JPS6330797B2 - - Google Patents
Info
- Publication number
- JPS6330797B2 JPS6330797B2 JP54060555A JP6055579A JPS6330797B2 JP S6330797 B2 JPS6330797 B2 JP S6330797B2 JP 54060555 A JP54060555 A JP 54060555A JP 6055579 A JP6055579 A JP 6055579A JP S6330797 B2 JPS6330797 B2 JP S6330797B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin
- metal foil
- heat
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000000853 adhesive Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000002966 varnish Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 125000000623 heterocyclic group Chemical group 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 25
- 239000010410 layer Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 22
- 239000012790 adhesive layer Substances 0.000 description 13
- 239000002904 solvent Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- 229920006015 heat resistant resin Polymers 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000003855 Adhesive Lamination Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- -1 can be used Chemical compound 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6055579A JPS55153393A (en) | 1979-05-18 | 1979-05-18 | Method of fabricating circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6055579A JPS55153393A (en) | 1979-05-18 | 1979-05-18 | Method of fabricating circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55153393A JPS55153393A (en) | 1980-11-29 |
| JPS6330797B2 true JPS6330797B2 (de) | 1988-06-21 |
Family
ID=13145641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6055579A Granted JPS55153393A (en) | 1979-05-18 | 1979-05-18 | Method of fabricating circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55153393A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115722A (ja) * | 2005-10-17 | 2007-05-10 | Tdk Corp | 可撓性配線板及び電子部品 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1667501A4 (de) * | 2003-09-10 | 2010-01-06 | Unitika Ltd | Substrat für eine flexible leiterplatte und herstelungsverfahren dafür |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4725885U (de) * | 1971-04-19 | 1972-11-22 | ||
| JPS4936941A (de) * | 1972-08-24 | 1974-04-05 | ||
| JPS4943160A (de) * | 1972-09-01 | 1974-04-23 | ||
| JPS4968266A (de) * | 1972-11-07 | 1974-07-02 | ||
| JPS49121968A (de) * | 1973-03-30 | 1974-11-21 |
-
1979
- 1979-05-18 JP JP6055579A patent/JPS55153393A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4725885U (de) * | 1971-04-19 | 1972-11-22 | ||
| JPS4936941A (de) * | 1972-08-24 | 1974-04-05 | ||
| JPS4943160A (de) * | 1972-09-01 | 1974-04-23 | ||
| JPS4968266A (de) * | 1972-11-07 | 1974-07-02 | ||
| JPS49121968A (de) * | 1973-03-30 | 1974-11-21 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115722A (ja) * | 2005-10-17 | 2007-05-10 | Tdk Corp | 可撓性配線板及び電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55153393A (en) | 1980-11-29 |
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