JPS6348199B2 - - Google Patents

Info

Publication number
JPS6348199B2
JPS6348199B2 JP56061042A JP6104281A JPS6348199B2 JP S6348199 B2 JPS6348199 B2 JP S6348199B2 JP 56061042 A JP56061042 A JP 56061042A JP 6104281 A JP6104281 A JP 6104281A JP S6348199 B2 JPS6348199 B2 JP S6348199B2
Authority
JP
Japan
Prior art keywords
conductive strip
conductive
films
contact
overlay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56061042A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57176790A (en
Inventor
Tatsuo Wada
Teruaki Yamamoto
Jiro Isomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP56061042A priority Critical patent/JPS57176790A/ja
Publication of JPS57176790A publication Critical patent/JPS57176790A/ja
Publication of JPS6348199B2 publication Critical patent/JPS6348199B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP56061042A 1981-04-22 1981-04-22 Method of producing laminated printed circuit board Granted JPS57176790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56061042A JPS57176790A (en) 1981-04-22 1981-04-22 Method of producing laminated printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56061042A JPS57176790A (en) 1981-04-22 1981-04-22 Method of producing laminated printed circuit board

Publications (2)

Publication Number Publication Date
JPS57176790A JPS57176790A (en) 1982-10-30
JPS6348199B2 true JPS6348199B2 (enExample) 1988-09-28

Family

ID=13159790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56061042A Granted JPS57176790A (en) 1981-04-22 1981-04-22 Method of producing laminated printed circuit board

Country Status (1)

Country Link
JP (1) JPS57176790A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6136893A (ja) * 1984-07-28 1986-02-21 株式会社 サト− 平面状共振回路の製造方法
DE102004002421A1 (de) * 2004-01-16 2005-08-18 Atotech Deutschland Gmbh Düsenanordnung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015072A (enExample) * 1973-06-13 1975-02-17
JPS52124912A (en) * 1976-04-09 1977-10-20 Toyo Aluminium Kk Production of metalized paper
JPS5361065A (en) * 1976-11-12 1978-06-01 Koito Mfg Co Ltd Method of producing printed circuit board conductor circuit

Also Published As

Publication number Publication date
JPS57176790A (en) 1982-10-30

Similar Documents

Publication Publication Date Title
SU1542430A3 (ru) Устройство дл изготовлени многослойных изделий
KR100297311B1 (ko) 천공구멍을구비한인쇄회로기판의전해처리방법및그방법을수행하는장치
MXPA06002649A (es) Dispositivo y metodo para tratar electroliticamente estructuras electricamente aisladas.
US6364247B1 (en) Pneumatic flotation device for continuous web processing and method of making the pneumatic flotation device
US2750332A (en) Method and apparatus for electrodeposition of a layer of uniform thickness on a conductive surface
JP5673582B2 (ja) 電気めっきの前処理方法及び該前処理方法を含んだ電気めっき方法による銅張積層樹脂フィルムの製造方法
US6991717B2 (en) Web processing method and apparatus
US4323441A (en) Apparatus for electroplating strip material without current leakage
JPS6348199B2 (enExample)
CN110418679B (zh) 模头装置、涂布方法及层叠体形成装置
CN112779578B (zh) 一种超薄膜电镀装置
CN101796223B (zh) 网的处理方法、处理槽、连续电解电镀装置及带有电镀膜的塑料膜的制造方法
US3539490A (en) Plating of stripes on longitudinal electrically conductive material
CN105143522A (zh) 连续镀敷装置及连续镀敷方法
JPS59177390A (ja) 動いている金属ストリツプを片側電気メツキする方法及び装置
US3629077A (en) Process for plating of stripes on longitudinal electrically conductive material
JP4719903B2 (ja) 塗工剤のコーティング方法およびコーティング装置
CN115305557A (zh) 导电带式镀膜机
CN101405823B (zh) 固体电解电容器的制造装置、固体电解电容器的制造方法、固体电解电容器
KR960015230B1 (ko) 방사형 셀 전기용착용 전류전송 장치 및 방법
CN114959857A (zh) 一种不溶性阳极电镀设备及其电镀工艺
BRPI0807609A2 (pt) Sistemas de célula foto-voltáica
CN217677862U (zh) 一种电镀部件
JPS57101693A (en) Vicinal electrolytic apparatus for strip
JP2003003294A (ja) 全面電気メッキ装置及びそれによって製造される全面メッキリードフレーム