JPS6336614B2 - - Google Patents

Info

Publication number
JPS6336614B2
JPS6336614B2 JP59260318A JP26031884A JPS6336614B2 JP S6336614 B2 JPS6336614 B2 JP S6336614B2 JP 59260318 A JP59260318 A JP 59260318A JP 26031884 A JP26031884 A JP 26031884A JP S6336614 B2 JPS6336614 B2 JP S6336614B2
Authority
JP
Japan
Prior art keywords
epoxy resin
ions
ion exchanger
resin composition
inorganic ion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59260318A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61138619A (ja
Inventor
Hirohiko Kagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP26031884A priority Critical patent/JPS61138619A/ja
Publication of JPS61138619A publication Critical patent/JPS61138619A/ja
Publication of JPS6336614B2 publication Critical patent/JPS6336614B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP26031884A 1984-12-10 1984-12-10 半導体封止用エポキシ樹脂組成物 Granted JPS61138619A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26031884A JPS61138619A (ja) 1984-12-10 1984-12-10 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26031884A JPS61138619A (ja) 1984-12-10 1984-12-10 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61138619A JPS61138619A (ja) 1986-06-26
JPS6336614B2 true JPS6336614B2 (enExample) 1988-07-21

Family

ID=17346350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26031884A Granted JPS61138619A (ja) 1984-12-10 1984-12-10 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61138619A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2728204B2 (ja) * 1987-06-09 1998-03-18 日東電工株式会社 半導体装置
JP2558293B2 (ja) * 1987-09-14 1996-11-27 日東電工株式会社 半導体装置
JP2757938B2 (ja) * 1987-09-14 1998-05-25 日東電工株式会社 半導体装置
JP2568581B2 (ja) * 1987-09-16 1997-01-08 日東電工株式会社 半導体装置
JP2755383B2 (ja) * 1987-09-16 1998-05-20 日東電工株式会社 半導体装置
JP2568584B2 (ja) * 1987-10-15 1997-01-08 日東電工株式会社 半導体装置
US5413861A (en) * 1988-10-17 1995-05-09 Dextor Corporation Semiconductor device encapsulated with a flame retardant epoxy molding compound
US5041254A (en) * 1988-10-17 1991-08-20 Dexter Corporation Method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
US5476716A (en) * 1988-10-17 1995-12-19 The Dexter Corporation Flame retardant epoxy molding compound, method and encapsulated device
US5104604A (en) * 1989-10-05 1992-04-14 Dexter Electronic Materials Div. Of Dexter Corp. Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
JPH05287054A (ja) * 1992-04-07 1993-11-02 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物、その硬化物及び半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170173A (ja) * 1983-03-18 1984-09-26 Toagosei Chem Ind Co Ltd 封着剤

Also Published As

Publication number Publication date
JPS61138619A (ja) 1986-06-26

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