JPH08204120A - Semiconductor module for power - Google Patents

Abstract

PURPOSE: To provide a power semiconductor module, which facilitates the work of the connection of a copper circuit on a metal substrate with a control device and is miniaturized at the same time. CONSTITUTION: A power semiconductor module is formed into a structure, wherein a semiconductor chip 2 is placed and fixed on the upper surface of a copper circuit on a metal substrate 1 via an insulating layer, the chip 2 is enclosed in a resin case 4 and a sealing medium is injected and cured in the interior of the case 4, and the module is constituted of projected parts made to project 4a and 4b from the outer wall of the case 4 and respectively having bosses 7 and 8 engaged with mounting holes formed in a printed-wiring board 5, on their points, and control terminals 6 which respectively have holes, which are engaged with the bosses, and respectively have a plurality of pins which are connected with one part of the copper circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor chip and a power semiconductor module in which a control component for the semiconductor chip is mounted in one module.

[0002]

2. Description of the Related Art One of power control devices used in a power semiconductor module is shown in FIG. That is, AC is received by the input terminal 51, AC is rectified by the rectifier diode 52, smoothed by the high-frequency bypass capacitor 53 and smoothing capacitor 54, and the rectified and smoothed DC is converted by the inverter 55 into AC. AC is output from the output terminal 10. The inverter 55 includes control elements 56 to 61 such as IGBTs, MOSFETs, transistors, GTOs, and the like.
6 to 61 and fuller Wheeling diodes 62 to 67 provided in parallel, respectively, and control element 56
A drive signal is input to the controller 61 from the controller 71.

Conventionally, when assembling a power semiconductor module from the power control device shown in FIG. 3, the one shown in FIG. 4 is known. That is, a copper circuit is adhered and soldered on a metal substrate 1 having an insulating layer formed on one entire surface, cream solder is printed on a required portion of the copper circuit on the metal substrate, and a diode and a power source are provided on the copper circuit. The control element chip 2 is mounted and soldered in a reflow furnace. After that, wire bonding between circuits is performed. Also,
A resin case 14 is adhered to the metal substrate 1, and a printed wiring board 5 having a control device for driving a power control element mounted therein is fixed in the resin case 14. Silicon gel is injected into the case 14 and heat-cured to form the silicon gel layer 9,
Further, epoxy resin is injected and cured by heating to form the epoxy resin layer 10. After that, the input terminal and the output terminal (not shown) drawn out from the resin case are provided with nuts or the like to form the external connection terminals and form the power semiconductor module.

[0004]

However, although the copper circuit of the metal substrate and the control device are connected by the control terminal,
Since the control terminals have a narrow open pitch and are composed of a large number of control terminals, there is a problem that the process of inserting the large number of control terminals into a resin case becomes complicated. In addition, a large number of pins may be formed as a terminal block. In this case, since the terminal block is fixed on the printed wiring board, when the printed wiring board is placed, the printed wiring board interferes with the pins. Soldering with a copper circuit was difficult. In addition, there is a problem that the power semiconductor module becomes large if the soldering is attempted easily.

[0005]

In order to solve the above problems, the present invention mounts and fixes a power semiconductor chip on the upper surface of a copper circuit provided on a metal substrate via an insulating layer. In a power semiconductor module which is surrounded by a resin case and in which a sealing material is injected and cured, the resin case protrudes inward from an outer wall and has a protrusion having a boss at a tip end that engages with a mounting hole of a printed wiring board. A control terminal having a plurality of pins having holes for engaging the bosses and connected to a part of the copper circuit.

[0006]

When the control terminal having a plurality of pins is inserted into the boss at the tip of the protruding portion provided on the resin case, the tip of the pin and the copper circuit can be easily connected. When the mounting hole of the printed wiring board is inserted into the boss, the printed wiring board is engaged with the boss.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to FIGS. In the figure, the same reference numerals as those in the conventional example indicate the same parts. Further, 6 is a control terminal, and a large number of pins 6a connected to the control device are insert-formed on one terminal block 6b, and a hole 6c is provided at the end thereof. On the other hand, the case is provided with protrusions 4a and 4b that protrude inward from the outer wall, and the protrusions 4a and 4b are provided.
Bosses 7 and 8 are provided on the upper part of b. Then, the one boss 7 is engaged with the hole 6c of the control terminal 6. Also,
The height of the protruding portion 4a is designed to be lower than the height of 4b by the thickness of the terminal block 6b.

