JPS63301535A - 半導体材料の接続方法及びそれに用いる接続材料 - Google Patents

半導体材料の接続方法及びそれに用いる接続材料

Info

Publication number
JPS63301535A
JPS63301535A JP62130595A JP13059587A JPS63301535A JP S63301535 A JPS63301535 A JP S63301535A JP 62130595 A JP62130595 A JP 62130595A JP 13059587 A JP13059587 A JP 13059587A JP S63301535 A JPS63301535 A JP S63301535A
Authority
JP
Japan
Prior art keywords
ball
wire
alloy wire
semiconductor material
bump electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62130595A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0465534B2 (enrdf_load_stackoverflow
Inventor
Toshinori Kogashiwa
俊典 小柏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP62130595A priority Critical patent/JPS63301535A/ja
Priority to GB8800518A priority patent/GB2201545B/en
Publication of JPS63301535A publication Critical patent/JPS63301535A/ja
Publication of JPH0465534B2 publication Critical patent/JPH0465534B2/ja
Priority to US07/970,232 priority patent/US5384090A/en
Priority to US08/315,575 priority patent/US5514334A/en
Priority to US08/315,577 priority patent/US5514912A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP62130595A 1987-01-30 1987-05-27 半導体材料の接続方法及びそれに用いる接続材料 Granted JPS63301535A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62130595A JPS63301535A (ja) 1987-01-30 1987-05-27 半導体材料の接続方法及びそれに用いる接続材料
GB8800518A GB2201545B (en) 1987-01-30 1988-01-11 Method for connecting semiconductor material
US07/970,232 US5384090A (en) 1987-01-30 1992-10-30 Fine wire for forming bump electrodes using a wire bonder
US08/315,575 US5514334A (en) 1987-01-30 1994-09-30 Fine lead alloy wire for forming bump electrodes
US08/315,577 US5514912A (en) 1987-01-30 1994-09-30 Method for connecting semiconductor material and semiconductor device used in connecting method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2120287 1987-01-30
JP62-21202 1987-01-30
JP62130595A JPS63301535A (ja) 1987-01-30 1987-05-27 半導体材料の接続方法及びそれに用いる接続材料

Publications (2)

Publication Number Publication Date
JPS63301535A true JPS63301535A (ja) 1988-12-08
JPH0465534B2 JPH0465534B2 (enrdf_load_stackoverflow) 1992-10-20

Family

ID=26358236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62130595A Granted JPS63301535A (ja) 1987-01-30 1987-05-27 半導体材料の接続方法及びそれに用いる接続材料

Country Status (1)

Country Link
JP (1) JPS63301535A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04299544A (ja) * 1991-03-28 1992-10-22 Nec Corp フィルムキャリヤ半導体装置の製造方法
US5366692A (en) * 1989-12-27 1994-11-22 Tanaka Denshi Kogyo Kabushiki Kaisha Alloy connecting materials for semiconductors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366692A (en) * 1989-12-27 1994-11-22 Tanaka Denshi Kogyo Kabushiki Kaisha Alloy connecting materials for semiconductors
US5550407A (en) * 1989-12-27 1996-08-27 Tanaka Denshi Kogyo Kabushiki Kaisha Semiconductor device having an aluminum alloy wiring line
JPH04299544A (ja) * 1991-03-28 1992-10-22 Nec Corp フィルムキャリヤ半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0465534B2 (enrdf_load_stackoverflow) 1992-10-20

Similar Documents

Publication Publication Date Title
US5514912A (en) Method for connecting semiconductor material and semiconductor device used in connecting method
EP0435009B1 (en) Semiconductor package connecting method and semiconductor package connecting wires
US7021521B2 (en) Bump connection and method and apparatus for forming said connection
TW200425364A (en) Dual metal stud bumping for flip chip applications
JPH10118783A (ja) 半田材料及びそれを用いた電子部品
JP5165810B1 (ja) 銀金パラジウム系合金バンプワイヤ
JP2004014884A (ja) ボンディングワイヤー
JP2737953B2 (ja) 金バンプ用金合金細線
TW200409332A (en) Semiconductor device
JPS63301535A (ja) 半導体材料の接続方法及びそれに用いる接続材料
JP2993660B2 (ja) ボンディングワイヤ
EP0288776A2 (en) Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad
EP1811556A1 (en) Wire bump material
JPH03291340A (ja) 半導体装置用銅合金極細線及び半導体装置
JPH061779B2 (ja) 半導体装置の製造方法
JP3091076B2 (ja) バンプ用微小金ボール
JPS63168031A (ja) 半導体装置
JP3689234B2 (ja) バンプ用微小金ボールおよび半導体装置
JP3086126B2 (ja) バンプ用微小金ボール
JPS63168037A (ja) 半導体材料の接続方法
JP2824302B2 (ja) 半田ボールの形成方法
JPH02251155A (ja) 半導体素子用金合金細線及びその接合方法
JP4713149B2 (ja) 半導体装置
JPH07122564A (ja) バンプ形成方法
JP2911005B2 (ja) バンプ電極の処理方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071020

Year of fee payment: 15