JPS6332264B2 - - Google Patents

Info

Publication number
JPS6332264B2
JPS6332264B2 JP4065782A JP4065782A JPS6332264B2 JP S6332264 B2 JPS6332264 B2 JP S6332264B2 JP 4065782 A JP4065782 A JP 4065782A JP 4065782 A JP4065782 A JP 4065782A JP S6332264 B2 JPS6332264 B2 JP S6332264B2
Authority
JP
Japan
Prior art keywords
substrate
ceramic
lead frame
semiconductor chip
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4065782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57166053A (en
Inventor
Jii Guratsubu Deimitorii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of JPS57166053A publication Critical patent/JPS57166053A/ja
Publication of JPS6332264B2 publication Critical patent/JPS6332264B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP4065782A 1981-03-27 1982-03-15 Defect receiving terminal and ceramic chip carrier with radiating plate Granted JPS57166053A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24859081A 1981-03-27 1981-03-27

Publications (2)

Publication Number Publication Date
JPS57166053A JPS57166053A (en) 1982-10-13
JPS6332264B2 true JPS6332264B2 (enrdf_load_stackoverflow) 1988-06-29

Family

ID=22939765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4065782A Granted JPS57166053A (en) 1981-03-27 1982-03-15 Defect receiving terminal and ceramic chip carrier with radiating plate

Country Status (1)

Country Link
JP (1) JPS57166053A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739242Y2 (ja) * 1987-12-22 1995-09-06 セイコーエプソン株式会社 半導体デバイス

Also Published As

Publication number Publication date
JPS57166053A (en) 1982-10-13

Similar Documents

Publication Publication Date Title
US4809135A (en) Chip carrier and method of fabrication
US5521429A (en) Surface-mount flat package semiconductor device
CA1200923A (en) Semiconductor packages
US4577056A (en) Hermetically sealed metal package
US5792984A (en) Molded aluminum nitride packages
US5578869A (en) Components for housing an integrated circuit device
EP0500750B1 (en) A method for housing a tape-bonded electronic device and the package employed
US5602059A (en) Semiconductor device and method for manufacturing same
EP0488783A2 (en) Lead frame for semiconductor device comprising a heat sink
KR100902766B1 (ko) 절연성 세라믹 히트 싱크를 갖는 디스크리트 패키지
US4807018A (en) Method and package for dissipating heat generated by an integrated circuit chip
JPH03225854A (ja) 半導体デバイス及びその製造方法
KR20020095053A (ko) 열방출 능력이 개선된 전력용 모듈 패키지 및 그 제조 방법
US3673309A (en) Integrated semiconductor circuit package and method
US6049971A (en) Casing for integrated circuit chips and method of fabrication
JPH041501B2 (enrdf_load_stackoverflow)
JP2534881B2 (ja) 気密封止回路装置
JP2720008B2 (ja) 電力用半導体モジュール
JPS6332264B2 (enrdf_load_stackoverflow)
EP0081419A2 (en) High lead count hermetic mass bond integrated circuit carrier
JP2870501B2 (ja) 半導体装置
JPH0196952A (ja) 気密封止チツプキヤリア
KR0168841B1 (ko) 금속전자 패키지 및 그 제조공정
JPS6217382B2 (enrdf_load_stackoverflow)
JPS623984B2 (enrdf_load_stackoverflow)