JPS6333670U - - Google Patents
Info
- Publication number
- JPS6333670U JPS6333670U JP12607586U JP12607586U JPS6333670U JP S6333670 U JPS6333670 U JP S6333670U JP 12607586 U JP12607586 U JP 12607586U JP 12607586 U JP12607586 U JP 12607586U JP S6333670 U JPS6333670 U JP S6333670U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- chip
- printed wiring
- wiring board
- chip element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ないし第３図はこの考案によるプリント
配線基板の一実施例を示す図で、第１図は分解斜
視図、第２図は縦断面図、第３図は平面図、第４
図および第５図はこの考案によるプリント配線基
板の他の実施例を示す図で、第４図は分解斜視図
、第５図は平面図、第６図ないし第８図は従来の
プリント配線基板の一例を示す図で、第６図は分
解斜視図、第７図は縦断面図、第８図はチツプ素
子１の位置ずれを示す平面図である。
１……チツプ素子、１ａ，１ｂ……チツプ素子
端子、２……プリント配線基板、３……導電パタ
ーン、３ａ，３ｂ……ランド部、４……半田レジ
スト、４ａ，４ｂ……窓、４ｃ，４ｅ……溝、４
ｄ……枝溝、５……接着剤、６……半田付け。
1 to 3 are views showing one embodiment of the printed wiring board according to this invention, in which FIG. 1 is an exploded perspective view, FIG. 2 is a vertical sectional view, FIG. 3 is a plan view, and FIG.
5 and 5 are views showing other embodiments of the printed wiring board according to this invention, in which FIG. 4 is an exploded perspective view, FIG. 5 is a plan view, and FIGS. 6 to 8 are conventional printed wiring boards. FIG. 6 is an exploded perspective view, FIG. 7 is a vertical sectional view, and FIG. 8 is a plan view showing misalignment of the chip element 1. 1... Chip element, 1a, 1b... Chip element terminal, 2... Printed wiring board, 3... Conductive pattern, 3a, 3b... Land portion, 4... Solder resist, 4a, 4b... Window, 4c , 4e...groove, 4
d... Branch groove, 5... Adhesive, 6... Soldering.
Claims (1)
電パターンのランド部部分にチツプ素子幅より大
きい幅の窓を残して導電パターンが半田レジスト
され、前記ランド部間に接着剤による仮固定され
た前記チツプ素子端子と当該ランド部とが半田付
けされるプリント配線基板において、前記窓のそ
れぞれを前記チツプ素子が嵌入可能な溝で連通さ
せるとともに、該溝と連通し前記接着剤が流れ込
み可能な枝溝を設けたことを特徴とするプリント
配線基板。 The conductive patterns are soldered and resisted by leaving a window with a width larger than the width of the chip element on the land portions of the conductive patterns placed opposite to each other to which the chip element terminals are connected, and the chip is temporarily fixed with adhesive between the land portions. In the printed wiring board to which the element terminal and the land portion are soldered, each of the windows is communicated with a groove into which the chip element can be inserted, and a branch groove is formed in communication with the groove and into which the adhesive can flow. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12607586U JPS6333670U (en) | 1986-08-19 | 1986-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12607586U JPS6333670U (en) | 1986-08-19 | 1986-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6333670U true JPS6333670U (en) | 1988-03-04 |
Family
ID=31019545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12607586U Pending JPS6333670U (en) | 1986-08-19 | 1986-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6333670U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0751648A (en) * | 1993-08-12 | 1995-02-28 | Toyo Hightech Kk | Flexible container cleaning device |
-
1986
- 1986-08-19 JP JP12607586U patent/JPS6333670U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0751648A (en) * | 1993-08-12 | 1995-02-28 | Toyo Hightech Kk | Flexible container cleaning device |
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