JPS6348424B2 - - Google Patents
Info
- Publication number
- JPS6348424B2 JPS6348424B2 JP58032186A JP3218683A JPS6348424B2 JP S6348424 B2 JPS6348424 B2 JP S6348424B2 JP 58032186 A JP58032186 A JP 58032186A JP 3218683 A JP3218683 A JP 3218683A JP S6348424 B2 JPS6348424 B2 JP S6348424B2
- Authority
- JP
- Japan
- Prior art keywords
- jcr
- semiconductor element
- resin
- stabilizing
- coating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/01—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58032186A JPS59158531A (ja) | 1983-02-28 | 1983-02-28 | 半導体素子の表面安定化法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58032186A JPS59158531A (ja) | 1983-02-28 | 1983-02-28 | 半導体素子の表面安定化法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59158531A JPS59158531A (ja) | 1984-09-08 |
| JPS6348424B2 true JPS6348424B2 (cg-RX-API-DMAC10.html) | 1988-09-29 |
Family
ID=12351877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58032186A Granted JPS59158531A (ja) | 1983-02-28 | 1983-02-28 | 半導体素子の表面安定化法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158531A (cg-RX-API-DMAC10.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2608407B2 (ja) * | 1987-04-24 | 1997-05-07 | 東レ・ダウコーニング・シリコーン株式会社 | 樹脂封止型半導体装置 |
| JP4892209B2 (ja) * | 2005-08-22 | 2012-03-07 | 日立化成デュポンマイクロシステムズ株式会社 | 半導体装置の製造方法 |
| JP4691417B2 (ja) | 2005-08-22 | 2011-06-01 | 日立化成デュポンマイクロシステムズ株式会社 | 回路接続構造体及びその製造方法及び回路接続構造体用の半導体基板 |
-
1983
- 1983-02-28 JP JP58032186A patent/JPS59158531A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59158531A (ja) | 1984-09-08 |
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