JPS63293995A - Printed wiring board for surface mounting - Google Patents

Printed wiring board for surface mounting

Info

Publication number
JPS63293995A
JPS63293995A JP13040087A JP13040087A JPS63293995A JP S63293995 A JPS63293995 A JP S63293995A JP 13040087 A JP13040087 A JP 13040087A JP 13040087 A JP13040087 A JP 13040087A JP S63293995 A JPS63293995 A JP S63293995A
Authority
JP
Japan
Prior art keywords
solder
surface mounting
printed wiring
wiring board
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13040087A
Other languages
Japanese (ja)
Inventor
Takeshi Yamada
武志 山田
Hidehiko Murakami
秀彦 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP13040087A priority Critical patent/JPS63293995A/en
Publication of JPS63293995A publication Critical patent/JPS63293995A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To form solder protuberances at least two positions, and to inhibit the displacement of a surface mounting part on mounting by dividing a pad into a section, on which solder is applied, and a section, on which solder is not applied, in a printed wiring board for surface mounting. CONSTITUTION:Terminals 11 for a surface mounting part 10 are placed at specified positions on pads 12 with sections 13, on which solder is applied, and sections 14, on which solder is not applied and from which conductors are exposed. Consequently, one terminals 11 are not moved because they are supported under a stable state by two or more of solder protuberances 13. The terminals 11 for the surface mounting part 10 and the pads 12 are connected with solder by charging a substrate, on which the surface mounting part 10 is arranged, in solder melting environment, and excess solder flows into the sections 14 from which the conductors are exposed. Accordingly, the terminals 11 for the surface mounting parts 10 and the pads 12 can be connected positively, and short circuits among the pads 12 due to excess solder can also be prevented.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、プリント配線板に関し、特に表面実装部品を
搭載するためのバットを有する表面実装用プリント配線
板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board, and more particularly to a surface mounting printed wiring board having a butt for mounting surface mount components.

（従来の技術） 第１図に示すように１表面実装部品（１）が搭載される
プリント配線板（２）側にあっては、表面実装部品（１
）を搭載するためのパッド（３）が、表面実装部品（１
）の各端子（４）に対して形成されている。また、表面
実装部品（１）を上記基板（２）に実装する際、確実に
実装できるように、上記基板（２）のパッド（３）表面
に、あらかじめ半田を塗布しておく必要がある。しかし
、第２図のバット（３）部分の断面に示されたごとく、
半田の表面張力の為、パッド（３）表面の半田（５）は
山なり状となり１表面実装部品を上記パッド（３）に載
せた際、各端子（４）は山なり状に半田か塗布されたパ
ッド（３）に対しその頂点（６）で接することになり、
表面実装部品（１）の安定度が極めて悪い。その結果、
第３図に示されるがごとく、表面実装基板（２）上の実
装部品（１）が移動して、他バッドと短絡するという問
題があった。(Prior Art) As shown in Fig. 1, on the printed wiring board (2) side on which one surface mount component (1) is mounted,
) is used to mount a surface mount component (1).
) is formed for each terminal (4). Furthermore, when mounting the surface mount component (1) on the substrate (2), it is necessary to apply solder in advance to the surface of the pad (3) of the substrate (2) in order to ensure the mounting. However, as shown in the cross section of the butt (3) in Figure 2,
Due to the surface tension of the solder, the solder (5) on the surface of the pad (3) forms a mountain, and when a surface mount component is placed on the pad (3), each terminal (4) is coated with solder in a mountain shape. The vertex (6) will touch the pad (3) that was
The stability of the surface mount component (1) is extremely poor. the result,
As shown in FIG. 3, there was a problem in that the mounted component (1) on the surface mount board (2) moved and shorted with other pads.

