JPS63297585A - Manufacture of nickel stamper - Google Patents

Abstract

PURPOSE:To manufacture a high-quality nickel stamper, by forming a metallic film on the rear of a glass substrate with high adhesive strength, by forming a pre-grouped pattern and a conductive film on the surface of the above film, and then by applying nickel plating to the above so as to prevent the warpage of the substrate. CONSTITUTION:A metallic film is arranged and formed on the rear of a glass substrate. It is preferable that this metallic film is formed of a deposited metal of 5,000-20,000Angstrom thickness prepared by plating or a metal plate prepared by forging. Subsequently, a resist is applied to the surface of the above glass substrate and, by an etching technique, a pre-grouped pattern reaching the glass substrate is formed. Then, a conductive film is formed on the above, and, by using this conductive film as a cathode, nickel plating is applied. Owing to the above-mentioned metallic film, the warpages of the glass substrate and the plated surface at the conclusion of plating are prevented, so that a high- quality nickel stamper free from distortion can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a nickel stamper related to a CD stamper, etc. of the present invention.

[Summary of the invention]

The present invention relates to a method for manufacturing a nickel stamper related to a CD stamper, etc., in which a metal film is disposed on the back surface of a glass substrate, and after the formation, a pre-group pattern is formed on the glass substrate, and a conductive film is further formed. Further, nickel plating is performed using the glass substrate as a cathode to form a nickel stamper, but by placing a metal film on the back side of the glass substrate and forming it with good adhesion, the glass substrate can be plated due to the difference in hot water temperature during plating. It absorbs the warpage of the glass substrate and the warpage of the glass substrate caused by plating precipitation stress, and prevents distortion caused by the warp of the glass substrate and nickel stamper when plating is completed, making it possible to obtain high quality stamps. This is what I did.

[Conventional technology]

The conventional manufacturing method for nickel stans (as is well known, photon cysts are deposited on a flattened glass substrate after coat-rebaking, followed by exposure recording with laser light, development, post-baking, and then a conductive film. This was a manufacturing method in which a steel sheet was formed, mounted on an electroforming device, electroformed with nickel, then the back surface was polished and cleaned, and the specified inner and outer diameters were machined to create the stamp/dimensions.

[Problem that the invention seeks to solve]

However, with conventional technology, the method of plating only one side (surface) of the glass substrate makes it impossible to absorb the warpage of the glass substrate caused by the difference between the temperature of the plating solution and the temperature in the atmosphere. Stanno with the glass substrate attached (
During back polishing, the stamper thickness variation was increased.In addition, the glass substrate was warped and distorted due to plating precipitation stress, making it difficult to control the stamper thickness during back polishing and reducing the quality of the stamper. causing a decline,
Furthermore, there is a problem in that the quality of the disc is also degraded.

Therefore, the present invention aims to solve these problems.
The purpose of this is to prevent the warping of the glass substrate caused by plating and the warping and distortion of the stamper due to plating precipitation stress, and to produce a high-quality stamper with less variation in stamper thickness and without distortion. It's there to provide.

Means for Solving Problem C] The method for manufacturing a nickel stamper of the present invention involves coating a glass substrate with a resist, forming a pre-group pattern that reaches the glass substrate using an etching technique, and then depositing a conductive film on the pre-group pattern. Next, the conductive film is plated with nickel as [i], and in the step of forming a nickel stamper, a metal film is placed on the back surface of the glass substrate, and after the formation, a pregroup pattern is formed with the glass substrate. After the formation, a conductive film is formed thereon, and nickel plating is performed using the conductive film as a cathode to form a stamper. That is, a deposited metal by plating or a metal film by forging is placed on the back surface of the glass substrate to a thickness of 5,000 λ to 20,000 λ,
After forming a pre-group pattern on the glass substrate, a conductive film is formed on the pre-group pattern, and nickel plating is performed using the Sta film as a cathode. The warpage of the glass substrate is absorbed by the strength of the metal, preventing warpage, and furthermore, warping and warping due to plating precipitation stress is also prevented.

[Effect]

According to the above structure of the present invention, the strength of the metal film strongly adhered to the back surface of the glass substrate prevents warpage caused by temperature differences in the glass substrate by wrapping the glass substrate in metal, and furthermore, plating precipitation is prevented. It can also prevent distortion and warping due to stress, and also plays a role in protecting the glass substrate.

