JPS6347137A - Manufacture of piezoelectric ceramic body - Google Patents
Manufacture of piezoelectric ceramic bodyInfo
- Publication number
- JPS6347137A JPS6347137A JP19189586A JP19189586A JPS6347137A JP S6347137 A JPS6347137 A JP S6347137A JP 19189586 A JP19189586 A JP 19189586A JP 19189586 A JP19189586 A JP 19189586A JP S6347137 A JPS6347137 A JP S6347137A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric ceramic
- ceramic body
- electrode
- thickness
- organometallic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 claims description 14
- 150000002902 organometallic compounds Chemical class 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000011230 binding agent Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002002 slurry Substances 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007606 doctor blade method Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 210000004709 eyebrow Anatomy 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- -1 phthalate ester Chemical class 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、セラミック層と電極層とが交互に積層され
ている圧電セラミック体の製法に関する〔背景技術〕
近年、急速に電子機器のコンパクト化が進行しているが
、これに伴い機器に使われる電子部品も小型化・軽量化
および低電圧駆動化が強く要求されている。そのような
電子部品の材料のひとつに、アクチュエータやセンサと
して用いられるセラミック層と電極層とが交互に積層さ
れ内部電極を有する圧電セラミック体がある。[Detailed Description of the Invention] [Technical Field] The present invention relates to a method for manufacturing a piezoelectric ceramic body in which ceramic layers and electrode layers are alternately laminated. [Background Art] In recent years, electronic devices have rapidly become more compact. However, along with this, there is a strong demand for electronic components used in devices to be smaller, lighter, and driven at lower voltages. One of the materials for such electronic components is a piezoelectric ceramic body that is used as an actuator or sensor and has internal electrodes in which ceramic layers and electrode layers are alternately laminated.
従来、このような圧電セラミック体は、つぎのような方
法によって内部電極を設けるようにしていた。Conventionally, such piezoelectric ceramic bodies have been provided with internal electrodes by the following method.
■ 薄板状セラミック焼結板を所定の大きさに切断し、
その両面に電極として銀ペーストを焼付した電極付き薄
板を、接着強度があり、硬化収縮が小さいなどの利点が
あるエポキシ系接着剤で接合する。■ Cut the thin ceramic sintered plate to the specified size,
A thin plate with electrodes, on which silver paste is baked as an electrode, is bonded with an epoxy adhesive that has the advantages of high adhesive strength and low curing shrinkage.
■ 所定形状の焼結板を導電性接着剤で接合して積層す
る。■ Sintered plates of a predetermined shape are bonded and laminated using a conductive adhesive.
■ 圧電セラミック配合組成の仮焼粉末をバインダなど
と混合粉砕し脱泡してスラリーを作製する。このスラリ
ーからドクターブレード法あるいは押し出し成形法など
によりグリーンシートを作製したのち、このグリーンシ
ートを所定の形状に切断する。その表面に内部電極ペー
ストを印刷したものを積層して６０〜１５０℃の温度で
圧力を加え熱圧着する。こうして得た積層体（生チップ
）を脱バインダ（脱脂）後焼結する。焼結後、外部電極
を焼付けることもある。■ The calcined powder of the piezoelectric ceramic composition is mixed with a binder, crushed, and defoamed to create a slurry. A green sheet is produced from this slurry by a doctor blade method or an extrusion method, and then this green sheet is cut into a predetermined shape. An internal electrode paste printed on the surface is laminated and thermocompression bonded by applying pressure at a temperature of 60 to 150°C. The thus obtained laminate (raw chips) is sintered after removing the binder (degreasing). After sintering, external electrodes may be baked.
しかしながら、これら■ないし■の方法には、それぞれ
つぎのような問題があった。However, these methods (1) to (2) each have the following problems.
