JPS6334966A - Frame for resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To increase the size of a conductor plate and a lead part and to design their size independently by a method wherein the conductor plate and the lead part are formed collectively on the same frame by keeping some space between them and, after the frame has been folded onto a semiconductor chip, the lead part is set at the required position on the conductor plate. CONSTITUTION:If a frame is piled up onto a semiconductor chip 6 by folding it at a required part of the tie-bar 3, a lead part 20 protrudes over a conductor plate 1 and the lead part 20 is arranged at a required position on the conductor plate 1. Then, after the semiconductor chip 6 and a prescribed lead 2 of the lead part 20 have been connected by means of a connecting wire 7, this assembly is sealed by means of a resin material 5. Through this constitution, the size of the conductor plate and the lead part can be expanded independently of each other so that the biggest possible size for a resin sealing process can be obtained. Therefore, a big chip can be housed into a small package.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a frame for a resin-sealed semiconductor device.

[Conventional technology]

As a conventional frame for a resin-sealed semiconductor device (hereinafter simply referred to as frame), there is one shown in FIG. Third
In the figure, 1 is a conductive plate to which a semiconductor chip (not shown) is bonded, 2 is a lead electrically connected to the semiconductor chip via a connecting wire, and a lead portion 20 is formed by a plurality of leads 2. Ru. 3 and 4 are the conductive plate 1 and the lead 2
These are the tie bars and outer frame for fixing, and are removed after resin sealing.

These conductive plates 1. Lead part 20. The tie bar 3° and the outer frame 4 are collectively referred to as a frame.

FIG. 4 is a diagram showing the frame after being sealed with resin, and 5 indicates the resin.

The conventional frame shown in FIG. 3 is formed by punching or etching a flat sheet of material.

[Problem that the invention seeks to solve]

Therefore, when manufacturing a resin-sealed semiconductor device with a fixed external dimension using a conventional frame, the frame dimensions must be designed so that the conductive plate 1 and the leads 2 are accommodated within the resin 5, and the semiconductor chip If the dimensions of the resin molded semiconductor device are larger than the specified specifications, it is necessary to redesign the chip so that it is smaller, or to allow the external dimensions of the entire resin-sealed semiconductor device to be increased. If not, there are problems such as the shape of the connecting wire becomes poor and the reliability decreases due to insufficient resin-embedded area of the lead portion 20.

This invention was made to solve the above-mentioned problems, and aims to provide a frame in which the conductive plate and the lead portion can be made larger and whose dimensions can be designed independently.

[Means for solving problems]

The frame according to the present invention has a structure in which a conductive plate and a lead part are separated and integrally formed in the same frame, and by folding the frame over a semiconductor chip, the lead part is placed at a desired position on the conductive plate. That is.

[Effect]

In the frame of the present invention, since the dimensions of the conductive plate and the lead portion can be designed independently, each can be designed to be as large as possible for resin sealing.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 are a plan view and a perspective view of a folded frame showing an embodiment of the present invention. Figure 1,
In FIG. 2, the same reference numerals as in FIGS. 3 and 4 indicate the same parts, and 6 is a semiconductor chip die-bonded on the conductive plate 1. In FIG. Further, the lead portion 2o is arranged integrally on the same frame with the conductive plate 1 in between.

By folding the frame configured as shown in FIG. 1 above onto the semiconductor chip S from the required locations of the tie bars 3, the lead portions 20 protrude above the conductive plate 1, and as shown in FIG. 20 will be placed at a predetermined position on the conductive plate 1.

After that, the semiconductor chip 6 and the predetermined glue 2 of the lead part 2o are connected with the connecting wire 7, and the resin 5
sealed by.

In the above embodiments, a dual in-line type semiconductor device has been described as an example, but the present invention can also be applied to a frame with a similar structure such as a single in-line type.

〔Effect of the invention〕

As explained above, in the present invention, a conductive plate on which a semiconductor chip is grounded and a lead part connected to the semiconductor chip with a connecting wire are separated and integrally formed in the same frame. By folding the leads upward, the lead parts can be placed at the desired positions on the conductive plate, allowing the dimensions of the conductive plate and lead parts to be expanded independently and to the maximum extent that can be sealed with resin, making it possible to accommodate large chips. It has the advantage of being able to fit into a small package.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a frame for a resin-sealed semiconductor device showing an embodiment of the present invention, Fig. 2 is a perspective view showing a folded state, and Fig. 3 is a frame for a conventional resin-sealed semiconductor device. A plan view of the frame, FIG. 4 is a plan view showing the state of the resin-sealed semiconductor device frame after resin sealing. In the figure, 1 is a conductive plate, 2 is a lead, 3 is a tie bar,
4 is an outer frame, 5 is a resin, 6 is a semiconductor chip, a tab, 7 is a connecting wire, and 2o is a lead portion. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent: Masuo Oiwa (2 others) Figure 1, Figure 2, Figure 7, Condolences, 71 Figures, Figure 3, Procedural amendments on his own initiative) Audience to the Commissioner of the Japan Patent Office 1, Indication of Compliance Patent Application No. 179512/1983 2. Title of the invention '34 Frame for RN-sealed semiconductor device 3, Relationship to the case of the person making the amendment Patent applicant address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo. Name (601) Mitsubishi Electric Corporation Representative Moriya Shiki 4, Agent Address 2-2-3-5 Marunouchi, Chiyoda-ku, Tokyo
, l111. of the claims of the specification subject to amendment. Detailed description of the invention, drawing 6, contents of amendment (1) The claims of the specification are amended as shown in the attached sheet. (2) “Guypond” on page 4, line 8 and page 5, line 5 of the specification
are respectively corrected as "Guibond". (3) Correct figures 1 and 4 as shown in the attached sheet. 2. Claims A frame for a resin-sealed semiconductor device comprising a conductive plate on which a semiconductor chip is connected, and a lead portion connected to the semiconductor chip with a connecting wire, wherein the conductive plate and , formed integrally with the same frame separated from the lead portion, and by folding the frame over the semiconductor chip, the lead portion is placed at a desired position on the conductive plate. 7 rams for resin-sealed semiconductor devices. Figure 1 20 = Sort area

Claims (1)

[Claims] In a resin-sealed semiconductor device frame comprising a conductive plate to which a semiconductor chip is die-bonded, and a lead part connected to the semiconductor chip with a connecting wire, the conductive plate and the lead part are separated from each other in the same frame. A frame for a resin-sealed semiconductor device, characterized in that the lead portion is placed at a desired position on the conductive plate by folding the frame over the semiconductor chip. .