JPS63287565A - 半導体用シリコンの破砕方法 - Google Patents
半導体用シリコンの破砕方法Info
- Publication number
- JPS63287565A JPS63287565A JP12031887A JP12031887A JPS63287565A JP S63287565 A JPS63287565 A JP S63287565A JP 12031887 A JP12031887 A JP 12031887A JP 12031887 A JP12031887 A JP 12031887A JP S63287565 A JPS63287565 A JP S63287565A
- Authority
- JP
- Japan
- Prior art keywords
- crushing
- oven
- polycrystalline silicon
- silicon
- crushed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052710 silicon Inorganic materials 0.000 title claims description 22
- 239000010703 silicon Substances 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 12
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 33
- 238000010438 heat treatment Methods 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 230000005684 electric field Effects 0.000 description 16
- 238000011109 contamination Methods 0.000 description 9
- 239000013078 crystal Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 241000190020 Zelkova serrata Species 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Constitution Of High-Frequency Heating (AREA)
- Disintegrating Or Milling (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12031887A JPS63287565A (ja) | 1987-05-19 | 1987-05-19 | 半導体用シリコンの破砕方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12031887A JPS63287565A (ja) | 1987-05-19 | 1987-05-19 | 半導体用シリコンの破砕方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63287565A true JPS63287565A (ja) | 1988-11-24 |
| JPH0239941B2 JPH0239941B2 (OSRAM) | 1990-09-07 |
Family
ID=14783276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12031887A Granted JPS63287565A (ja) | 1987-05-19 | 1987-05-19 | 半導体用シリコンの破砕方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63287565A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0761808A (ja) * | 1993-08-26 | 1995-03-07 | Koujiyundo Silicon Kk | 多結晶シリコンの破砕方法 |
| JP2004091321A (ja) * | 2002-08-22 | 2004-03-25 | Hemlock Semiconductor Corp | シリコン処理効率の改善方法及び装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5148688A (en) * | 1974-09-12 | 1976-04-26 | Lilly Co Eli | Sefuazorinno seiho |
| JPS5237228A (en) * | 1975-09-17 | 1977-03-23 | Eaton Corp | Relief valve apparatus |
| JPS6033210A (ja) * | 1983-08-02 | 1985-02-20 | Komatsu Denshi Kinzoku Kk | 半導体用シリコンの破砕方法 |
-
1987
- 1987-05-19 JP JP12031887A patent/JPS63287565A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5148688A (en) * | 1974-09-12 | 1976-04-26 | Lilly Co Eli | Sefuazorinno seiho |
| JPS5237228A (en) * | 1975-09-17 | 1977-03-23 | Eaton Corp | Relief valve apparatus |
| JPS6033210A (ja) * | 1983-08-02 | 1985-02-20 | Komatsu Denshi Kinzoku Kk | 半導体用シリコンの破砕方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0761808A (ja) * | 1993-08-26 | 1995-03-07 | Koujiyundo Silicon Kk | 多結晶シリコンの破砕方法 |
| JP2004091321A (ja) * | 2002-08-22 | 2004-03-25 | Hemlock Semiconductor Corp | シリコン処理効率の改善方法及び装置 |
| US6874713B2 (en) | 2002-08-22 | 2005-04-05 | Dow Corning Corporation | Method and apparatus for improving silicon processing efficiency |
| JP2010189274A (ja) * | 2002-08-22 | 2010-09-02 | Hemlock Semiconductor Corp | シリコン片混合物を少なくとも２つのサイズ分布に区分する方法、システム及び分級機 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0239941B2 (OSRAM) | 1990-09-07 |
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