JPH07153906A - Power semiconductor module - Google Patents

Abstract

PURPOSE:To improve workability by rigidly fixing an external lead-out terminal to a resin case. CONSTITUTION:The side wall of a resin case is constituted of a holding part 4a, which is extending toward the inside and has an opening part 4d at the center, a groove, which is surrounded with the holding part and provided on an outer wall, and a supporting stage 4b, which is provided at the lower part of the holding part and extending to the inside. Furthermore, an external lead- out terminal 10 is constituted of a notch part 10a, whose width is smaller than the opening part of the holding part, a protruding part 10b protruding to the side of the side wall and a bent part 10c, which is provided at the lower part of the notch part and extending to the inside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor module obtained by mounting a power semiconductor chip and a control component for controlling the semiconductor chip inside and sealing with a resin.

[0002]

2. Description of the Related Art As a conventional power semiconductor module,
There is a structure shown in the sectional view of FIG. 2 in the figure
Is a metal substrate having an insulating plate 6 on one surface, and a copper circuit (not shown) is mounted on the insulating plate 6. Then, cream solder is printed at a required position on the copper circuit, and the power semiconductor chip 8 and control components such as resistors and ICs which are surface mounting components, and connecting pins 12 to the control circuit are printed on the solder.
And the external lead-out terminal 10 is mounted, and soldering is performed in a reflow furnace. After that, the power semiconductor chip 8 and the necessary copper circuit 6 are wire-bonded.

Next, the periphery of the metal substrate is covered with a resin case 24 integrally formed with a printed circuit mounting projection (not shown) for mounting a printed circuit described later, and the side wall is bonded to the metal substrate with an adhesive such as silicon rubber. To do. And case 2
4 is filled with silicone rubber from above, 120-150 ° C
Then, the silicon rubber layer 26 is formed by heat curing. Then, an epoxy resin is filled in the upper part of the silicone rubber layer 26, and the epoxy resin layer 2 is cured by heating at 120 to 150 ° C.
8 is formed.

On the other hand, a control component for controlling a power semiconductor chip is mounted on a printed wiring board and soldered to form a printed circuit. A hole (not shown) provided in the printed circuit 14 is engaged with a printed circuit mounting protrusion (not shown) of the case, and the connecting pin 12 is connected to the printed circuit 14 for soldering. Then, the epoxy resin is filled from the upper part of the case and heated and cured at 120 to 150 ° C. to form the upper epoxy resin layer 30.

[0005]

In obtaining a semiconductor module such as the upper part, the resin case 24 is provided with a hole 24a through which the external lead terminal 10 is fixed. The workability of inserting the external lead-out terminal whose one end is fixed into the hole 24a is poor, and the workability is particularly poor when the hole is plural. Therefore, before soldering the external lead terminals to the copper circuit 6, first, the plurality of external lead terminals 10 are inserted into the holes 24a of the respective cases 24, the cases 24 are bonded to the metal substrate 2, and the external lead terminals 10 are attached. Attempts have been made to solder to the copper circuit 6, but the external lead terminals 10 may come off during insertion until they are inserted into the holes 24a of the case 24 and set on a metal substrate, and this work also has poor workability. Met. Also,
The external lead terminals may be molded at the same time as the case when the case is manufactured, but it takes time to set the external lead terminals and the workability is poor.

[0006]

According to the present invention, a metal substrate having an insulating plate on which a copper circuit is arranged and at least a power semiconductor chip are mounted and fixed on the copper circuit, and one end of the metal substrate is outside the upper part of the case. In the semiconductor module in which the external lead-out terminal that is drawn out to and the other end is connected to the copper circuit is covered with a resin case having an opening at the top, and the inside of the case is resin-sealed, the side wall of the resin case is The gripping portion extending toward the center and having an opening portion in the center, a groove provided on the side wall surrounded by the gripping portion, and a support base provided in the lower portion of the gripping portion and extending toward the inside, and The external lead terminal includes a cutout portion having a width smaller than the open portion of the holding portion, a protrusion protruding toward the side wall, and a bent portion provided in a lower portion of the cutout portion and extending inward. It is those that are configured.

[0007]

[Function] When the cutout portion of the external lead terminal is passed through the opening of the holding portion of the side wall of the resin case and the external lead terminal is lowered, the bent portion of the external lead terminal is supported by the support base and the external lead terminal is projected. The portion engages with the groove of the resin case, and the external lead terminal is firmly supported by the resin case.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a power semiconductor module according to the present invention is shown in FIGS. The same parts as those of the conventional one shown in FIG.