すなわち、■、■の方法は、手軽に色々な形状のものが
作製できるという利点があるのであるが、工程が多く生
産性が悪く、加工上焼成板の厚さを薄くできない。した
がって、駆動電圧が高くなる、市販品では眉間剥離が生
じやすく剥離防止のためにボルトでの締めつけが行われ
、出力変位量の低下をまねきやすい。他方、■の方法は
、量産性にすぐれ信頼性もあり、しかも、駆動電圧が低
減できるという利点があるのであるが、同時焼成である
ため、約１３００℃まで耐えられるような電極材料が必
要であり、Ａｇ−Ｐｄ系電極のＰｄの含有量を多くする
必要があり、コスト面で不利である。内部電極ペースト
を塗布する方法は、スクリーン印刷などの方法が用いら
れるのであるが、内部電極の厚さが５μｍ程度にしかな
らず、熱膨張履歴の違いによる歪みや、動作時に電極部
が変形しないことによるセラミックと電極部との接合部
の応力集中などから素子強度の劣化をまねく。この対策
として電極金属材料にセラミックを混入することが考え
えられているが、密着力が充分とはいえない。また、電
極としてセラミックを用いる方法も提案されている。こ
の方法の１つであるＢａＴｉ０３（チタン酸バリウム）
を用いたものは、半導体化したＢａＴｉＯ３との組み合
わせにより密着力の点では成功しているのであるが、電
極の厚みが大きくなって素子全体が太き（なる。しかも
、ＢａＴｉＯ３は、Ｐｂ （ＺｒＸ Ｉｒ１−、 ）０
３系に比べ圧電性能も劣っている。一方、Ｐｂ （Ｚｒ
ｘ Ｉｒ１−ｘ ）ｏｉのようなセラミックは、ｐｂの
拡散速度が早いため導電性セラミックの形成がはなはだ
困難であった。That is, methods (1) and (2) have the advantage of being able to easily produce products of various shapes, but they require many steps, have low productivity, and cannot reduce the thickness of the fired plate during processing. Therefore, in commercially available products where the drive voltage is high, peeling between the eyebrows tends to occur, and bolts are tightened to prevent peeling, which tends to cause a decrease in output displacement. On the other hand, method (2) has the advantage of being highly mass-producible and reliable, as well as being able to reduce the driving voltage, but because it requires simultaneous firing, it requires electrode materials that can withstand temperatures of about 1300°C. However, it is necessary to increase the Pd content of the Ag-Pd based electrode, which is disadvantageous in terms of cost. Methods such as screen printing are used to apply the internal electrode paste, but the thickness of the internal electrode is only about 5 μm, which causes distortion due to differences in thermal expansion history and the fact that the electrode part does not deform during operation. This leads to deterioration of element strength due to stress concentration at the joint between the ceramic and the electrode part. As a countermeasure to this problem, it has been considered to mix ceramics into the electrode metal material, but it cannot be said that the adhesion is sufficient. A method using ceramic as the electrode has also been proposed. One of these methods is BaTi03 (barium titanate)
The device using Pb (ZrX Ir1-, )0
The piezoelectric performance is also inferior compared to the 3 series. On the other hand, Pb (Zr
Ceramics such as x Ir1-x ) oi have been extremely difficult to form into conductive ceramics due to the fast diffusion rate of PB.
この発明は、このような事情に鑑みて、層間の密着強度
が大きく、内部電極層の厚みが薄くできて低コスト化で
き、かつ、素子内部の歪の小さい圧電セラミック体の製
法を提供することを目的としている。In view of these circumstances, it is an object of the present invention to provide a method for manufacturing a piezoelectric ceramic body that has high adhesion strength between layers, can reduce the thickness of internal electrode layers, and can reduce costs, and has low strain inside the element. It is an object.
この発明は、このような目的を達成するために、セラミ
ック層と電極層とが交互に積層されている圧電セラミッ
ク体を得るにあたり、シート状に形成されたセラミック
成形体を、焼結後金属となる有機金属化合物をその表面
に塗布しておいて、複数枚積層し焼成することを特徴と
する圧電セラミック体の製法を要旨としている。In order to achieve such an object, the present invention, in order to obtain a piezoelectric ceramic body in which ceramic layers and electrode layers are alternately laminated, sinters a ceramic molded body formed in a sheet shape with metal. The gist of this article is a method for manufacturing a piezoelectric ceramic body, which is characterized by coating the surface of the piezoelectric ceramic body with an organic metal compound, and then laminating and firing a plurality of piezoelectric ceramic bodies.
