JPS57166053A - Defect receiving terminal and ceramic chip carrier with radiating plate - Google Patents

Defect receiving terminal and ceramic chip carrier with radiating plate

Info

Publication number
JPS57166053A
JPS57166053A JP4065782A JP4065782A JPS57166053A JP S57166053 A JPS57166053 A JP S57166053A JP 4065782 A JP4065782 A JP 4065782A JP 4065782 A JP4065782 A JP 4065782A JP S57166053 A JPS57166053 A JP S57166053A
Authority
JP
Japan
Prior art keywords
receiving terminal
radiating plate
chip carrier
ceramic chip
defect receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4065782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6332264B2 (enrdf_load_stackoverflow
Inventor
Jii Guratsubu Deimitorii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of JPS57166053A publication Critical patent/JPS57166053A/ja
Publication of JPS6332264B2 publication Critical patent/JPS6332264B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP4065782A 1981-03-27 1982-03-15 Defect receiving terminal and ceramic chip carrier with radiating plate Granted JPS57166053A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24859081A 1981-03-27 1981-03-27

Publications (2)

Publication Number Publication Date
JPS57166053A true JPS57166053A (en) 1982-10-13
JPS6332264B2 JPS6332264B2 (enrdf_load_stackoverflow) 1988-06-29

Family

ID=22939765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4065782A Granted JPS57166053A (en) 1981-03-27 1982-03-15 Defect receiving terminal and ceramic chip carrier with radiating plate

Country Status (1)

Country Link
JP (1) JPS57166053A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197564U (enrdf_load_stackoverflow) * 1987-12-22 1989-06-29

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197564U (enrdf_load_stackoverflow) * 1987-12-22 1989-06-29

Also Published As

Publication number Publication date
JPS6332264B2 (enrdf_load_stackoverflow) 1988-06-29

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