JPS63290938A - Bending test method for flexible printed wiring board - Google Patents
Bending test method for flexible printed wiring boardInfo
- Publication number
- JPS63290938A JPS63290938A JP62125182A JP12518287A JPS63290938A JP S63290938 A JPS63290938 A JP S63290938A JP 62125182 A JP62125182 A JP 62125182A JP 12518287 A JP12518287 A JP 12518287A JP S63290938 A JPS63290938 A JP S63290938A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- bending
- bending test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 title claims abstract description 34
- 238000010998 test method Methods 0.000 title claims description 8
- 230000033001 locomotion Effects 0.000 abstract description 10
- 230000003252 repetitive effect Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000013519 translation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
この発明は、磁気記録装置等における可動部分の電気的
接続に用いられろフレキシブルプリント配線板に係わり
、特に、その繰り返し屈曲に対する寿命を測定するフレ
キシブルプリント配線板の屈曲試験方法に関する。[Detailed Description of the Invention] "Industrial Application Field" This invention relates to flexible printed wiring boards used for electrical connection of movable parts in magnetic recording devices, etc., and in particular, to measuring the lifespan of the flexible printed wiring boards against repeated bending. This invention relates to a bending test method for flexible printed wiring boards.
「従来の技術」
従来、フレキシブルプリント配線板の屈曲試験方法とし
て、ｒｐｃ（米国プリント
とＭ＋４’（ＪＩＳ−Ｐ−８１ １５）法が知られテｔ
）ＩＰＣ法は、第７図に示すように、平行に配置された
固定板１と移動板２との間にフレキノプルプリント配線
板３を固定し、移動板２を矢印Ｙ１方向へ往復平行移動
させて屈曲試験を行う。この屈曲試験は自由曲げ形態で
あり、フレギノブルプリント配線板３０曲率半径ｒは固
定板１と移動板２との間の距離によって設定される。"Prior Art" Conventionally, the RPC (American Print and M+4' (JIS-P-81 15) method) has been known as a bending test method for flexible printed wiring boards.
) In the IPC method, as shown in Fig. 7, a flexible printed wiring board 3 is fixed between a fixed plate 1 and a movable plate 2 arranged in parallel, and the movable plate 2 is moved back and forth in parallel in the direction of arrow Y1. Move and perform a bending test. This bending test is a free bending test, and the radius of curvature r of the flexible printed wiring board 30 is set by the distance between the fixed plate 1 and the movable plate 2.
ＭＩＴ法は、第８図に示すように、先端部にアールが形
成された２個の固定ダイス５．６によってフレキシブル
プリント配線板３を挾持し、一定の張力Ｆをフレギノブ
ルプリンＩ・配線板３にか（Ｊた状態で、固定ダイス５
．６を矢印Ｙ２のよう７こ揺動させて屈曲試験を行う。In the MIT method, as shown in Fig. 8, a flexible printed wiring board 3 is held between two fixed dies 5 and 6 each having a rounded tip, and a constant tension F is applied to the flexible printed circuit board I and the wiring. Fixed die 5 on board 3 (in J state)
．． 6 is swung seven times as shown by arrow Y2 to conduct a bending test.
この屈曲試験は、フレキノプルプリント配線板３が張力
Ｆによって固定ダイス５または６に密着する強制曲げ形
態である。This bending test is a forced bending mode in which the flexible printed wiring board 3 is brought into close contact with the fixed die 5 or 6 by the tension F.
いずれの方法も、試料のフレキシブルプリント配線板３
の曲げの加イっる部分の回路をループさ且、微電流を流
した状態で試験を実施し、屈曲により通電回路にクラッ
クか生じ、断線するまでの屈曲回数をカウントするもの
である。In either method, the sample flexible printed wiring board 3
The test is carried out by looping the circuit in the part where the bending occurs and applying a small current, and counting the number of bends until the energized circuit cracks and breaks due to bending.
