JPS63284844A - High density integrated element with connector terminal - Google Patents

Abstract

PURPOSE:To make a lot of LSi chips mountable on one sheet of a substrate, by mounting connector terminals on an upper plane of a package and connecting any connector terminals to leads disposed on a lower or side plane of the package. CONSTITUTION:Conductive pins 11-2 piercing a package 11-1 are disposed on lead mounting positions and other positions of a package in which semiconductor chips are housed to be projected in fixed dimensions from both upper and lower planes of the package. Unillustrated semiconductor chips are connected to some pins 11-2. Leads 11-2a connected to a substrate and connector terminals 11-2b connected to cables are disposed on the lower plane of the package 11-1 and on the upper plane of it, respectively. Namely LSi chips 11 with connector terminals are mounted on the whole main surface of the substrate 12. The connector terminals 11-2b for the LSi chips 11, disposed on terminal edges on the insertion side of the terminals, are connected to connectors 13-1 of a back panel 13 by using cables 14 fitted with cable connectors 14-1, 14-2 on both their ends. Any LSi chips 11 on a front side are connected to this unit by using cables 15 fitted with the cable connectors 14-1, so that mounting density can be upgraded.

Description

[Detailed Description of the Invention] (Summary) Penetrating pins with good conductivity are arranged in specified positions in a package containing a semiconductor chip so as to protrude from both the upper and lower surfaces, and some of the pins are connected to the semiconductor chip to package the package. A high-density integrated device with leads on the bottom side and connector terminals on the top side, which also functions as a conventional printed board connector.

[Industrial application field]

The present invention relates to high-density integrated devices widely used in the construction of various electronic devices.

In particular, printed circuit boards installed in medium-sized and large-sized electronic devices require large boards to mount a large number of high-density integrated devices (hereinafter referred to as LSi), and the LSi mounting layout and board wiring pattern design are complicated. It has become

Therefore, there is a need for a high-density integrated element with connector terminals that can be mounted using a mounting method that facilitates miniaturization of the board and easy design of wiring patterns and the like.

[Conventional technology]

As shown in FIG. 5, in the LSi that has been widely used in the past, a semiconductor chip part 1-2a sealed with an insulator such as plastic or ceramic is assembled into a package 1-1 as shown in FIG. A pin grid array package that comes out in parallel from the bottom of the , (middle) a flat package that comes out flat from the four sides shown in the figure, and a 3-shaped package that comes out from the bottom of the four sides as shown in the bottom view of (C). There is also a leadless chip carrier formed on the chip carrier, and a dual-in package (not shown) arranged downward from both sides.

As shown in FIG. 6, the mounting method is to mount each of the LSils at predetermined positions on the main surface of the board 2, and connect the printed board connector 2 to the back panel 3 and cable 4 at the front and rear edges in the insertion direction. 1 is mounted, and if necessary, the connection circuit between the LSis is modified using a modified wire 5 to form a printed board.

Then, the printed board connector 2-1 arranged on one of the printed boards is inserted and connected to the connector 3-1 of the back panel 3, and the cable connector 4-1 is connected to the other printed board connector 2-1. There is.

[Problem to be Solved by the Invention 3] The problem with the conventional LSi described above is that the printed board connectors for connecting the LSi mounted on the board, the back panel, and the cable are placed on both front and rear edges in the insertion direction of the board. (1) The mounting area of the printed board connector and the wiring area "S" between the connector and the LSi in the board.
However, a larger board is required for the connector mounting area and the wiring area between the connector and the LSi compared to the area provided on both front and rear edges of the board for mounting the LSi.

(2) Since the signal transmission time differs depending on the length of the wiring pattern between the mounted LSi and the printed circuit board connector, the LSi mounting design of the board and the wiring pattern should be considered when the wiring between the connector and a specific LSi is wired with equal length. The design becomes complicated.

(3) Since the position of the printed board connector connected to the cable is limited to the front side of the board, the layout design of other units to be connected becomes complicated. Furthermore, it is difficult to connect a special LSi that features a special power source to its power supply wiring. In addition, there may be restrictions such as mounting an LSi that requires a special power supply only near the connector.

