JPS6347267B2 - - Google Patents

Info

Publication number
JPS6347267B2
JPS6347267B2 JP57105857A JP10585782A JPS6347267B2 JP S6347267 B2 JPS6347267 B2 JP S6347267B2 JP 57105857 A JP57105857 A JP 57105857A JP 10585782 A JP10585782 A JP 10585782A JP S6347267 B2 JPS6347267 B2 JP S6347267B2
Authority
JP
Japan
Prior art keywords
plating layer
tin
lead frame
glossy
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57105857A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58222551A (ja
Inventor
Osamu Yoshioka
Yoshinori Bando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP57105857A priority Critical patent/JPS58222551A/ja
Publication of JPS58222551A publication Critical patent/JPS58222551A/ja
Publication of JPS6347267B2 publication Critical patent/JPS6347267B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/457—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57105857A 1982-06-18 1982-06-18 半導体用リ−ドフレ−ム Granted JPS58222551A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57105857A JPS58222551A (ja) 1982-06-18 1982-06-18 半導体用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57105857A JPS58222551A (ja) 1982-06-18 1982-06-18 半導体用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58222551A JPS58222551A (ja) 1983-12-24
JPS6347267B2 true JPS6347267B2 (enExample) 1988-09-21

Family

ID=14418652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57105857A Granted JPS58222551A (ja) 1982-06-18 1982-06-18 半導体用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58222551A (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127355A (ja) * 1982-01-25 1983-07-29 Hitachi Ltd リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS58222551A (ja) 1983-12-24

Similar Documents

Publication Publication Date Title
KR960002495B1 (ko) 개량된 리드를 갖는 반도체장치
TWI397981B (zh) 半導體封裝用導線架
US7268415B2 (en) Semiconductor device having post-mold nickel/palladium/gold plated leads
JP3537417B2 (ja) 半導体装置およびその製造方法
US20080087996A1 (en) Semiconductor device and manufacturing method of the same
JP3760075B2 (ja) 半導体パッケージ用リードフレーム
CN101013683A (zh) 半导体集成电路器件
US10763195B2 (en) Leadframe package using selectively pre-plated leadframe
JPH08111484A (ja) リードフレーム
JP7032239B2 (ja) リードフレーム材およびその製造方法ならびに半導体パッケージ
CN109937479A (zh) 引线框材料及其制造方法以及半导体封装件
WO2017179447A1 (ja) リードフレーム材およびその製造方法
JP2003197827A (ja) 半導体装置およびその製造方法
JPH07326701A (ja) 電気電子部品用導電材、リードフレ−ム及びそれを使用した半導体集積回路
KR100378489B1 (ko) 은 또는 은 합금도금을 이용한 반도체 패키지용 리드프레임 및 그 제조방법
JPS6347267B2 (enExample)
JPS6347342B2 (enExample)
JPH09172124A (ja) はんだダイボンディング用ニッケルめっき銅合金リードフレーム
TW517315B (en) Ag-pre-plated lead frame for semiconductor package
JPS639957A (ja) 半導体リ−ドフレ−ム
KR100225778B1 (ko) 리드 프레임을 이용한 반도체 팩키지
JPS59149042A (ja) 半導体用リ−ドフレ−ム
EP0380176A1 (en) method for producing a solderable finish on metal frames for semiconductors
JPH05211261A (ja) 半導体装置
JPS6258548B2 (enExample)