When assembling a power semiconductor module,
A copper circuit is adhered or soldered onto the metal substrate 1 on which an insulating layer is formed, cream solder is printed on a required portion of the copper circuit on the metal substrate, and a power semiconductor such as a diode or a power control element is printed on the copper circuit. The chip 2 is mounted and soldered in a reflow furnace. After that, wire bonding between circuits is performed. Next, a resin case 4 in which terminals (not shown) are insert-molded on the metal substrate 1 is bonded with silicon rubber or the like, and the terminals and the copper circuit are soldered together.

Then, the hole 6c of the control terminal 6 is fitted into the boss 7 on the side of the protruding portion 4a which is provided low. At this time, boss 7
Has a tip protruding from the hole 6c. One end of the pin 6a extending from the control terminal 6 is in contact with the copper circuit of the metal substrate 1, and one end of the pin 6a and the copper circuit are soldered to each other. After that, the printed wiring board 5 having holes for engaging with the bosses 7 and 8 and the pin 6a and having electronic components mounted thereon is placed, and the pins 6b and the printed wiring board 5 are soldered. Then, silicone gel is injected into the case 4 and cured by heating to form a gel layer 9, and an epoxy resin is injected onto the upper portion of the gel layer 9 and cured by heating to form an epoxy resin layer 10. In addition, the gel layer 9 and the epoxy resin 10
The terminal pulled out from the device is provided with a nut or the like to form an external connection terminal and form a power semiconductor module.

Although silicon gel and epoxy resin are used as the encapsulating material for protecting the power semiconductor chip in the above embodiment, either one may be used. Further, although the number of bosses for fixing the printed wiring board is four in the above-mentioned embodiment, the number of bosses for fixing the control terminal 6 to the printed wiring board in common may be two, or three or more. Good. Also,
By mounting the temperature detector on the copper circuit and inputting the detection signal of the temperature detector to the control device, the temperature of the module can be guaranteed during operation.

[0011]

As described above, in the power semiconductor module of the present invention, a large number of pins are insert-molded in a simple terminal block to form a terminal block, and the terminal block is connected to a boss provided in a resin case. Is easy to attach, and the pins come into contact with the copper circuit, which facilitates soldering between the pins and the copper circuit.
Further, the boss for mounting the terminal block is a boss for mounting the printed wiring board, and it is not necessary to separately provide a boss for the printed wiring board, and the power semiconductor module can be miniaturized.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an embodiment of a power semiconductor module of the present invention.

2 is a front view of the components of FIG. 1. FIG.

FIG. 3 is a wiring diagram of a power control device according to the present invention.

FIG. 4 is a cross-sectional view of a conventional power semiconductor module.

[Explanation of symbols]

 1 Metal Substrate 2 Power Semiconductor Chip 4 Resin Case 4a, 4b Projection 5 Printed Wiring Board 6 Control Terminals 7, 8 Boss 9 Silicon Gel 10 Epoxy Resin

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hideo Ishii Inventor Hideo Ishii 2-14-3 Awaji, Higashiyodogawa-ku, Osaka-shi, Osaka Sansan Electric Co., Ltd.

Claims (1)

[Claims] 1. A power semiconductor chip in which a power semiconductor chip is mounted and fixed on the upper surface of a copper circuit provided on a metal substrate with an insulating layer interposed therebetween, and a sealing material is injected and cured inside the resin case. In a semiconductor module, the resin case projects inward from an outer wall and has a boss at a tip end that engages with a mounting hole of a printed wiring board, and a hole that engages with the boss and is connected to a part of the copper circuit. And a control terminal having a plurality of pins, the semiconductor module for electric power.