以下に、この発明にかかる圧電セラミック体の製法をそ
の１実施例にしたがって 詳しく説明する。Below, a method for manufacturing a piezoelectric ceramic body according to the present invention will be explained in detail according to one embodiment thereof.
所望の組成の圧電セラミック体の仮焼物を粉砕しバイン
ダ、可塑剤２溶剤を混合しスラリー化する。得られたス
ラリーをドクターブレード法、または、押出法を用いて
グリーンシートに成形し、ローラーなどで表面粗度を１
０μｍ以下にする。A calcined product of a piezoelectric ceramic body having a desired composition is crushed, and a binder, a plasticizer, and a solvent are mixed to form a slurry. The obtained slurry is formed into a green sheet using a doctor blade method or an extrusion method, and the surface roughness is reduced to 1 by using a roller or the like.
Make it 0 μm or less.
このグリーンシート上に、下記組成式、Ｒ−８−Ｍｅ
・ ・ ・（ＣＩＲ−８−Ｍｅ
−８−Ｒ・ ・ ・（ｄ）であられされる有機金属化合
物などをスクリーン印刷等で１０Ｉｆｍ程度の所望のパ
ターンに印刷する表面に所望のパターンが描かれたシー
トを所望の大きさに切断し、これを複数枚重ね熱圧着す
る。そののち、脱バインダを行い、用いられたセラミッ
クの通常の焼成温度で焼成する。この焼成によって、有
機金属化合物は、金属以外の組成物が焼失し、パターン
の厚みが０．２Ｉ！ｍ程度となる。これと同時にセラミ
ックがパターンの描かれていない部分で一部焼成され層
間の強度が増大する。On this green sheet, the following compositional formula, R-8-Me
・ ・ ・(CIR-8-Me
-8-R... Print the desired pattern of about 10Ifm using screen printing or the like with the organometallic compound etc. coated in (d). Cut the sheet with the desired pattern drawn on the surface to the desired size. , a plurality of these are stacked and bonded together by thermocompression. Thereafter, the binder is removed and the ceramic is fired at a normal firing temperature for the ceramic used. By this firing, the components other than metals in the organometallic compound are burned away, and the thickness of the pattern is reduced to 0.2I! It will be about m. At the same time, the ceramic is partially fired in areas where no pattern is drawn, increasing the strength between the layers.
以下に、この発明にかかる製法をその実施例によって詳
しく説明する。The manufacturing method according to the present invention will be explained in detail below with reference to Examples.
（実施例１）
試料特級のＰｂＯ，Ｚｒ０ｚ、Ｔｉ０ｚをそれぞれＰｂ
Ｚｒｏ、 ５３Ｔｉｏ、ａ７０３の組成配合になるよう
に秤量して湿式混合粉砕したのちろ過を行った。このろ
憑物をアルミするつぼ中に入れ、８５０℃で２時間仮焼
を行った。この仮焼物を湿式粉砕しろ過後充分に乾燥を
行い、ＰｂＺｒｏ、 ５３Ｔｉｏ、 ４７ｏｆｆの組成
の仮焼物粉末を得た。この粉末１００重量部に対して、
バインダとしてのポリビニルブチラール樹脂を８重量部
、可塑剤としてのフタル酸エステルを４重量部、溶剤と
してのブタノールを２０重量部とトリクレンを５０重量
部を添加してデイスペンサーによって混合しスラリー化
した。このスラリーをドクターブレード法を用いて厚み
３００−のグリーンシートを形成した。このシートにロ
ーラーをかけ表面粗度を１０−とした。表面粗度を１０
μｍとしたシートを３Ｑｍｍ角に切断した。この切断片
表面にペースト状の有機金属化合物でスクリーン印刷に
よって所望のパターンを１０ｐの厚みで印刷した。(Example 1) Sample special grade PbO, Zr0z, and Ti0z were each replaced with Pb
They were weighed and wet-mixed and pulverized to have a composition of Zro, 53Tio, and a703, and then filtered. This substance was placed in an aluminum pot and calcined at 850°C for 2 hours. This calcined product was wet-pulverized, filtered, and thoroughly dried to obtain calcined powder having a composition of PbZro, 53Tio, and 47off. For 100 parts by weight of this powder,
8 parts by weight of polyvinyl butyral resin as a binder, 4 parts by weight of phthalate ester as a plasticizer, 20 parts by weight of butanol and 50 parts by weight of trichlene as solvents were added and mixed using a dispenser to form a slurry. This slurry was used to form a green sheet with a thickness of 300 mm using a doctor blade method. This sheet was rolled to give a surface roughness of 10-. Surface roughness 10
The μm sheet was cut into 3Qmm square pieces. A desired pattern was printed on the surface of the cut piece by screen printing with a paste-like organometallic compound to a thickness of 10p.