[Example-1] Figure 1 is a flowchart in an example of the present invention, in which the surface of a glass substrate whose surface has been polished and made flat is covered with a protective mask using masking tape for plating. , prevents plating precipitation (℃). Next, the glass substrate was subjected to plating pretreatment.

Me! The pretreatment process is 1. Arshika 1 no moon removal, 2° water washing, 3. i! 2. Neutralization, 4. Washing with water, 5. Washing with water, 6. Tin treatment (using HC1-2% stannous chloride solution), 7. Washing with water, 8. Palladium treatment (uses Left Schumer 5th harmonic wave sold by Nippon Kanigen), 9. Washed with water. Next is the electroless nickel plating solution released by Nippon Kanigen, Schumer 5680.
Then, electroless nickel plating was applied to a thickness of 10,000 coats. The treatment conditions for electroless nickel plating were as follows: 4 minutes of immersion at a liquid temperature of 50@C at a concentration specified by the manufacturer, washing with water, and then drying. Next, remove the masking tape from the surface of the metallized glass substrate on the back side,
After cleaning with an organic solvent, the glass substrate was washed with an alkali, washed with water, neutralized with an acid, washed with water (washed with pure water), water wettability was confirmed, and water was drained by blowing with nitrogen. Next, the glass substrate was subjected to substrate beta at 120'C for 30 minutes in a drying oven. Next, a resist coat (AZ1350) was applied to a thickness of 1100 mm using a spin code method. Next, the substrate was soft baked at 90° C. for 80 minutes. After cooling, it was set in a cutting machine and information was recorded. Next, a resist was developed using a development machine, and after thorough washing with water, post-baking was performed at 120° C. for 30 minutes using a drying oven. This glass substrate was mounted on a suvafuta device and nickel was sputtered to a thickness of 700 mm. Next, the substrate placed in the electroforming apparatus was heated and nickel plated using the nickel sputtered film as a cathode to obtain an electroformed layer with a thickness of 300 μm. Next, the back surface was polished to obtain a stan/f thickness of 290 μm. Furthermore, the inner and outer diameters were processed and used as a stamper.

[Example 2] A pure 20,000-meter-thick piece of pure 20,000-layer paper was placed on the back side of a glass substrate whose surface had been polished and bound flat in the same manner as in Example 1.
It was applied uniformly using an IW agent. The adhesive used for pasting was a U■ hardening type adhesive. Next, the glass substrate with metal was thoroughly cleaned and made into a cloth with good wettability. Furthermore, in the process based on Example-1, a stamper was manufactured and a predetermined stamper was subjected to a post-process.

〔Effect of the invention〕

As described above, according to the invention, in the step of forming a nickel stamper by performing nickel plating on a pre-group pattern formed on a glass substrate, a metal film is arranged and formed on the back surface of the glass substrate, and then the glass After forming a pre-group pattern with the substrate, a four-electrode film is formed on the pre-group pattern, and then the 41! By performing nickel plating using the chemical film as a cathode and forming a nickel stamper while preventing warping of the glass substrate due to stress strain created in the plating, 1. It becomes easier to control the thickness of the stamper during back polishing.

2. A stamper without distortion or warping can be obtained,
This can contribute to high-quality discs.

The above effects exist.

[Brief explanation of drawings]

Figure tJ1 is a process flowchart showing an embodiment of the method for manufacturing a nickel stamper of the present invention. ￥E2 Figure is a process flowchart showing a conventional method for manufacturing a nickel stamper. that's all

Claims (2)

[Claims] (1) After applying a resist to a glass substrate and forming a pre-group pattern that reaches the glass substrate using etching technology,
A conductive film is formed on this, and then nickel plating is performed using the conductive film as a cathode. In the process of forming a nickel stamper, a metal film is placed on the back surface of the glass substrate, and after the formation. A method for manufacturing a nickel stamper, comprising forming a pregroup pattern on the glass substrate, forming a conductive film thereon, and further performing nickel plating using the conductive film as a cathode to form a stamper. . (2) The thickness of the metal film is 5000 Å to 2
2. The method for manufacturing a nickel stamper according to claim 1, wherein the stamper is either a deposited metal by plating with a thickness of 0,000 Å or a metal plate by forging.