JPS59106685U - Laser processing equipment - Google Patents

Laser processing equipment

Info

Publication number
JPS59106685U
JPS59106685U JP1982199929U JP19992982U JPS59106685U JP S59106685 U JPS59106685 U JP S59106685U JP 1982199929 U JP1982199929 U JP 1982199929U JP 19992982 U JP19992982 U JP 19992982U JP S59106685 U JPS59106685 U JP S59106685U
Authority
JP
Japan
Prior art keywords
workpiece
laser processing
amount
processing equipment
drives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982199929U
Other languages
Japanese (ja)
Inventor
弘幸 中野
吉村 喜代和
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP1982199929U priority Critical patent/JPS59106685U/en
Publication of JPS59106685U publication Critical patent/JPS59106685U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の全体構成を示す光学及び機
構的部分の側面図及び制御系のブロック図、第2図は被
加工物の位置検出の一例の原理説明図、第3図はライン
センサ上の照度分布図、第4図は本考案の他の一実施例
の側面図である。 1・・・被加工物載置台、2・・・ステッピングモータ
、3・・・レーザ光源、4・・・レンズ、5・・・ビー
ムスプリッタ、6・・・ラインセンサ、7・・・側御回
路。
Fig. 1 is a side view of the optical and mechanical parts and a block diagram of the control system showing the overall configuration of an embodiment of the present invention, Fig. 2 is a diagram explaining the principle of an example of position detection of a workpiece, and Fig. 3 4 is an illuminance distribution diagram on the line sensor, and FIG. 4 is a side view of another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Workpiece mounting table, 2... Stepping motor, 3... Laser light source, 4... Lens, 5... Beam splitter, 6... Line sensor, 7... Side control circuit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上下方向に可動な被加工物載置台と、回合を上・ 下方
向に駆動するモータと、被加工物から反射する入射レー
ザビームの反射光を受光する撮像素子と、同素子の出力
を解析して被加工物の入射レーザビームに対する焦点外
れ量を検出し、被加工物の合焦位置まで駆動量を算出し
、その量だけ上記゛ モータを駆動する制御回路を備え
たレーザ加工装置。
It consists of a workpiece mounting table that is movable in the vertical direction, a motor that drives the rotation up and down, an image sensor that receives the reflected light of the incident laser beam reflected from the workpiece, and the output of the device is analyzed. A laser processing device comprising: a control circuit that detects the amount of defocus of an incident laser beam on a workpiece, calculates the amount of drive to bring the workpiece into focus, and drives the motor by that amount.
JP1982199929U 1982-12-30 1982-12-30 Laser processing equipment Pending JPS59106685U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982199929U JPS59106685U (en) 1982-12-30 1982-12-30 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982199929U JPS59106685U (en) 1982-12-30 1982-12-30 Laser processing equipment

Publications (1)

Publication Number Publication Date
JPS59106685U true JPS59106685U (en) 1984-07-18

Family

ID=30425458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982199929U Pending JPS59106685U (en) 1982-12-30 1982-12-30 Laser processing equipment

Country Status (1)

Country Link
JP (1) JPS59106685U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006153660A (en) * 2004-11-29 2006-06-15 Tdk Corp Laser ablation apparatus, laser ablation method, sample analyzer and sample analyzing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035796A (en) * 1973-08-01 1975-04-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035796A (en) * 1973-08-01 1975-04-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006153660A (en) * 2004-11-29 2006-06-15 Tdk Corp Laser ablation apparatus, laser ablation method, sample analyzer and sample analyzing method

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