［発明が解決しようとする問題点」
ところで、」−述したＭＩＴ法は、荷重のかかった状態
でのフレキノプルプリント配線板の特性評価を与えるが
、荷重をか１」ない現実の使用状態との相関性を係数値
化することができない。一方、ＩＰＣ法は、自由曲げ形
態で用いられるプリンタヘット等に代表される中・低速
の屈曲動作用のフレキンプルプリント配線板の多用さイ
１ているが、高速動作に対する屈曲試験法としては次の
問題がある。[Problems to be Solved by the Invention] By the way, the MIT method described above evaluates the characteristics of a flexible printed wiring board under a load, but it cannot be used in actual usage conditions without any load. It is not possible to convert the correlation with the coefficient into a coefficient value. On the other hand, the IPC method makes extensive use of flexible printed wiring boards for medium- to low-speed bending motions, such as printer heads used in free bending mode1, but as a bending test method for high-speed motions, the following There is a problem.
■屈曲部分全体に屈曲−平坦の繰り返しを行おうとした
場合、第９図に示すように、平行移動幅を設定した曲率
ｒに対して２πｒ以」二とすることが必要となる。オな
イつち、曲率の設定から平行移動幅か制約を受け、また
、平行移動幅もかなり大きくなる。(2) When attempting to repeat bending and flattening over the entire bent portion, as shown in FIG. 9, it is necessary to set the translation width to 2πr or more with respect to the set curvature r. On the other hand, the translation width is constrained by the curvature setting, and the translation width also becomes quite large.
■高速において平行移動幅を大きくとるごとは、従来の
ＩＰＣ試験機の動作原理では機構上の限界かある。■Increasing the width of parallel movement at high speeds may be due to mechanical limitations of the operating principles of conventional IPC testing machines.
この発明は上述した事情に鑑みてなされたもので、フレ
キノプルプリント配線板を高速で大きく変形させること
かでき、しかも、順方向／逆方向の曲げを同時に実施す
ることができるフレキシブルプリント配線板の屈曲試験
方法を提供することを目的としている。This invention was made in view of the above-mentioned circumstances, and is a flexible printed wiring board that can greatly deform a flexible printed wiring board at high speed, and can also be bent in forward and reverse directions at the same time. The purpose of this study is to provide a bending test method.
１問題点を解決するための手段」
この発明は、フレキソプルプリント配線板の長手方向に
繰り返し圧縮荷重を加えることを特徴としている。1. Means for Solving Problem 1 The present invention is characterized in that a compressive load is applied repeatedly in the longitudinal direction of a flexo-pulled printed wiring board.
「実施例」
以下、図面を参照してこの発明の一実施例について説明
する。第１図は同実施例による方法を説明するための概
略構成図であり、この図において、３はフレキシブルプ
リント配線板、８はこのフレキシブルプリント配線板３
の一部を装置の固定部に固定する固定ホルダ、９はフレ
キノプルプリント配線板３の他の一部が下面に取り付（
プられ、配線板３が取り付けられた状態で矢印Ｙ３方向
に往復運動をする移動ホルダである。"Embodiment" Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic configuration diagram for explaining the method according to the same embodiment. In this figure, 3 is a flexible printed wiring board, and 8 is this flexible printed wiring board 3.
A fixed holder 9 fixes a part of the flexible printed wiring board 3 to a fixed part of the device;
This is a movable holder that reciprocates in the direction of arrow Y3 with the wiring board 3 attached.
このような構成において、移動ホルダ９を矢印Ｙ３方向
へ往復運動させろと、固定ホルダ８．移動ボルダ９間の
フレキシブルプリント配線板３が屈曲運動を行う。この
際に、フレキノプルプリント配線板３の屈曲部分に形成
されている回路パターンの抵抗値を測定し、その抵抗値
が高抵抗側へ大きく変化した時、断線と判断する。移動
ホルダ９が往復運動を開始した時点からこの断線時まで
の往復運動の回数がフレキノプルプリント配線板３の屈
曲特性を示している。第２図は、回路〕（ターンの抵抗
値の変化の一例を示す図であり、この図に示す点Ｐにお
いて断線と判断される。In such a configuration, fixed holders 8 . The flexible printed wiring board 3 between the movable boulders 9 performs a bending motion. At this time, the resistance value of the circuit pattern formed on the bent portion of the flexible printed wiring board 3 is measured, and when the resistance value changes significantly to the high resistance side, it is determined that the wire is disconnected. The number of reciprocating movements from the time when the movable holder 9 starts its reciprocating movement until the time of this disconnection indicates the bending characteristics of the flexible printed wiring board 3. FIG. 2 is a diagram showing an example of a change in the resistance value of a circuit (turn), and a disconnection is determined at point P shown in this diagram.
