JP2720008B2 - Power semiconductor module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor module obtained by mounting a power semiconductor chip and a control component for controlling the semiconductor chip therein and sealing it with a resin.

[0002]

2. Description of the Related Art As a conventional power semiconductor module,
There is a structure shown in the sectional view of FIG. 2 in the figure
Is a metal substrate having an insulating plate 6 on one surface, on which a copper circuit (not shown) is mounted. Then, cream solder is printed on necessary portions on the copper circuit, and the power semiconductor chip 8 and control components such as resistors and ICs, which are surface mount components, and connection pins 12 for connection with the control circuit are formed on the solder.
Then, the external lead terminal 10 is mounted, and soldering is performed in a reflow furnace. Thereafter, the power semiconductor chip 8 and the necessary copper circuit 6 are wire-bonded.

Next, the periphery of the metal substrate is covered with a resin case 24 integrally formed with a printed circuit mounting projection (not shown) for mounting a printed circuit described later, and the side wall is adhered to the metal substrate with an adhesive such as silicon rubber. I do. And Case 2
4. Fill silicon rubber from the top of 120, 120-150 ° C
To form a silicone rubber layer 26. Next, an epoxy resin is filled in the upper portion of the silicone rubber layer 26, and cured by heating at 120 to 150 ° C.
8 is formed.

On the other hand, a control component for controlling a power semiconductor chip is mounted on a printed wiring board and soldered to form a printed circuit. The holes (not shown) provided in the printed circuit 14 are engaged with the printed circuit mounting projections (not shown) of the case, and the connection pins 12 are connected to the printed circuit 14 to perform soldering. Then, an epoxy resin is filled from the upper portion of the case, and is heated and cured at 120 to 150 ° C. to form the upper epoxy resin layer 30.

[0005]

In order to obtain a semiconductor module as shown in the upper part, the resin case 24 is provided with a hole 24a through which the external lead terminal 10 is fixed. Insertion of the external lead-out terminal, one end of which is fixed to the hole 24a, has poor workability, and particularly when there are a plurality of holes, the workability is poor. Therefore, before soldering the external lead-out terminals to the copper circuit 6, first, a plurality of external lead-out terminals 10 are inserted into the holes 24a of the respective cases 24, the cases 24 are bonded to the metal substrate 2, and the external lead-out terminals 10 are attached. Attempts have been made to solder to the copper circuit 6, but the external lead-out terminal 10 may be disengaged during transport until it is inserted into the hole 24a of the case 24 and set on a metal substrate. Met. Also,
The external lead-out terminal may be molded at the same time as the case when the case is manufactured, but it takes time to set the external lead-out terminal and the workability is poor.

[0006]

According to the present invention, there is provided a metal substrate having an insulating plate on which a copper circuit is arranged, at least a power semiconductor chip mounted and fixed on the copper circuit, and one end of the metal substrate is located outside the case upper part. In a semiconductor module in which an external lead terminal pulled out to the other end and connected to a copper circuit is covered with a resin case having an opening at an upper portion, and the inside of the case is resin-sealed, a side wall of the resin case is formed inside. A holding portion extending toward the center and having an opening at the center, a groove provided on the side wall surrounded by the holding portion, and a support base provided at a lower portion of the holding portion and extending toward the inside, and The external lead-out terminal includes a notch having a width smaller than the opening of the holding portion, a protrusion protruding toward the side wall, and a bent portion provided below the notch and extending toward the inside. It is those that are configured.

[0007]

The cutout of the external drawer terminal is passed through the open portion of the holding portion of the side wall of the resin case, and the external drawer terminal is lowered. When the bent portion of the external drawer terminal is supported by the support base, the protrusion of the external drawer terminal protrudes. The portion is engaged with the groove of the resin case, and the external lead-out terminal is firmly supported by the resin case.

[0008]

1 to 3 show one embodiment of a power semiconductor module according to the present invention. In addition, the same symbols are given to the same parts as the conventional one shown in FIG.

The resin case 4 extends inward and has a holding portion 4a having an opening 4d at the center, and a holding portion 4a.
A groove 4c provided in the side wall and surrounded by the support 4b, and a support 4b provided below the holding portion 4a and extending inward. Also, the external lead-out terminal is
The cutout 10a has a width smaller than the width of the opening 4d, a claw 10b protruding toward the side wall, and a bent portion 10c provided below the cutout 10a and extending inward.

