JPS6328987B2 - - Google Patents
Info
- Publication number
- JPS6328987B2 JPS6328987B2 JP60151603A JP15160385A JPS6328987B2 JP S6328987 B2 JPS6328987 B2 JP S6328987B2 JP 60151603 A JP60151603 A JP 60151603A JP 15160385 A JP15160385 A JP 15160385A JP S6328987 B2 JPS6328987 B2 JP S6328987B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- alloy
- sputtering
- atmosphere
- ppm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910001215 Te alloy Inorganic materials 0.000 claims description 18
- 229910052760 oxygen Inorganic materials 0.000 claims description 16
- 239000001301 oxygen Substances 0.000 claims description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 15
- 238000004544 sputter deposition Methods 0.000 claims description 12
- 229910052714 tellurium Inorganic materials 0.000 claims description 11
- 239000012535 impurity Substances 0.000 claims description 3
- 239000002994 raw material Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229910052793 cadmium Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15160385A JPS6213569A (ja) | 1985-07-10 | 1985-07-10 | TeまたはTe合金製スパツタリング用焼結タ−ゲツト |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15160385A JPS6213569A (ja) | 1985-07-10 | 1985-07-10 | TeまたはTe合金製スパツタリング用焼結タ−ゲツト |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6213569A JPS6213569A (ja) | 1987-01-22 |
JPS6328987B2 true JPS6328987B2 (US20100175706A1-20100715-C00006.png) | 1988-06-10 |
Family
ID=15522138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15160385A Granted JPS6213569A (ja) | 1985-07-10 | 1985-07-10 | TeまたはTe合金製スパツタリング用焼結タ−ゲツト |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6213569A (US20100175706A1-20100715-C00006.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0399291U (US20100175706A1-20100715-C00006.png) * | 1990-01-31 | 1991-10-16 | ||
JPH0536195U (ja) * | 1991-10-21 | 1993-05-18 | 株式会社クボタ | 管継手部の防食用コア |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01106748U (US20100175706A1-20100715-C00006.png) * | 1988-01-05 | 1989-07-18 | ||
JP5496078B2 (ja) * | 2008-02-26 | 2014-05-21 | Jx日鉱日石金属株式会社 | 焼結用Sb−Te系合金粉末及び同粉末の製造方法並びに焼結体ターゲット |
JP5457609B2 (ja) * | 2011-09-08 | 2014-04-02 | Jx日鉱日石金属株式会社 | Cu−Te合金系焼結体スパッタリングターゲットの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60131963A (ja) * | 1983-12-21 | 1985-07-13 | Nippon Mining Co Ltd | スパツタリング用タ−ゲツト板 |
-
1985
- 1985-07-10 JP JP15160385A patent/JPS6213569A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60131963A (ja) * | 1983-12-21 | 1985-07-13 | Nippon Mining Co Ltd | スパツタリング用タ−ゲツト板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0399291U (US20100175706A1-20100715-C00006.png) * | 1990-01-31 | 1991-10-16 | ||
JPH0536195U (ja) * | 1991-10-21 | 1993-05-18 | 株式会社クボタ | 管継手部の防食用コア |
Also Published As
Publication number | Publication date |
---|---|
JPS6213569A (ja) | 1987-01-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |