JPS6334278Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a package structure for a hybrid integrated circuit, and particularly to a package structure for a hybrid integrated circuit that has excellent thermal shock resistance.

[Background technology]

In general, the integration technology of hybrid integrated circuits is progressing steadily, and the applications of hybrid integrated circuits are expanding along with the demand for miniaturization of electronic devices. Some electronic devices using hybrid integrated circuits are used in very severe environmental conditions ranging from sub-zero temperatures to fairly high temperatures above room temperature. For example, video cameras used outdoors, electronic devices for automobiles, etc. fall under this category. Accordingly, it has become necessary for hybrid integrated circuit packages to have a structure that can withstand such severe thermal environments. For this, for example −40
Thermal shock tests, which consist of temperature cycles between 0.degree. C. and +125.degree. C., are increasingly being performed on hybrid integrated circuit devices.

[Prior art]

In conventional hybrid integrated circuit devices, the main method is to directly mold the hybrid integrated circuit body with resin or the like, or to pour epoxy resin or the like into a case containing the hybrid integrated circuit body and harden it to seal it. It was being done. In this case, the coefficient of thermal expansion of the epoxy resin is one to two orders of magnitude larger than that of the substrate of the hybrid integrated circuit (for example, the coefficient of thermal expansion of an alumina substrate is 75 × 10 ^-7 /℃). Alternatively, when a thermal shock is applied, shrinkage stress is applied to the board, and there is a risk that the board and the electronic components mounted on the board will be damaged. In order to avoid this, it has conventionally been usual to apply a buffer coating to the hybrid integrated circuit body to alleviate thermal shock.

[Problem that the invention attempts to solve]

Therefore, the purpose of this invention is to solve the above-mentioned problem that conventional hybrid integrated circuit devices are susceptible to temperature cycles or the application of thermal shock, and this invention provides excellent results. A hybrid integrated circuit package structure is provided that has improved thermal shock resistance.

[Means for solving problems]

In order to solve the above-mentioned problems, the package structure of the hybrid integrated circuit according to the present invention includes a hybrid integrated circuit body, a base that holds the hybrid integrated circuit body, and a base that houses the body and is attached to the base. In the package structure of a hybrid integrated circuit consisting of a package case to be attached, the base is made of an insulating material, and the base has protrusions formed at positions to hold at least both end portions in the longitudinal direction of the body of the hybrid integrated circuit. A lead wire insertion hole is provided at a position corresponding to the lead wire drawn out from the hybrid integrated circuit body, and a groove is formed in the protrusion in the longitudinal direction of the base, and the groove allows the hybrid integrated circuit body to It is characterized by having a structure that is held in a hollow state within a package case.

〔Example〕

Next, an embodiment of this invention will be described based on FIGS. 1 and 2.

In FIG. 1, 1 is a hybrid integrated circuit main body. The hybrid integrated circuit main body 1 has a wiring pattern formed on a substrate such as alumina, and IC chips,
It is constructed by mounting electronic components such as chip capacitors and chip resistors, and further forming a coating layer of resin or the like on top of them. Furthermore, it goes without saying that thin film or thick film resistors and capacitors may be formed in place of the chip resistors and chip capacitors. A lead wire 2 for external extraction is attached to the substrate of the hybrid integrated circuit by soldering or the like. Reference numeral 3 denotes a base for holding the hybrid integrated circuit main body 1, and is made of an insulating material such as resin. A hole 4 for inserting the lead wire 2 of the main body 1 is formed in the base 3. Furthermore, the base 3 is provided with three protrusions 5 on its upper part, and a groove 6 is formed in the protrusions 5 in the longitudinal direction of the base 3. The groove 6 has a hybrid integrated circuit main body 1
are fitted and held vertically. Projection 5 of base 3
The number is not limited to three, and it is sufficient to hold at least both end portions of the hybrid integrated circuit main body 1, but in order to stably hold the hybrid integrated circuit main body 1, it is desirable to have about three. Further, the base 3 has a pair of fixing claws 7 on the left and right sides of the center thereof.
The fixing claws 7 fix the package case 8 to the base 3, and the number of fixing claws 7 is not limited to one pair.
It is clear that more numbers may be provided. The package case 8 is made of a conductive material such as metal or an insulating material such as resin, and has a pair of fixing windows 9 formed on its left and right sides. The fixing window 9 of the package case 8 is fitted into the fixing claw 7 of the base 3, and the package case 8 is fixed to the base 3. When the package case 8 is made of a metal material, it can be used as a shielding case, so that noise generated in the hybrid integrated circuit main body 1 can be prevented from leaking out to the outside, and noise from the outside can be prevented from entering. Further, the package case 8 has a pair of claws 10 formed at the bottom of the opening for attachment to the motherboard. This nail 1
0, the hybrid integrated circuit device is attached and fixed to a printed circuit board or the like.

