JPS6346983B2 - - Google Patents
Info
- Publication number
- JPS6346983B2 JPS6346983B2 JP54171013A JP17101379A JPS6346983B2 JP S6346983 B2 JPS6346983 B2 JP S6346983B2 JP 54171013 A JP54171013 A JP 54171013A JP 17101379 A JP17101379 A JP 17101379A JP S6346983 B2 JPS6346983 B2 JP S6346983B2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- pattern
- resist layer
- wiring
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000004148 curcumin Substances 0.000 description 2
- 239000002151 riboflavin Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000012668 chain scission Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17101379A JPS5694353A (en) | 1979-12-28 | 1979-12-28 | Micropattern forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17101379A JPS5694353A (en) | 1979-12-28 | 1979-12-28 | Micropattern forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5694353A JPS5694353A (en) | 1981-07-30 |
| JPS6346983B2 true JPS6346983B2 (de) | 1988-09-20 |
Family
ID=15915472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17101379A Granted JPS5694353A (en) | 1979-12-28 | 1979-12-28 | Micropattern forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5694353A (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6191948A (ja) * | 1984-10-12 | 1986-05-10 | Nec Corp | 半導体装置の製造方法 |
| JPS63316055A (ja) * | 1987-06-19 | 1988-12-23 | Toshiba Corp | 半導体装置の製造方法 |
| JPH01194334A (ja) * | 1988-01-28 | 1989-08-04 | Nec Corp | 半導体集積回路の製造方法 |
| JP4039036B2 (ja) | 2001-11-06 | 2008-01-30 | 日立金属株式会社 | アライメントマーク作製方法 |
| JP2012208350A (ja) * | 2011-03-30 | 2012-10-25 | Lapis Semiconductor Co Ltd | レジストパターンの形成方法、立体構造の製造方法、及び半導体装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51108778A (en) * | 1975-03-20 | 1976-09-27 | Fujitsu Ltd | Handotaisochino seizohoho |
| JPS5492801A (en) * | 1977-12-30 | 1979-07-23 | Ibm | Photolithographic method |
-
1979
- 1979-12-28 JP JP17101379A patent/JPS5694353A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51108778A (en) * | 1975-03-20 | 1976-09-27 | Fujitsu Ltd | Handotaisochino seizohoho |
| JPS5492801A (en) * | 1977-12-30 | 1979-07-23 | Ibm | Photolithographic method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5694353A (en) | 1981-07-30 |
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