JPS6333854Y2 - - Google Patents
Info
- Publication number
- JPS6333854Y2 JPS6333854Y2 JP18538779U JP18538779U JPS6333854Y2 JP S6333854 Y2 JPS6333854 Y2 JP S6333854Y2 JP 18538779 U JP18538779 U JP 18538779U JP 18538779 U JP18538779 U JP 18538779U JP S6333854 Y2 JPS6333854 Y2 JP S6333854Y2
- Authority
- JP
- Japan
- Prior art keywords
- section
- actuator
- pulley
- sensor
- paddy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000843 powder Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 15
- 239000010902 straw Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Landscapes
- Threshing Machine Elements (AREA)
- Control Of Conveyors (AREA)
- Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18538779U JPS6333854Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-12-26 | 1979-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18538779U JPS6333854Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-12-26 | 1979-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56100417U JPS56100417U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1981-08-07 |
| JPS6333854Y2 true JPS6333854Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-09-08 |
Family
ID=29695574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18538779U Expired JPS6333854Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-12-26 | 1979-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6333854Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7057280B2 (en) | 1998-11-20 | 2006-06-06 | Amkor Technology, Inc. | Leadframe having lead locks to secure leads to encapsulant |
| US7192807B1 (en) | 2002-11-08 | 2007-03-20 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US7361533B1 (en) | 2002-11-08 | 2008-04-22 | Amkor Technology, Inc. | Stacked embedded leadframe |
| US7572681B1 (en) | 2005-12-08 | 2009-08-11 | Amkor Technology, Inc. | Embedded electronic component package |
| US8900995B1 (en) | 2010-10-05 | 2014-12-02 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US8981572B1 (en) | 2011-11-29 | 2015-03-17 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
-
1979
- 1979-12-26 JP JP18538779U patent/JPS6333854Y2/ja not_active Expired
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7057280B2 (en) | 1998-11-20 | 2006-06-06 | Amkor Technology, Inc. | Leadframe having lead locks to secure leads to encapsulant |
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8952522B1 (en) | 2002-11-08 | 2015-02-10 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US7361533B1 (en) | 2002-11-08 | 2008-04-22 | Amkor Technology, Inc. | Stacked embedded leadframe |
| US7420272B1 (en) | 2002-11-08 | 2008-09-02 | Amkor Technology, Inc. | Two-sided wafer escape package |
| US7192807B1 (en) | 2002-11-08 | 2007-03-20 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9406645B1 (en) | 2002-11-08 | 2016-08-02 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US7247523B1 (en) | 2002-11-08 | 2007-07-24 | Amkor Technology, Inc. | Two-sided wafer escape package |
| US7572681B1 (en) | 2005-12-08 | 2009-08-11 | Amkor Technology, Inc. | Embedded electronic component package |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US8900995B1 (en) | 2010-10-05 | 2014-12-02 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| US8981572B1 (en) | 2011-11-29 | 2015-03-17 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56100417U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1981-08-07 |