(4) When modifying the wiring circuit of the board as necessary, cut the wiring pattern, wire a thin modified wire between the LSis mounted in high density, and connect both ends of the modified wire to the leads of the LSi or the board. In order to solder the modified pad, the modification work requires the skill of the operator and a large number of man-hours.

This leads to an increase in the size of the device and causes an increase in design and manufacturing costs.

In view of the above-mentioned circumstances, the present invention makes it possible to mount a large number of LSis on a single board, and to directly connect any LSi to a cable, increasing the degree of freedom in arranging connectors in any position. The object of the present invention is to provide an LSi with connector terminals that reduces design and manufacturing costs.

[Means for solving problems]

As shown in Fig. 1, the above-mentioned problem is caused by placing pins 11-2, which have good conductivity and penetrating through the package 11-1, above and below the position where the leads of the package containing the semiconductor chip are arranged and at any other arbitrary position. The pins 11-2 are arranged so as to protrude from both sides by a certain dimension, and some of the pins 11-2 are connected to a semiconductor chip (not shown), and connected to the substrate on the lower surface of the package 11-1. This problem is solved by the LSi with a connector terminal of the present invention, which is provided with a connector terminal 11-2b for connection to a cable.

[Effect]

That is, in the present invention, the connector terminal 11-2b is provided on the upper surface of the package 11-1 and is connected to some of the pins 11-2 and the semiconductor chip by penetrating the pins 11-2 having good conductivity. Connecting lead 11-2 The through pin 11-2, which has the lead a on the bottom surface and is not connected to the semiconductor chip, is connected to another LSill as a power supply or signal terminal for supplying power and signals, or for outputting signals. By using the connector terminal 11-2b as a signal or power supply terminal, an LSi having a conventional connector function is formed.

The LSill with connector terminals is mounted on the entire main surface of the board 12 as shown in the perspective view of FIG. are connected by a cable 14 with cable connectors 14-1 and 14-2 attached to both ends, and a cable 15 with a cable connector 14-1 attached to an arbitrary LSill on the front side and a unit (not shown).
(1) The mounting area of the printed board connector and the distribution area between the connector and the LSi become unnecessary, and the mounting area of the LSill increases, making it possible to downsize the board and improve the mounting density. .

(2) Connect directly to the connector terminal 11-2b of the LSill where the delay in transmitted signals is a problem with the cable 14 that has a delay time of approximately 1/2 per unit length with respect to the wiring pattern of the board 12. LS can be placed in any position.
ill can be mounted, making mounting design and wiring pattern design of the board 12 easier.

(3) Since it can be connected to the connector terminal 11-2b on the top surface of the LSill mounted from any direction to any position on the board 12, there is a large degree of freedom in the connector mounting position.
Since the positions of the other units are not restricted, the layout design becomes easy. Also, a special LS featuring a special power supply.
A special power supply can be supplied by connecting the cable connector 14-1 of the cable 15, which is connected to a power supply (not shown), to the connector terminal 11-2b of the illumination terminal 11-2b, making the connection easy, and the special power supply can be used as in the conventional method. LS to do
There is no need to limit the mounting value of i near the connector.

(4) When modifying the wiring circuit of the board 12, cut the wiring pattern and wire the modified wires 16 between the connector terminals 11-2b arranged on the top surface of each LSill, or connect the cable connectors 14 at both ends. Since it can be connected with the cable attached to -1, modification work is facilitated, and it is possible to downsize the device of the board 12 and reduce the device manufacturing cost.

〔Example〕

The present invention will be described in detail below with reference to FIGS. 1 to 4.

FIG. 1 shows a perspective view of an LSi with connector terminals in a pin array grid package according to a first embodiment.

As shown in the figure, a thin metal wire 2 with good conductivity is made of, for example, a nickel-plated hard copper wire, with a diameter of 0.2 n and a length of about 12
A pin 11-2 of mm is passed through the conventional lead arrangement position of the package 11-1 containing a semiconductor chip and any other arbitrary position, and the pin 11-2 is inserted into the package 11-1.
Approximately 5 cranes protrude from the bottom surface of 1-1, and some 1l-2a,
Connector terminals 1l-2b are formed that protrude by 4 fi from the top surface.

