JPS6328452Y2 - - Google Patents
Info
- Publication number
- JPS6328452Y2 JPS6328452Y2 JP15589582U JP15589582U JPS6328452Y2 JP S6328452 Y2 JPS6328452 Y2 JP S6328452Y2 JP 15589582 U JP15589582 U JP 15589582U JP 15589582 U JP15589582 U JP 15589582U JP S6328452 Y2 JPS6328452 Y2 JP S6328452Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- light emitting
- white
- shielding film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003973 paint Substances 0.000 claims description 13
- 238000009792 diffusion process Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000012463 white pigment Substances 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15589582U JPS5960681U (ja) | 1982-10-14 | 1982-10-14 | 発光ダイオ−ド表示器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15589582U JPS5960681U (ja) | 1982-10-14 | 1982-10-14 | 発光ダイオ−ド表示器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5960681U JPS5960681U (ja) | 1984-04-20 |
| JPS6328452Y2 true JPS6328452Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-08-01 |
Family
ID=30344162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15589582U Granted JPS5960681U (ja) | 1982-10-14 | 1982-10-14 | 発光ダイオ−ド表示器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5960681U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005013246A1 (ja) * | 2003-08-04 | 2005-02-10 | Koha Co., Ltd. | 表示装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010171294A (ja) * | 2009-01-26 | 2010-08-05 | Rohm Co Ltd | 発光装置 |
| JP5410167B2 (ja) * | 2009-06-12 | 2014-02-05 | 株式会社小糸製作所 | 発光モジュールおよび車両用前照灯 |
-
1982
- 1982-10-14 JP JP15589582U patent/JPS5960681U/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005013246A1 (ja) * | 2003-08-04 | 2005-02-10 | Koha Co., Ltd. | 表示装置 |
| JPWO2005013246A1 (ja) * | 2003-08-04 | 2006-09-28 | 株式会社光波 | 表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5960681U (ja) | 1984-04-20 |