JPS6338861B2 - - Google Patents

Info

Publication number
JPS6338861B2
JPS6338861B2 JP55140459A JP14045980A JPS6338861B2 JP S6338861 B2 JPS6338861 B2 JP S6338861B2 JP 55140459 A JP55140459 A JP 55140459A JP 14045980 A JP14045980 A JP 14045980A JP S6338861 B2 JPS6338861 B2 JP S6338861B2
Authority
JP
Japan
Prior art keywords
circuit
bonding
mosfet
changed
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55140459A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5764941A (en
Inventor
Kenichi Tsucha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14045980A priority Critical patent/JPS5764941A/ja
Publication of JPS5764941A publication Critical patent/JPS5764941A/ja
Publication of JPS6338861B2 publication Critical patent/JPS6338861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP14045980A 1980-10-09 1980-10-09 Semiconductor integrated circuit device Granted JPS5764941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14045980A JPS5764941A (en) 1980-10-09 1980-10-09 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14045980A JPS5764941A (en) 1980-10-09 1980-10-09 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS5764941A JPS5764941A (en) 1982-04-20
JPS6338861B2 true JPS6338861B2 (https=) 1988-08-02

Family

ID=15269088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14045980A Granted JPS5764941A (en) 1980-10-09 1980-10-09 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5764941A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963744A (ja) * 1982-10-04 1984-04-11 Mitsubishi Electric Corp 半導体装置
JPS59163854A (ja) * 1983-03-07 1984-09-14 Mitsubishi Electric Corp 半導体装置
JPS61256741A (ja) * 1985-05-10 1986-11-14 Nec Corp 半導体集積回路装置
JP2538698B2 (ja) * 1990-05-31 1996-09-25 株式会社東芝 半導体集積回路装置
US5442218A (en) * 1993-09-30 1995-08-15 At&T Global Information Solutions Company CMOS power fet driver including multiple power MOSFET transistors connected in parallel, each carrying an equivalent portion of the total driver current
US8890338B2 (en) 2006-09-27 2014-11-18 Agere Systems, Inc. Method of identifying and/or programming an integrated circuit

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534641U (https=) * 1978-08-26 1980-03-06

Also Published As

Publication number Publication date
JPS5764941A (en) 1982-04-20

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