なお、上記有機金属化合物ペーストは、前述の組成式（
ａ）の２つのＲがベンゼン基、 Ｍｅが篩で構成される
化合物をＡｕが２４ｗｔ％含まれるように調整したちの
３５０ｇと、組成式ｆｂｌのＲがベンゼン基。The above-mentioned organometallic compound paste has the above-mentioned compositional formula (
350g of a compound in which the two R's in a) are benzene groups and Me is a sieve is adjusted to contain 24 wt% of Au, and the R in the composition formula fbl is a benzene group.
ＭｅがＰｄで構成される化合物をＰｄが５ｗｔ％含まれ
るようにしたもの１５０ｇとを混合してペースト化した
ものを用いた。このペースト中の金属成分は、Ａｕが８
５ｗｔ％、 Ｐｄが１５−ｔ％で、その融点は、１３０
０°Ｃであった。つぎに、スクリーン印刷された切断片
を５０枚積層し１００℃の温度で５０Ｑ ｋｇ ／ ｃ
ｆｌのプレス圧をかけて熱圧着し積層体を得た。この積
層体をオーブン中に入れ、空気中で１００℃／Ｈｒの昇
温速度で３００ ’Ｃまで昇温し２４時間この温度に保
持して脱バインダ（脱脂）を行った。脱バインダ後積層
体をＭｇＯ製の匣鉢中に入れるとともに、積層体と匣鉢
との間に形成される空間に焼成中に匣鉢内をｐｂｏ雰囲
気に保つためにｐｂｏ粉末を充填し、さらに、ＭｇＯ製
の蓋をしてふたたびオーブン中に入れた。この匣鉢内に
収容された積層体を２００℃１０ｒの速度で１２００℃
まで昇温し、この温度で２時間保持したのち、２００°
Ｃ／ｌｌｒの速度で降温して焼成を行い、層間にＡｕ−
Ｐｄ合金からなる電極部が形成された多層の圧電セラミ
ック体を得た。なお、電極部の厚みは０．１ｐ、圧電セ
ラミック体の大きさば２５Ｘ２５Ｘ１５１であった。A paste was prepared by mixing 150 g of a compound in which Me is composed of Pd and containing 5 wt% of Pd. The metal components in this paste include Au 8
5 wt%, Pd is 15-t%, and its melting point is 130
It was 0°C. Next, 50 sheets of screen-printed cut pieces were stacked together at a temperature of 100℃ to produce 50Q kg/c.
A laminate was obtained by thermocompression bonding by applying a press pressure of fl. This laminate was placed in an oven, heated to 300'C at a rate of 100C/Hr in air, and held at this temperature for 24 hours to remove the binder (degreasing). After removing the binder, the laminate was placed in an MgO sagger, and the space formed between the laminate and the sagger was filled with PBO powder to maintain a PBO atmosphere inside the sagger during firing. Then, it was placed in the oven again with the MgO lid on. The laminate housed in this sagger was heated to 1200°C at a speed of 200°C and 10r.
After raising the temperature to 200° and keeping it at this temperature for 2 hours,
Firing is performed by lowering the temperature at a rate of C/llr, and Au-
A multilayer piezoelectric ceramic body was obtained in which an electrode portion made of a Pd alloy was formed. The thickness of the electrode portion was 0.1p, and the size of the piezoelectric ceramic body was 25×25×151.
