing 8
The first bracket 3 is supported via the second pin 10
Is held. Further, the tip 9a of the first pin 9 is
It is arranged at a position that protrudes through the back side of the bracket 3 and protrudes.
ing. Forks 14 sandwiching the tip 9a of the first pin 9 passing through the first hole 5 is drivingly connected by an air cylinder 16 which is supported by the second bracket 15 fixed to the first bracket 3. Incidentally, beauty concentric arcuate first hole Oyo second bracket 15 attached to the air cylinder 16
The L-shaped first bracket 3 provided with the second hole 6 and the measurement light source 4 is covered with a cover 17. Next,
The operation of the present embodiment will be described. First, the light receiving CCD camera 1
2 is a table in which the measurement point 1a of the work 1 is positioned directly above.
Monitor the surface condition. Then, the air cylinder 16 moves forward.
The fork 14 pushes the tip 9a of the first pin 9 by the operation .
It is dynamic, the first pin 9 and the second pin 1 0, respectively that
The camera base rotates along the first hole 5 and the second hole 6
Rotate 11 to tilt CCD camera 12 for receiving light
Move to position. Then, light from the measurement light source 4 is received.
Light, height and depth dimensions of the work 1 at the measurement point 1a
Will move to the position 12a at the time of measurement. This and
Come, the position 12a during the measurement, the first hole 5, since the measurement points 1a arcuate same heart circle centered, position and measurement point light receiving CCD camera 12 serving as a monitor position 1
Since the distance from “a” does not change, the application can be switched and used for the operation without any adjustment.

[0007]

As described above, according to the present invention, a measuring point of a work to be measured is monitored from above vertically by a light-receiving CCD camera equipped with a microscope, and thereafter, a diagonal arc is formed around the measuring point of the work. Since the position can be switched to a position as a sensor head for receiving the reflected light, there is an effect that the entire device can be monitored and measured with a small size and accurately.

[Brief description of the drawings]

FIG. 1A is a cutaway front view of the present embodiment, and FIG.
FIG. 3 is a side view cut along the line AA of FIG.

[Explanation of symbols]

Reference Signs List 1 work 1a measuring point 2 table 3 first bracket 4 measuring light source 5 first hole (through hole) 6 second hole (through hole) 7 first bearing 8 second bearing 9 first pin (pin) 10 second pin (pin) 11 camera base 12 received CCD camera (CCD camera) 13 microscope 14 fork 15 second bracket 16 air cylinder

Claims (1)

(57) [Claims] 1. A method for measuring a measuring point of a workpiece.
A CCD camera equipped with a microscope and this CCD camera
When you support this camera base
In both cases, the penetrator is formed in an arc around the measurement point.
A first bracket having a through hole;
It is inserted into the through hole and supported by the camera base.
Pin, a fork that sandwiches the tip of this pin, and this
An air cylinder for pushing the fork, and the first bracket
A light source for measurement provided at a predetermined position, wherein the CCD camera moves upward with respect to a measurement point of the workpiece.
When the direction is set, the measurement point observation and
Monitor head for
The fork is pushed by the air cylinder from the position of
Move the pin along the through hole to
When the camera is set at an angle, the height of the measurement point
As a measuring head for measuring height or depth dimensions
A microscope for light sectioning, characterized in that it is used .