（本発明が解決しようとする問題点） 上述したように、従来の表面実装用プリント配線板（２
）にあっては１表面実装部品（１）を実装する際、上記
プリント配線板（２）のバット（３）部分の半田（５）
か、第２図に示されるように、山なり状になっており、
表面実装部品（１）の各端子（４）との接触面積か小さ
く上記基板（２）上に配置された表面実装部品（１）の
安定度が悪い。その結果、第３図に示されるがごとく、
表面実装基板（２）上の実装部品（１）が移動して、他
パッドと短絡するという問題があった。(Problems to be Solved by the Present Invention) As mentioned above, the conventional printed wiring board for surface mounting (2
), when mounting the surface mount component (1), solder (5) on the butt (3) of the printed wiring board (2)
Or, as shown in Figure 2, it is shaped like a mountain,
The contact area of the surface mount component (1) with each terminal (4) is small, and the stability of the surface mount component (1) placed on the substrate (2) is poor. As a result, as shown in Figure 3,
There is a problem in that the mounted component (1) on the surface mount board (2) moves and short-circuits with other pads.

（問題点を解決するための手段） 以上の問題点を解決するために本発明が採った手段は、
従来の表面実装用プリント配線板上の半田付バッドか、
表面実装部品の端子１つに対して１つの点あるいは線、
あるいは面でささえたのに対し、本発明に係る表面実装
用プリント配線板ではバットを半田を塗布した部分と、
半田を塗布しない部分とに分ける事によって、少なくと
も二箇所に半田の隆起を形成し、上記端子１つに対し、
複数筒の点あるいは線、あるいは面でささえることによ
り、実装時の表面実装部品のズレを抑えようというもの
である。(Means for solving the problems) The means taken by the present invention to solve the above problems are as follows:
Soldering pads on conventional surface mount printed wiring boards,
One point or line for each terminal of surface mount components,
Alternatively, in the surface mount printed wiring board according to the present invention, the bat is supported by a part coated with solder,
By dividing the solder into parts that are not applied with solder, solder bumps are formed in at least two places, and for each terminal,
By supporting the tubes with points, lines, or planes, it is possible to suppress misalignment of surface-mounted components during mounting.

本発明において、その少なくとも二箇所に半田の隆起を
形成することは、第８図〜第１０図に示すように、中央
一箇所、もしくは、中央左右両方向等に、半田を塗布し
ない部分を形成することを意味し、そのためにこのよう
に半田を塗布しない部分が一箇所であってもよいし、あ
るいは複数個所あってもよいのである。In the present invention, forming solder bumps at at least two locations means forming a portion where solder is not applied at one location in the center or in both left and right directions of the center, as shown in FIGS. 8 to 10. This means that, for this reason, there may be only one portion where solder is not applied, or there may be multiple portions.

（発明の作用） 本発明が以上のような手段を採ることによって以下のよ
うな作用がある。(Actions of the Invention) By adopting the above-described measures, the present invention has the following effects.

本発明に係る表面実装用プリント配線板にあっては、前
記基板上に形成されたバッドからの表面実装部品端子の
移動が抑えられることにより、他バッドとの短絡、及び
表面実装部品端子の接続不良が防止され、確実な表面実
装が現実可能となったのである。In the surface mount printed wiring board according to the present invention, movement of the surface mount component terminals from the pads formed on the board is suppressed, thereby preventing short circuits with other pads and connection of the surface mount component terminals. Defects were prevented and reliable surface mounting became a reality.

また、半田付は工程で発生する余分な半田は、バッド上
の半田を塗布しない部分に流れ込むため、半田流れによ
る他氏線との短絡を防止することか可能となったのであ
る。Additionally, excess solder generated during the soldering process flows into the parts of the pad where solder is not applied, making it possible to prevent short circuits with other wires due to solder flow.