（実施例２）
有機金属化合物ペーストとしてカルボニルニッケルを主
成分とし、Ｎｉが９．４ｗｔ％となるように調整したも
のを用いた以外は、実施例１と同様にして圧電セラミッ
ク体を得た。なお、電極部の厚みは、０．２１！ｍであ
った。融点は、１２２０℃であつた。(Example 2) A piezoelectric ceramic body was obtained in the same manner as in Example 1, except that an organometallic compound paste containing carbonyl nickel as a main component and having Ni adjusted to 9.4 wt% was used. In addition, the thickness of the electrode part is 0.21! It was m. The melting point was 1220°C.
（実施例３）
スクリーン印刷によって得られるパターンの厚みを２０
−とした以外は、実施例１と同様にして圧電セラミック
体を得た。なお、電極部の厚みは、０．２ｔｒｍであっ
た。(Example 3) The thickness of the pattern obtained by screen printing was 20
A piezoelectric ceramic body was obtained in the same manner as in Example 1 except that -. Note that the thickness of the electrode portion was 0.2 trm.
（実施例４）
有機金属化合物ペーストとして前述の組成式（ｄ）の２
つのＲをベンゼン基、 Ｍｅをｐｔで構成された化合物
をｐｔが２６ｗｔ％となるように調整したものを用い、
この有機金属化合物ペーストを切断片表面に刷毛管りに
よって２０−の厚みにもるようにした以外は、実施例１
と同様にして圧電セラミック体を得た。なお、電極部の
厚みは、０．２−であった。(Example 4) 2 of the above-mentioned compositional formula (d) as an organometallic compound paste
Using a compound in which two R's are benzene groups and Me is pt, the pt is adjusted to 26 wt%,
Example 1 except that this organometallic compound paste was applied to the surface of the cut piece to a thickness of 20 mm using a brush pipe.
A piezoelectric ceramic body was obtained in the same manner as above. Note that the thickness of the electrode portion was 0.2-.
（実施例５）
有機金属化合物ペーストとして前述の組成式（ｃ）のＲ
をベンゼン基、 ＭｅをＡｇで構成した化合物を静が３
０ｗｔ％となるように調整したもの５０ｇと、組成式（
ｄｌの２つのＲをベンゼン基、 Ｍｅをｐｔで構成され
た化合物をｐｔが２６−ｔ％となるように調整したもの
５０ｇとを混合したものを用いた以外は、実施例１と同
様にして圧電セラミック体を得た。(Example 5) R of the above-mentioned compositional formula (c) as an organometallic compound paste
is a benzene group, and Me is composed of Ag.
50g of the product adjusted to 0wt% and the composition formula (
The process was carried out in the same manner as in Example 1, except that a mixture of 50 g of a compound in which the two R's of dl were benzene groups and Me was pt was adjusted so that pt was 26-t% was used. A piezoelectric ceramic body was obtained.
なお、電極部の厚みは、０，３ｐであった。また、回路
の金属分は、八ｇが５３ｗｔ％、 ｐｔが４７−ｔ％で
、その融点は１２２０℃であった。Note that the thickness of the electrode portion was 0.3p. The metal content of the circuit was 53 wt% of 8g and 47-t% of pt, and its melting point was 1220°C.
（比較例１）
有機金属化合物の代わりに、Ｐｄペースト（エンゲルハ
ード社製のＡ−４０９０）を用いた以外は、実施例１と
同様にして圧電セラミック体を得た。なお、電極部の厚
みは、１０７１１１１であった。(Comparative Example 1) A piezoelectric ceramic body was obtained in the same manner as in Example 1, except that Pd paste (A-4090 manufactured by Engelhard) was used instead of the organometallic compound. Note that the thickness of the electrode portion was 1,071,111 mm.
以上の実施例および比較例のそれぞれで得られた圧電セ
ラミック体の導電性と密着強度とを測定した。The conductivity and adhesion strength of the piezoelectric ceramic bodies obtained in each of the above Examples and Comparative Examples were measured.
密着強度は、それぞれの実施例および比較例で得られた
圧電セラミック体を２．５Ｘ２．５Ｘ１５ｍに切断し、
これを折り曲げるようにして電極の平行方向の抗折強度
を測定した。その結果を第１表に示す。The adhesion strength was determined by cutting the piezoelectric ceramic body obtained in each example and comparative example into a size of 2.5 x 2.5 x 15 m.