A pin 11 is inserted through the position where the lead is placed.
-2 and a semiconductor chip (not shown) to connect its pin 1.
1-2 is used as a signal and power supply terminal, and pin 11-2, which passes through any other position, functions as a terminal for supplying power and signals to other LSills and outputting signals without connection. An LSill with a connector terminal is formed.

The mounting method is as shown in the perspective view of FIG.
The LSills are mounted at designated positions on the entire main surface of the LSill, and the connector terminals 1l-2b of the LSills are arranged on one edge in the insertion direction, and the connector 13 is arranged on the back panel 13.
-1 is connected by a cable 14 in which a cable connector 14-1 with a low insertion/removal force is attached to one side of the flat cable using a detaching tool, and a cable connector 14-2 is arranged on the other side.

When modifying the wiring circuit of the board as necessary, cut the wiring pattern, connect the connector terminals 1l-2b of each LSill with a thin modified wire 16, and connect it to any LSill mounted on the front side. By connecting the cable connector 14-1 with a low insertion/removal force to the connector terminal 1l-2b and connecting it to another unit (not shown) using the cable 15, it is possible to downsize the board 12 and reduce design and manufacturing costs. Become.

In addition, the pins 11-2 penetrating the package 11 are connected to the number of modification terminals or G
It may be limited to only the ND terminal.

Note that by forming a package with a connector terminal having the same structure as above in which the pin 11-2 is passed through the package 11 which does not include a semiconductor chip and the leads 1l-2a and the connector terminal 1l-2b are formed, the package 11 is the same as the conventional one. It is a functional multi-pin connector and can be mounted in any position.

Next, in a flat package in which the leads are flat from all four sides, or in a leadless chip carrier formed in a U-shape on the bottom surface, as shown in the second embodiment of FIG. The above mounting method can also be applied to an LSi with a connector terminal in which connector terminals 2l-2b with good conductivity that protrude a certain dimension are arranged and any connector terminal 2l-2b protrudes from the side surface or connects a part 1-2a. This makes it possible to downsize the board and reduce costs.

Furthermore, as shown in the third embodiment of FIG. 4, in order to prevent or reduce crosstorf in the connector section, the signal pins 31-2a and the GND pins 3l-2b are arranged in a staggered manner when viewed from the top. The method for preventing or reducing crosstorf in the parts can be applied to the first and second embodiments.

[Effects of the Invention] As explained above, according to the present invention, by using an LSi with an extremely simple structure, the mounting area of the connector and the wiring area between the connector and the LSi are reduced, and the size of the board can be reduced, and the transmission speed can be improved. Signal delay time can be shortened,
It also has the advantage of being able to reduce design and manufacturing costs, and can be expected to have significant economic and reliability effects, making it extremely useful industrially.

[Brief explanation of the drawing]

FIG. 1 shows an L with connector terminals according to a first embodiment of the present invention.
Fig. 2 is a perspective view showing the mounting method of the LSi with connector terminals of this embodiment, Fig. 3 is a sectional view showing the second embodiment, and Fig. 4 is a plan view showing the third embodiment. 5 is a perspective view showing a conventional LSi, and FIG. 6 is a perspective view showing a conventional mounting method. In the figure, 11 is t, s i. 1-1.11-1 is a package, 11-2 is a pin, 1-2a, 1l-2a are leads, 11-2b, 2l-2b are connector terminals, 12 is a board, 13 is a back panel 13-1. 14-1.14-2 is a connector, 14, 15
is the cable, 16 is the modified wire, 3l-2a is the signal pin, 31-2b is the GND pin. Figure 4: Nail fJ plan view (C<b)
(C) Passenger car, lLS; Fig. 5 with a slight color finish.

Claims (3)

[Claims] (1) A high-density integrated device in which a semiconductor chip is housed in a package, which includes at least one connector terminal (11-2b) on the top surface of the package (11-1), and any of the connector terminals (11-2b). 2b) and a lead (11-2a) disposed on the bottom or side surface thereof.A high-density integrated device with a connector terminal. (2) A high-density integrated device with a connector terminal according to claim 1, wherein the connector terminal (11-2b) is composed of a GND terminal and a terminal for modification. (3) The arrangement of the connector terminal (11-2b) is characterized in that the signal pin (31-2a) and the GND pin (31-2b) are arranged in a staggered manner.
High-density integrated device with connector terminals as described in .