しかして、」二記の試験方法によれば、従来のＩＰＣ法
に比較し、フレキシブルプリント配線板３を小さなスト
ロークで大きく変形させることができる。また、配線板
３に順方向／逆方向の曲げを同時に加えることができる
。すなわち、第３図において、部分Ａは−１−面に引張
力か、下面に圧縮力が各々加わるか、部分Ｂ、Ｃは」−
面に圧縮力が、下面に引張力が各々加わる。この結果、
１回の試験でフレキンプルプリント配線板３の−１−而
（下面）に引張力および圧縮力の双方を加えることか可
能となる。According to the test method described in section 2, the flexible printed wiring board 3 can be significantly deformed with a small stroke compared to the conventional IPC method. Further, the wiring board 3 can be bent in the forward direction and in the reverse direction at the same time. That is, in Fig. 3, part A has tensile force applied to the -1- plane, compressive force is applied to the lower surface, and parts B and C are
A compressive force is applied to the surface, and a tensile force is applied to the bottom surface. As a result,
It is possible to apply both a tensile force and a compressive force to the -1- side (lower surface) of the flexible printed wiring board 3 in one test.
次に、上述した試験おいて、フレキシブルプリント配線
板３の曲率の設定は屈曲形態に近似する関数より求める
ことができる。すなわち、第４図において、フレキシブ
ルプリント配線板３」−の各点の曲率ρは、
なる式により与えられ、この時屈曲形態を、ｙ −（ｈ
／ ２ ）ｃｏｓ（２ｒｒ Ｘ／ρ）−−（２）に近似
させた場合、（１）式は次のようになる。Next, in the above-described test, the setting of the curvature of the flexible printed wiring board 3 can be determined from a function that approximates the bending form. That is, in FIG. 4, the curvature ρ at each point of the flexible printed wiring board 3'' is given by the following equation, and the bending form is defined as y − (h
/ 2 ) cos (2rr X/ρ) -- When approximated to (2), equation (1) becomes as follows.
ここで、フレキノプルプリント配線板に最大の歪を与え
る最小曲率Ｉρ（は、Ｘ＝０の時に実現される。すなわ
ち、（３）式より第４図のＱ点の最小曲率１ρｌ （Ｘ
・０）は、
１ρｌ （Ｘ・０）−ρ２／２πｈ・・・（４）により
与えられる。Here, the minimum curvature Iρ (that gives the maximum distortion to the flexinople printed wiring board) is realized when X = 0. In other words, from equation (3), the minimum curvature 1ρl (X
・0) is given by 1ρl (X・0)−ρ2/2πh (4).
また、実際に屈曲に係わるフレキノプルプリント配線板
の長さＬ （−ρ十△ρ）は、１．７４＝Ｓ“（Ｉ＋（
ｄＹ／ｄＸ）’）””ｄＸ・ （５）に近似し、ｌ
＋が和分にｇよりも小さければ、Ｌ−４Ｊ”（ｌ＋（１
／２）（πｈ／Ｑ）’ｓｉｎ’（２πｘ＃り）ｄＸ一ρ
（ト（πｈ／２ρ）２） ・・（６）と見なすことがで
きる。したがって、フレキシブルプリント配線板に（４
）式による変形を与えるために必要な長さ方向の移動量
△ρは次式により求まる。In addition, the length L (-ρ+△ρ) of the flexible printed wiring board that is actually related to bending is 1.74=S"(I+(
dY/dX)')""dX・ Approximate to (5), l
+ is smaller than g in sum, then L-4J”(l+(1
/2) (πh/Q)'sin'(2πx#ri)dX-ρ
((πh/2ρ)2) (6). Therefore, on the flexible printed wiring board (4
) The lengthwise movement amount Δρ required to give the deformation according to the equation is determined by the following equation.