Next, the assembly order in this example will be explained. Connect the lead wire 2 of the hybrid integrated circuit main body 1 to the base 3
Insert the lead wire into the lead wire insertion hole 4, and then insert the lead wire into the main body 1.
into the groove 6 of the protrusion 5. Thereafter, the package case 8 is placed over the main body 1, and the fixing window 9 of the package case 8 is fitted into the fixing claw 7 of the base 3, thereby completing the hybrid integrated circuit device as shown in FIG. . In such a hybrid integrated circuit device, the hybrid integrated circuit main body 1 is held vertically by the groove 6, and is sealed so that the interior of the package case 8 becomes a space without contacting the package case 8. In this way, with the base 3 and the package case 8 shown in the above embodiment,
The hybrid integrated circuit main body 1 can be held in a hollow state inside the package case. Also, base 3
The groove 6 of the projection 5 and the lead wire insertion hole 4 play an important role in positioning and holding the main body 1.

〔effect〕

As explained above, in the package structure of the hybrid integrated circuit of this invention, the main body of the hybrid integrated circuit is held in a hollow state within the package case, so that the following effects can be obtained.

First, because the hybrid integrated circuit body is not in direct contact with packaging materials such as epoxy resin,
Since the hybrid integrated circuit main body is not subjected to stress due to a difference in coefficient of thermal expansion during thermal shock, it is hardly affected by thermal shock.

Second, insert the lead wire of the hybrid integrated circuit main body into the lead wire insertion hole of the base, and insert the package case from above.The fixing claws on the base will fix the package case, so this step is all you need. Therefore, processes such as buffer coating and resin pouring are not necessary, making production management easier and reducing labor to a large extent. At this time, by inserting the lead wire into the lead wire insertion hole, the hybrid integrated circuit main body can be accurately positioned in the groove, so that large components such as IC chips that are present on the hybrid integrated circuit main body are not accidentally inserted. There is no chance of damage due to contact with protrusions. Moreover, since both longitudinal ends of the hybrid integrated circuit main body are held by the projections, the hybrid integrated circuit main body can be stably held.

Thirdly, there is no need to pour epoxy resin or the like into the package case, and all that is needed is a resin base, so the cost of materials such as resin can be significantly reduced, thereby reducing the cost of hybrid integrated circuit devices. be able to.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of essential parts for explaining an embodiment of the package structure of a hybrid integrated circuit according to the present invention, and FIG. 2 is a completed assembled view of FIG. 1. 1...Hybrid integrated circuit body, 2...Lead wire, 3
...Base, 4...Lead wire insertion hole, 5...Protrusion, 6...Groove, 7...Fixing claw, 8...Package case, 9...Fixing window, 10...For installation nail.

Claims (1)

[Claims for Utility Model Registration] 1. A hybrid integrated circuit consisting of a hybrid integrated circuit body, a base for holding the hybrid integrated circuit body, and a package case that houses the hybrid integrated circuit body and is attached to the base. In the package structure, the base is made of an insulating material, and the base has a protrusion formed at a position to hold at least both end portions in the longitudinal direction of the hybrid integrated circuit body, and a protrusion that is pulled out from the hybrid integrated circuit body. A lead wire insertion hole is provided at a position corresponding to the lead wire, and a groove for holding the hybrid integrated circuit body is formed in the protrusion, and the groove allows the hybrid integrated circuit body to be inserted into the package case. A hybrid integrated circuit package structure characterized by a hollow state in which space is maintained. 2. A package structure for a hybrid integrated circuit according to claim 1, wherein the package case is a shield case. 3. The package structure for a hybrid integrated circuit according to claim 1, wherein the package case is provided with a claw for attachment.