（実施例） 本発明の実施例を第４図〜第７図により説明する。第４
図に示す様に、本発明による表面実装用プリント配線板
は、絶縁基板（７）の表面に配線用の銅箔パターン（８
）を形成し、これに実装する表面実装部品（１０）の端
子（ｉｔ）が当る位置に、バッド（１２）を設ける。バ
ッド（１２）上には、第５図に示すように、半田（１３
）が塗布される。この半田（１３）は、第６図に示すよ
うに、バッド上で導体を露出させる部分にマスク（１５
）を設け、その後第７図に示す様に、半田（１３）を塗
布する。このようにして作成したプリント配線板（７）
よりマスク（１５）を除去したものか、本発明に係る表
面実装用プリント配線板である。(Example) An example of the present invention will be described with reference to FIGS. 4 to 7. Fourth
As shown in the figure, the printed wiring board for surface mounting according to the present invention has a copper foil pattern (8) for wiring on the surface of an insulating substrate (7).
), and a pad (12) is provided at a position where the terminal (it) of the surface mount component (10) to be mounted on the pad contacts. As shown in Figure 5, solder (13) is placed on the pad (12).
) is applied. This solder (13) is applied to the mask (15) on the part where the conductor is exposed on the pad, as shown in FIG.
), and then solder (13) is applied as shown in FIG. Printed wiring board created in this way (7)
This is the printed wiring board for surface mounting according to the present invention, with the mask (15) removed.

次に、作成された本発明に係る表面実装用プリント配線
板に表面実装部品を設置および半田付けによる実装時の
動作について説明する。Next, a description will be given of operations when installing and soldering surface mount components on the produced surface mount printed wiring board according to the present invention.

表面実装部品（１０）を、半田を塗布した部分（１３）
と、半田を塗布しないで導体が露出した部分（１４）を
有する本発明に係るバッド（１２）上に、端子（ｉｌ）
を所定の位置にのせる。第５図に示すように、１つの端
子（１１）は、２つ以上の半田の隆起（１３）で安定し
た状態てささえられるので、移動することはない。Surface mount component (10) with solder applied part (13)
and a terminal (il) on the pad (12) according to the present invention having a portion (14) where the conductor is exposed without applying solder.
Place it in place. As shown in FIG. 5, one terminal (11) is stably supported by two or more solder bumps (13), so it does not move.

次に、表面実装部品（１０）を配置した基板を、半田溶
融環境に投入することによって、表面実装部品（ｌＯ）
の端子（１１）とバッド（１２）を半田により接続する
。ここで、余分な半田は、バット（１２）の半田を塗布
しないで導体が露出した部分（１４）に流れ込む。Next, by putting the board on which the surface mount component (10) is placed into a solder melting environment, the surface mount component (10) is
Connect the terminal (11) and the pad (12) with solder. Here, the excess solder flows into the portion (14) of the bat (12) where the conductor is exposed without applying solder.

以上のように、表面実装部品（１０）がずれることなく
かつ、余分な半田がバッド外に流れ出ることのない表面
実装部品の実装が可能となり、よって表面実装部品（ｌ
Ｏ）の端子（１１）とバッド（１２）とを確実に接続す
ることができ、余分な半田によるバッド（１２）間の短
絡も防止することができる。As described above, it is possible to mount the surface mount component (10) without shifting the surface mount component (10) and without causing excess solder to flow out of the pad.
The terminal (11) of O) and the pad (12) can be reliably connected, and a short circuit between the pads (12) due to excess solder can also be prevented.

なお、上述の実施例では、中心部に半田を塗布しないで
導体が露出した部分（１４）を有した形状のバッド（１
２）を例に説明したが、第８図〜第１０図に示した形状
を含む他の形状を有したバッドや、例えば部品搭載方向
を確認することもできる少なくとも１つのバッドにのみ
、この形状を変えたものを避用できることは言うまでも
ない。In addition, in the above-mentioned embodiment, the pad (1
2) has been explained as an example, but this shape is applicable only to pads having other shapes including those shown in FIGS. It goes without saying that you can avoid using a modified version.

また、１つの部品に対するバッドが複数個ある場合には
、必要に応じてこの形状を適用するパットの数を決めれ
ば良いことも言うまでもないことである。Furthermore, it goes without saying that if there are a plurality of pads for one component, the number of pads to which this shape is applied can be determined as necessary.

