JPS61203555U - - Google Patents
Info
- Publication number
- JPS61203555U JPS61203555U JP8677785U JP8677785U JPS61203555U JP S61203555 U JPS61203555 U JP S61203555U JP 8677785 U JP8677785 U JP 8677785U JP 8677785 U JP8677785 U JP 8677785U JP S61203555 U JPS61203555 U JP S61203555U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- case body
- semiconductor
- accommodating portion
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の半導体基板用ケースの実施例
を示しイはケース本体の平面図、ロはイの断面正
面図、第２図は第１図のケース本体に半導体基板
を収納時の全体の断面正面図、第３図、第４図は
それぞれ従来の半導体基板用ケースを示し、それ
ぞれイは平面図、ロはイの断面正面図である。
１……ケース本体、７……半導体収容部、３…
…半導体基板、４……クツシヨン材、５……ケー
ス蓋、６……繊維状スプリング。
Fig. 1 shows an embodiment of the case for semiconductor substrates of the present invention, A is a plan view of the case body, B is a cross-sectional front view of A, and Fig. 2 is the entire case when the semiconductor substrate is housed in the case body of Fig. 1. FIGS. 3 and 4 respectively show conventional cases for semiconductor substrates, with A being a plan view and B being a sectional front view of A. 1...Case body, 7...Semiconductor housing part, 3...
...Semiconductor substrate, 4...Cushion material, 5...Case lid, 6...Fibrous spring.
Claims (1)
、該半導体収容部に載置された半導体基板を該半
導体基板上面にクツシヨン材を介在し上記ケース
本体に固定するように形成されたケース蓋とを設
けたものにおいて、上記半導体収容部が、上記ケ
ース本体内でほぼ水平状もしくは上記ケース本体
中央側がやや低く形成され内壁側端部を固定され
該中央部側端部で上記半導体基板の周縁部を下面
から支持するように個々に平板状に並設された複
数の繊維状スプリングにより形成されていること
を特徴とする半導体基板用ケース。 A case body having a semiconductor accommodating portion formed on its upper surface, and a case lid formed to fix a semiconductor substrate placed in the semiconductor accommodating portion to the case body with a cushion material interposed on the upper surface of the semiconductor substrate. The semiconductor accommodating portion is formed in the case body in a substantially horizontal manner or slightly lower on the center side of the case body, and has an inner wall side end fixed, and a peripheral edge of the semiconductor substrate at the center side end. A case for a semiconductor substrate, characterized in that it is formed by a plurality of fibrous springs that are individually arranged in parallel in a flat plate shape so as to be supported from the bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8677785U JPS61203555U (en) | 1985-06-07 | 1985-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8677785U JPS61203555U (en) | 1985-06-07 | 1985-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61203555U true JPS61203555U (en) | 1986-12-22 |
Family
ID=30638396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8677785U Pending JPS61203555U (en) | 1985-06-07 | 1985-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61203555U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011036826A1 (en) * | 2009-09-28 | 2011-03-31 | シャープ株式会社 | Storage tray |
-
1985
- 1985-06-07 JP JP8677785U patent/JPS61203555U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011036826A1 (en) * | 2009-09-28 | 2011-03-31 | シャープ株式会社 | Storage tray |