△Ｑ＝ Ｌ−（！＝ （π２／４）（ｈ２／（り−−（
７）上記の展開に基づく曲率ρとＱ点の高さｈとの関係
を第５図に、高さｈとストローク△Ｑとの関係を第６図
に各々示す。△Q= L-(!= (π2/4)(h2/(ri--(
7) The relationship between the curvature ρ and the height h of point Q based on the above development is shown in FIG. 5, and the relationship between the height h and the stroke ΔQ is shown in FIG. 6.
以」二が、この発明の一実施例による屈曲試験方法であ
る。なお、上記の方法を適用した屈曲試験装置は、振動
発生機、振動出力アンプ、振動制御装置、試料取付ユニ
ット、固定ボルダ、移動ボルダ、抵抗測定器および測定
データ処理部を組ろ合イっせて構成する。The following is a bending test method according to an embodiment of the present invention. The bending test device to which the above method is applied is a combination of a vibration generator, a vibration output amplifier, a vibration control device, a sample mounting unit, a fixed boulder, a movable boulder, a resistance measuring device, and a measurement data processing section. Configure.
「発明の効果」
以Ｊ二説明したように、この発明によれば、フレキノプ
ルプリント配線板の長手方向に繰り返し圧縮荷重を加え
るようにしたので、次の効果を得ることができる。"Effects of the Invention" As explained below, according to the present invention, compressive loads are applied repeatedly in the longitudinal direction of the flexible printed wiring board, so that the following effects can be obtained.
■フレキンプルプリント配線板の屈曲寿命を、従来の方
法より、小さなストロークで試験することができ、この
結果、標準的な振動発生装置を用いて試験機を構成でき
、広い屈曲径の範囲に亙る試験を短時間で実施すること
が可能となる。■The bending life of flexible printed wiring boards can be tested with a smaller stroke than conventional methods. As a result, the test machine can be configured using a standard vibration generator and can be used over a wide range of bending diameters. It becomes possible to conduct the test in a short time.
■順方向／逆方向の双方の曲げを１回の試験で実施する
ことができろ。■Be able to perform both forward and reverse bending in one test.
■従来、曲率に比例して大きな移動が必要であった試験
を、歪量に比例した移動量で行うことが可能となり、高
速試験を小型の機器で行うことが゛可能となる。■Tests that conventionally required large movements in proportion to the curvature can now be performed with movements in proportion to the amount of strain, making it possible to perform high-speed tests with small equipment.
■フレキシブルプリント配線板の特定箇所に集中的な屈
曲を加えることが可能となる。■It is possible to apply concentrated bending to specific points on a flexible printed wiring board.
第１図はこの発明の一実施例による屈曲試験方−７＝
法を説明するための概略構成図、第２図は試験時間と回
路パターンの抵抗値との関係を示す図、第３図はフレキ
シブルプリント配線板３に加わる引張力および圧縮力を
説明するための図、第４図は曲率−スドロークー高さの
関係を説明するための図、第５図は曲率−高さの相関関
係を示すグラフ、第６図はストローク−高さの相関関係
を示すグラフ、第７図は従来のＩＰＣ法の説明図、第８
図は従来のＭｒＴ法の説明図、第９図はＩＰＣ法の問題
点を説明するための図である。
３ ・フレキノプルプリント配線板、８・・・・固定ボ
ルダ、９・・ ・移動ホルダ。Fig. 1 is a schematic configuration diagram for explaining the bending test method-7 according to an embodiment of the present invention, Fig. 2 is a diagram showing the relationship between test time and resistance value of a circuit pattern, and Fig. 3 is a diagram showing the relationship between test time and resistance value of a circuit pattern. FIG. 4 is a diagram for explaining the tensile force and compressive force applied to the flexible printed wiring board 3, FIG. 4 is a diagram for explaining the relationship between curvature and height, and FIG. 5 is a diagram showing the correlation between curvature and height. Graph, Figure 6 is a graph showing the stroke-height correlation, Figure 7 is an explanatory diagram of the conventional IPC method, Figure 8
The figure is a diagram for explaining the conventional MrT method, and FIG. 9 is a diagram for explaining the problems of the IPC method. 3 ・Flexible pull printed wiring board, 8...Fixed boulder, 9... ・Movable holder.