The holding portion 4a of the outer wall of the resin case 4
When the notched portion 10a of the external lead-out terminal 10 is passed through the open portion 4d, and the external draw-out terminal 10 is lowered, the bent portion 10c of the external draw-out terminal 10 is supported by the support 4b, and the claw 10b of the external draw-out terminal 10 The external lead-out terminal 10 is firmly supported by the resin case 4 by engaging with the groove 4c of the resin case 4 as shown in FIGS.

On the other hand, a power semiconductor chip 8 is soldered to a required portion of a copper circuit (not shown) adhered on an insulating layer 6 such as a ceramic metallized on one side, and the power semiconductor chip 8 and the copper Wire bonding is performed between circuits to form a stack.

[0012] Then, cream solder is printed on necessary portions of the metal substrate 2, and an adhesive such as silicon rubber is applied to the periphery of the metal substrate 2. On this cream solder, in addition to the above-mentioned stack, a connection pin 12 for connection with a control component such as a resistance of a surface mount component, a semiconductor element and a control circuit, and a resin in which the above-mentioned external lead-out terminal is supported on an adhesive material The case is placed, and soldering and bonding are performed in a reflow furnace.
The external lead terminals are also soldered to the copper circuit at the same time.

Then, silicone rubber is filled from the upper portion of the case 4 and cured by heating at 120 to 150 ° C. to form a silicone rubber layer 26. Next, an epoxy resin is filled in the upper portion of the silicon rubber layer 26 and is cured by heating at 120 to 150 ° C. to form an epoxy resin layer 28. Further, a hole (not shown) provided inside the printed circuit 14 on which a control component for controlling the power semiconductor chip is mounted is engaged with a printed circuit mounting projection (not shown) protruding from the resin case 4, Connect the connection pin 12 to the printed circuit,
Perform soldering. Then, an epoxy resin is filled from the upper part of the case and cured by heating to form an upper epoxy resin layer 30, thereby obtaining a power semiconductor module.

In the above embodiment, as shown in FIGS. 1 to 3, the external lead-out terminal is provided with a claw whose upper part is open. However, a protrusion such as a convex mark whose upper part is not open may be provided. In the above embodiment, the power semiconductor chip is molded with the silicon rubber layer 26 and the epoxy resin layer 28, but may be molded with only the epoxy resin layer.

[0015]

As described above, according to the present invention, the resin case is provided with a holding portion for holding the external lead-out terminal, the holding portion is opened at the center, and the terminal is held through the cutout portion of the terminal. When the terminal is put down and the terminal is lowered, the protrusion of the terminal engages with the groove of the resin case, the bent portion of the terminal is supported by the support base of the resin case, and the terminal is easily and firmly supported by the resin case. . This facilitates the manufacture of the power semiconductor module without the terminals coming off the case during the transfer operation.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating the engagement between a resin case and an external lead-out terminal in one embodiment of a power semiconductor module of the present invention.

FIG. 2 is a sectional view showing an embodiment of the power semiconductor module of the present invention.

FIG. 3 is a cross-sectional view illustrating fixing of a resin case and an external lead terminal of FIG. 1;

FIG. 4 is a sectional view of a conventional power semiconductor module.

[Explanation of symbols]

 Reference Signs List 2 Metal substrate 4 Resin case 4a Holder 4b Support 4c Groove 4d Open 6 Insulating plate 8 Power semiconductor chip 10 External lead-out terminal 10a Notch 10b Claw 10c Bend 12 Connection pin 14 Printed circuit 26 Silicon rubber layer 28, 30 Epoxy resin layer

 ──────────────────────────────────────────────────続 き Continuation of the front page Examiner Hideo Kawamada (56) References JP-A-4-111346 (JP, A) JP-A-1-107144 (JP, U)

Claims (1)

(57) [Claims] 1. A metal substrate having an insulating plate on which a copper circuit is disposed, a power semiconductor chip mounted and fixed on the copper circuit, one end drawn out of the upper part of the case and the other end connected to the copper In a semiconductor module in which an external lead terminal connected to a circuit is covered with a resin case having an opening at an upper portion and the inside of the case is resin-sealed, a side wall of the resin case extends inward, and an open portion is formed at the center. A holding portion, a groove provided on a side wall surrounded by the holding portion, and a support base provided below the holding portion and extending toward the inside. A power semiconductor comprising: a notch having a width smaller than an open portion; a protrusion protruding toward the side wall; and a bent portion provided below the notch and extending toward the inside. module.