JPS6347258B2 - - Google Patents
Info
- Publication number
- JPS6347258B2 JPS6347258B2 JP57042608A JP4260882A JPS6347258B2 JP S6347258 B2 JPS6347258 B2 JP S6347258B2 JP 57042608 A JP57042608 A JP 57042608A JP 4260882 A JP4260882 A JP 4260882A JP S6347258 B2 JPS6347258 B2 JP S6347258B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- tank
- wafer
- liquid
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004140 cleaning Methods 0.000 claims description 83
- 239000007788 liquid Substances 0.000 claims description 35
- 238000007599 discharging Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 63
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 26
- 238000000034 method Methods 0.000 description 20
- 239000000126 substance Substances 0.000 description 18
- 238000003860 storage Methods 0.000 description 9
- 238000011109 contamination Methods 0.000 description 8
- 238000005406 washing Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4260882A JPS58161328A (ja) | 1982-03-19 | 1982-03-19 | 薄片状物品の洗浄装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4260882A JPS58161328A (ja) | 1982-03-19 | 1982-03-19 | 薄片状物品の洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58161328A JPS58161328A (ja) | 1983-09-24 |
JPS6347258B2 true JPS6347258B2 (ko) | 1988-09-21 |
Family
ID=12640742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4260882A Granted JPS58161328A (ja) | 1982-03-19 | 1982-03-19 | 薄片状物品の洗浄装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58161328A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210114995A (ko) * | 2019-02-05 | 2021-09-24 | 파라곤 툴즈, 에스.엘. | 치과 구조물에 스크류를 안착시키기 위한 밀링 공구 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3057163B2 (ja) * | 1993-12-08 | 2000-06-26 | 東京エレクトロン株式会社 | 洗浄方法及び洗浄装置 |
JP5798505B2 (ja) * | 2011-04-27 | 2015-10-21 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4941800U (ko) * | 1972-07-13 | 1974-04-12 | ||
JPS5332523U (ko) * | 1976-08-26 | 1978-03-22 | ||
JPS55158634A (en) * | 1979-05-30 | 1980-12-10 | Fujitsu Ltd | Treating device for photo-mask, etc. |
-
1982
- 1982-03-19 JP JP4260882A patent/JPS58161328A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4941800U (ko) * | 1972-07-13 | 1974-04-12 | ||
JPS5332523U (ko) * | 1976-08-26 | 1978-03-22 | ||
JPS55158634A (en) * | 1979-05-30 | 1980-12-10 | Fujitsu Ltd | Treating device for photo-mask, etc. |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210114995A (ko) * | 2019-02-05 | 2021-09-24 | 파라곤 툴즈, 에스.엘. | 치과 구조물에 스크류를 안착시키기 위한 밀링 공구 |
Also Published As
Publication number | Publication date |
---|---|
JPS58161328A (ja) | 1983-09-24 |
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