Claims (1)
荷重を加えることを特徴とするフレキシブルプリント配
線板の屈曲試験方法Flexible printed wiring board bending test method characterized by repeatedly applying a compressive load in the longitudinal direction of the flexible printed wiring board
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125182A JPH076900B2 (en) | 1987-05-22 | 1987-05-22 | Bending test method of flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125182A JPH076900B2 (en) | 1987-05-22 | 1987-05-22 | Bending test method of flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63290938A true JPS63290938A (en) | 1988-11-28 |
| JPH076900B2 JPH076900B2 (en) | 1995-01-30 |
Family
ID=14903929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62125182A Expired - Lifetime JPH076900B2 (en) | 1987-05-22 | 1987-05-22 | Bending test method of flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH076900B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0499943A2 (en) * | 1991-02-16 | 1992-08-26 | Daimler-Benz Aerospace Aktiengesellschaft | Apparatus for carrying out 4-point alternating bending stress tests |
| WO2014171247A1 (en) * | 2013-04-15 | 2014-10-23 | 旭硝子株式会社 | Bend-test method, sheet-article manufacturing method, bend-test device, brittle sheet, brittle sheet with element attached thereto, and electronic device |
| DE102016223900A1 (en) * | 2016-12-01 | 2018-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Measuring device for measuring the bending behavior of a sample |
| CN117148121A (en) * | 2023-10-31 | 2023-12-01 | 深圳市华旭达精密电路科技有限公司 | Flexible circuit board electrical measurement device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59142437A (en) * | 1983-02-02 | 1984-08-15 | Furukawa Electric Co Ltd:The | Bending test device of long object |
-
1987
- 1987-05-22 JP JP62125182A patent/JPH076900B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59142437A (en) * | 1983-02-02 | 1984-08-15 | Furukawa Electric Co Ltd:The | Bending test device of long object |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0499943A2 (en) * | 1991-02-16 | 1992-08-26 | Daimler-Benz Aerospace Aktiengesellschaft | Apparatus for carrying out 4-point alternating bending stress tests |
| WO2014171247A1 (en) * | 2013-04-15 | 2014-10-23 | 旭硝子株式会社 | Bend-test method, sheet-article manufacturing method, bend-test device, brittle sheet, brittle sheet with element attached thereto, and electronic device |
| CN105143848A (en) * | 2013-04-15 | 2015-12-09 | 旭硝子株式会社 | Bend-test method, sheet-article manufacturing method, bend-test device, brittle sheet, brittle sheet with element attached thereto, and electronic device |
| JPWO2014171247A1 (en) * | 2013-04-15 | 2017-02-23 | 旭硝子株式会社 | Bending test method, sheet manufacturing method, bending test apparatus, brittle sheet, brittle sheet with element, and electronic device |
| DE102016223900A1 (en) * | 2016-12-01 | 2018-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Measuring device for measuring the bending behavior of a sample |
| DE102016223900B4 (en) * | 2016-12-01 | 2018-12-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Measuring device for measuring the bending behavior of a sample |
| CN117148121A (en) * | 2023-10-31 | 2023-12-01 | 深圳市华旭达精密电路科技有限公司 | Flexible circuit board electrical measurement device |
| CN117148121B (en) * | 2023-10-31 | 2024-01-26 | 深圳市华旭达精密电路科技有限公司 | Flexible circuit board electrical measurement device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH076900B2 (en) | 1995-01-30 |
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