This was bent to measure the bending strength in the parallel direction of the electrode. The results are shown in Table 1.
第１表
第１表にみるように、実施例で得られた多層の゛ 圧
電セラミック体は、導電性が充分な内部電極を有すると
ともに、抗折強度が強いことが明らかである。Table 1 As shown in Table 1, it is clear that the multilayer piezoelectric ceramic bodies obtained in the examples have internal electrodes with sufficient conductivity and strong bending strength.
この発明にかかる圧電セラミック体の製法は、上記実施
例に限定されない。The method for manufacturing a piezoelectric ceramic body according to the present invention is not limited to the above embodiments.
基板の表面粗度を１０ｇｍ以下にすることは必ずしも必
要ではない。しかしながら、１０−以下にすると抗折強
度がよりよくなるので好ましいと言える。It is not necessarily necessary that the surface roughness of the substrate be 10 gm or less. However, it can be said that a value of 10 or less is preferable because the bending strength becomes better.
この発明にかかる圧電セラミック体の製法は、以上のよ
うに構成されているので、眉間の密着強度が大きく、電
極層の厚みが薄く、かつ、素子内部の歪の小さい圧電セ
ラミック体が低コスト化でき、かつ、作業性よく得るこ
とができる。Since the manufacturing method of the piezoelectric ceramic body according to the present invention is configured as described above, the cost of the piezoelectric ceramic body is reduced, the adhesive strength between the eyebrows is high, the thickness of the electrode layer is thin, and the strain inside the element is small. and can be obtained with good workability.
Claims (3)
圧電セラミック体を得るにあたり、シート状に形成され
たセラミック成形体を、焼結後金属となる有機金属化合
物をその表面に塗布しておいて、複数枚積層し焼成する
ことを特徴とする圧電セラミック体の製法。(1) To obtain a piezoelectric ceramic body in which ceramic layers and electrode layers are alternately laminated, an organometallic compound that becomes a metal after sintering is applied to the surface of a ceramic molded body formed in a sheet shape. A method for manufacturing a piezoelectric ceramic body, which comprises laminating and firing a plurality of piezoelectric ceramic bodies.
る特許請求の範囲第１項記載の圧電セラミック体の製法
。(2) The method for producing a piezoelectric ceramic body according to claim 1, wherein the surface roughness of the ceramic molded body is 10 μm or less.
ＭｅはＡｕ、Ｐｔ、Ｐｄ、Ａｇからなる群より選ばれた
少なくとも１つの金属である。〕であらわされるものの
少なくとも１種である特許請求の範囲第１項または第２
項記載の圧電セラミック体の製法。(3) The organometallic compound has the following compositional formula, ▲Mathematical formula, chemical formula, table, etc.▼ [In the formula, R is an aromatic and/or aliphatic hydrocarbon,
Me is at least one metal selected from the group consisting of Au, Pt, Pd, and Ag. ] Claim 1 or 2 is at least one of the following:
A method for producing a piezoelectric ceramic body as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19189586A JPS6347137A (en) | 1986-08-15 | 1986-08-15 | Manufacture of piezoelectric ceramic body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19189586A JPS6347137A (en) | 1986-08-15 | 1986-08-15 | Manufacture of piezoelectric ceramic body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6347137A true JPS6347137A (en) | 1988-02-27 |
Family
ID=16282232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19189586A Pending JPS6347137A (en) | 1986-08-15 | 1986-08-15 | Manufacture of piezoelectric ceramic body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6347137A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0370133A (en) * | 1989-08-09 | 1991-03-26 | Shin Etsu Handotai Co Ltd | Automatic cleaning device of work |
| SG98427A1 (en) * | 1999-09-30 | 2003-09-19 | Tdk Corp | Multilayer piezoelectric device and method of producing same |
-
1986
- 1986-08-15 JP JP19189586A patent/JPS6347137A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0370133A (en) * | 1989-08-09 | 1991-03-26 | Shin Etsu Handotai Co Ltd | Automatic cleaning device of work |
| SG98427A1 (en) * | 1999-09-30 | 2003-09-19 | Tdk Corp | Multilayer piezoelectric device and method of producing same |
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