JPS633977U - - Google Patents
Info
- Publication number
- JPS633977U JPS633977U JP9846986U JP9846986U JPS633977U JP S633977 U JPS633977 U JP S633977U JP 9846986 U JP9846986 U JP 9846986U JP 9846986 U JP9846986 U JP 9846986U JP S633977 U JPS633977 U JP S633977U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- tray
- transporting
- side wall
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は、本考案の第１の実施例による半導体
装置の平面図、第２図は、第１図の線―に沿
う断面図、第３図は、本考案の第２の実施例によ
る半導体装置の第２図と同様の図、第４図は、本
考案の第３の実施例による半導体装置の第２図と
同様の図である。
１……トレー、２……凹部、３……底部、４…
…凸部、５……支持壁、Ｓ……半導体装置、Ｓ１
……パツケージ本体、Ｓ２……リード。
1 is a plan view of a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along the line - in FIG. 1, and FIG. 3 is a plan view of a semiconductor device according to a second embodiment of the present invention. FIG. 4 is a diagram similar to FIG. 2 of a semiconductor device, and FIG. 4 is a diagram similar to FIG. 2 of a semiconductor device according to a third embodiment of the present invention. 1...tray, 2...recess, 3...bottom, 4...
... Convex portion, 5... Support wall, S... Semiconductor device, S1
...Package body, S2...Lead.
Claims (1)
る凹部を備えた半導体装置の運搬用トレーにおい
て、前記凹部の底部に上方に突出させた凸部を設
けることにより、ほぼ上下方向に延びる側壁を形
成し、この側壁によつて、該トレーの下に置かれ
たトレー内に収容された半導体装置のパツケージ
本体の側面もしくは該パツケージ本体の側面から
延びるリードの根元に接触することにより、前記
凹部内での半導体装置の表面方向の移動を防止す
るようにした半導体装置の運搬用トレー。 (2) 前記凸部が、半導体装置の被嵌合部分より
若干大きい縦横寸法に形成されていることを特徴
とする特許請求の範囲第１項記載の半導体装置の
運搬用トレー。 (3) 前記凸部が、半導体装置のリードの段差部
分に嵌合するように構成されていることを特徴と
する特許請求の範囲第１項または第２項記載の半
導体装置の運搬用トレー。[Claims for Utility Model Registration] (1) In a tray for transporting semiconductor devices that is provided with a recessed portion on the surface of the tray for accommodating a semiconductor device, a convex portion that protrudes upward is provided at the bottom of the recessed portion. This side wall forms a side wall that extends substantially in the vertical direction, and this side wall allows the base of the lead extending from the side surface of the package body of the semiconductor device housed in the tray placed below the tray or the side surface of the package body to be formed by the side wall. A tray for transporting a semiconductor device, which prevents the semiconductor device from moving in the surface direction within the recess by contacting the recess. (2) The tray for transporting a semiconductor device according to claim 1, wherein the convex portion is formed to have vertical and horizontal dimensions slightly larger than the fitted portion of the semiconductor device. (3) A tray for transporting a semiconductor device according to claim 1 or 2, wherein the convex portion is configured to fit into a stepped portion of a lead of a semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098469U JPH0627589Y2 (en) | 1986-06-27 | 1986-06-27 | Tray for transporting semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098469U JPH0627589Y2 (en) | 1986-06-27 | 1986-06-27 | Tray for transporting semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS633977U true JPS633977U (en) | 1988-01-12 |
| JPH0627589Y2 JPH0627589Y2 (en) | 1994-07-27 |
Family
ID=30966428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986098469U Expired - Lifetime JPH0627589Y2 (en) | 1986-06-27 | 1986-06-27 | Tray for transporting semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0627589Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362256A (en) * | 1986-09-02 | 1988-03-18 | Matsushita Electronics Corp | Conveyor for semiconductor device |
| CN114291424A (en) * | 2020-10-07 | 2022-04-08 | 颀邦科技股份有限公司 | Storage structure for tape packaging and carrier tray thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130676U (en) * | 1984-07-28 | 1986-02-24 | 富士通株式会社 | Semiconductor device tray |
-
1986
- 1986-06-27 JP JP1986098469U patent/JPH0627589Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130676U (en) * | 1984-07-28 | 1986-02-24 | 富士通株式会社 | Semiconductor device tray |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362256A (en) * | 1986-09-02 | 1988-03-18 | Matsushita Electronics Corp | Conveyor for semiconductor device |
| CN114291424A (en) * | 2020-10-07 | 2022-04-08 | 颀邦科技股份有限公司 | Storage structure for tape packaging and carrier tray thereof |
| JP2022061949A (en) * | 2020-10-07 | 2022-04-19 | ▲き▼邦科技股▲分▼有限公司 | Accommodation device for tape carrier package and carrier thereof |
| CN114291424B (en) * | 2020-10-07 | 2023-09-01 | 颀邦科技股份有限公司 | Storage structure of coiled tape package and carrying disc thereof |
| US11792923B2 (en) | 2020-10-07 | 2023-10-17 | Chipbond Technology Corporation | Storage device for flexible circuit packages and carrier thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0627589Y2 (en) | 1994-07-27 |