The resin case 4 extends inwardly and has a holding portion 4a having an opening 4d at the center, and the holding portion 4a.
It is constituted by a groove 4c surrounded by and provided on the side wall, and a support base 4b provided at a lower portion of the holding portion 4a and extending toward the inside. Also, the external lead-out terminal is the holding part 4
It is composed of a cutout portion 10a having a width smaller than the open portion 4d of a, a pawl 10b protruding toward the side wall, and a bent portion 10c provided at a lower portion of the cutout portion 10a and extending inward.

Then, a holding portion 4a on the outer wall of the resin case 4
When the cutout portion 10a of the external lead terminal 10 is passed through the open portion 4d and the external lead terminal 10 is lowered, the bent portion 10c of the external lead terminal 10 is supported by the support base 4b and the pawl 10b of the external lead terminal 10 is held. By engaging with the groove 4c of the resin case 4, the external lead-out terminal 10 is firmly supported by the resin case 4 as shown in FIGS.

On the other hand, a power semiconductor chip 8 is soldered to a necessary portion of a copper circuit (not shown) adhered on an insulating layer 6 such as ceramic whose one surface is metallized. Wire bonding is performed between the circuits to form a stack.

Then, cream solder is printed on a required portion of the metal substrate 2, and an adhesive such as silicon rubber is applied to the periphery of the metal substrate 2. On this cream solder, in addition to the above-mentioned stack, the resistance of surface-mounted components, the connection pins 12 for connecting to control components such as semiconductor elements and control circuits, and the resin on which the above-mentioned external lead terminals are supported on the adhesive material Place the case and solder and bond in a reflow oven.
The external lead terminal is also soldered to the copper circuit at the same time.

Then, silicone rubber is filled from the upper part of the case 4 and heated and cured at 120 to 150 ° C. to form the silicone rubber layer 26. Then, an epoxy resin is filled in the upper part of the silicone rubber layer 26 and is heated and cured at 120 to 150 ° C. to form an epoxy resin layer 28. Further, a hole (not shown) having a printed circuit 14 on which a control component for separately controlling the power semiconductor chip is mounted is engaged with a printed circuit mounting protrusion (not shown) protruding from the resin case 4, Connect the connection pin 12 to the printed circuit,
Solder. Then, an epoxy resin is filled in from the upper part of the case and cured by heating to form the upper epoxy resin layer 30 to obtain a power semiconductor module.

In the above embodiment, as shown in FIGS. 1 to 3, the external lead-out terminal is provided with the claw whose upper part is opened, but it is also possible to provide a projecting part such as a convex mark whose upper part is not opened. Further, in the above embodiment, the power semiconductor chip is molded by the silicone rubber layer 26 and the epoxy resin layer 28, but it may be molded only by the epoxy resin layer.

[0015]

As described above, according to the present invention, the resin case is provided with the holding portion for holding the external lead-out terminal, and the holding portion is opened at the center, and the terminal is held through the cutout portion of the terminal. When the terminal is fitted inside and the terminal is lowered, the projection of the terminal engages with the groove of the resin case, and the bent part of the terminal is supported by the support base of the resin case, and the terminal is easily and firmly supported by the resin case. . This facilitates the manufacture of the power semiconductor module without the terminals coming off the case during the transfer operation.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating the engagement between a resin case and an external lead terminal of an embodiment of a power semiconductor module of the present invention.

FIG. 2 is a sectional view showing an embodiment of a power semiconductor module of the present invention.

FIG. 3 is a cross-sectional view illustrating fixing of the resin case and the external lead terminal of FIG.

FIG. 4 is a cross-sectional view of a conventional power semiconductor module.

[Explanation of symbols]

 2 Metal substrate 4 Resin case 4a Holding part 4b Supporting base 4c Groove 4d Opening part 6 Insulating plate 8 Power semiconductor chip 10 External lead terminal 10a Notch part 10b Pawl 10c Bending part 12 Connection pin 14 Printed circuit 26 Silicon rubber layer 28, 30 Epoxy resin layer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hideyuki Funamoto 2-3-14 Awaji, Higashiyodogawa-ku, Osaka-shi, Osaka Inside Sansha Electric Co., Ltd.

Claims (1)

[Claims] 1. A metal substrate having an insulating plate on which a copper circuit is arranged, a power semiconductor chip mounted and fixed on the copper circuit, one end of which is pulled out of the upper part of the case and the other end of which is the copper. In a semiconductor module in which an external lead terminal connected to a circuit is covered with a resin case having an opening at the top and the inside of the case is resin-sealed, the side wall of the resin case extends toward the inside and has an opening at the center. The holding portion having, a groove provided in the side wall surrounded by the holding portion, and a support base provided in the lower portion of the holding portion and extending toward the inside, and the external lead terminal, the external lead terminal of the holding portion. A power semiconductor, comprising: a notch having a width smaller than an opening, a protrusion protruding toward the side wall, and a bent part provided at a lower portion of the notch and extending inward. module.