（発明の、効果） 以上説明した通り、本発明に係る表面実装用プリント配
線板にあっては、前記基板上に形成されたバッドからの
表面実装部品端子の移動が抑えられることにより、他バ
ッドとの短絡、及び表面実装部品端子の接続不良が防止
され、確実な表面実装を実現できる。(Effects of the Invention) As explained above, in the surface mount printed wiring board according to the present invention, movement of the surface mount component terminals from the pads formed on the board is suppressed, so that other pads This prevents short circuits and poor connections between surface mount component terminals, making it possible to achieve reliable surface mounting.

また、半田付は工程で発生する余分な半田は、バッド上
の半田を塗布しない部分に流れ込むため、半田流れによ
る他配線との短絡を防止することができる。Further, excess solder generated during the soldering process flows into the portions of the pad where no solder is applied, so short circuits with other wiring due to solder flow can be prevented.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図〜第３図は従来のものを示す図であワて、第１図
は表面実装部品が表面実装用プリント配線板上に実装さ
れる様子を示した斜視図、第２図はバッドの部分拡大断
面図、第３図は表面実装部品を実装した部分拡大平面図
である。 第４図〜第１θ図は本発明に係るものを示す図であって
、第４図は本発明の表面実装用プリント配線板に表面実
装部品を実装した部分拡大平面図、第５図は第４図点線
（１６）上での断面図、第°６図及び第７図は本発明の
半田を塗布した部分と半田を塗布しないで導体を露出し
た部分を有するバッドを形成する為の方法を示す図、第
８図〜第１０図のそれぞれは本発明のその他の実施例を
示すバッドの拡大平面図である。 符　　　号　　　の　　　説　　　明 １１・・・空洞、１２・・・バッド、２０−・・表面実
装用プリント配線板。 以　　　上Figures 1 to 3 are diagrams showing the conventional type, and Figure 1 is a perspective view showing how surface mount components are mounted on a surface mount printed wiring board, and Figure 2 is a board FIG. 3 is a partially enlarged sectional view of FIG. FIG. 4 to FIG. 1θ are diagrams showing things according to the present invention, in which FIG. 4 is a partially enlarged plan view of a surface mount component mounted on the surface mount printed wiring board of the present invention, and FIG. Figure 4 is a cross-sectional view taken along the dotted line (16), and Figures 6 and 7 illustrate a method for forming a pad having a solder-applied part and an exposed conductor part without applying solder according to the present invention. Each of the figures shown in FIGS. 8 to 10 is an enlarged plan view of a pad showing other embodiments of the present invention. Explanation of symbols 11--Cavity, 12--Bud, 20--Surface mounting printed wiring board. that's all

Claims (1)

【特許請求の範囲】 搭載すべき表面実装用部品の端子が、半田によって接続
されるパッドを有するプリント配線板において、 前記パッドが半田を塗布した部分と、半田を塗布しない
部分とを有するものとしたことを特徴とする表面実装用
プリント配線板。[Scope of Claims] A printed wiring board having a pad to which a terminal of a surface mount component to be mounted is connected by solder, wherein the pad has a part coated with solder and a part not coated with solder. A printed wiring board for surface mounting, which is characterized by:
JP13040087A 1987-05-27 1987-05-27 Printed wiring board for surface mounting Pending JPS63293995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13040087A JPS63293995A (en) 1987-05-27 1987-05-27 Printed wiring board for surface mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13040087A JPS63293995A (en) 1987-05-27 1987-05-27 Printed wiring board for surface mounting

Publications (1)

Publication Number Publication Date
JPS63293995A true JPS63293995A (en) 1988-11-30

Family

ID=15033390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13040087A Pending JPS63293995A (en) 1987-05-27 1987-05-27 Printed wiring board for surface mounting

Country Status (1)

Country Link
JP (1) JPS63293995A (en)

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