JPS6328353B2 - - Google Patents
Info
- Publication number
- JPS6328353B2 JPS6328353B2 JP17049580A JP17049580A JPS6328353B2 JP S6328353 B2 JPS6328353 B2 JP S6328353B2 JP 17049580 A JP17049580 A JP 17049580A JP 17049580 A JP17049580 A JP 17049580A JP S6328353 B2 JPS6328353 B2 JP S6328353B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- receiving element
- prism
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 230000000903 blocking effect Effects 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
Description
【発明の詳細な説明】
本発明は、混成集積回路の基板の上に直接チツ
プ状の発光素子と受光素子を取付けて形成される
光結合インタラプタに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical coupling interrupter formed by directly attaching a chip-shaped light emitting element and a light receiving element to a substrate of a hybrid integrated circuit.
絶縁基板上に形成する膜技術を利用して、抵抗
体、絶縁体等の受動素子を形成し、トランジス
タ、IC等の能動素子等を塔載して集積化する厚
膜混成ICの生産プロセスは、印刷技術が主体と
なるため２次元的な拡がりをもつ回路構成をとつ
ている。 The production process for thick film hybrid ICs uses film technology to form on an insulating substrate, forming passive elements such as resistors and insulators, and mounting and integrating active elements such as transistors and ICs. , since printing technology is the main component, the circuit configuration has a two-dimensional expansion.
例えば、第１図に示すように、抵抗体１や導電
体２が基板３上に２次元的に形成され、半導体チ
ツプ４は基板３上にダイボンデングされ、極細線
５で電極６と電気的に接続されている。しかし、
このような基板３の上に、チツプ状の発光素子７
と受光素子８を直接取付けようとしても、光結合
インタラプタ９は発光素子７と受光素子８との間
を遮光物１０が通過するための間隙部１１を介し
て対向させる必要がある点から実際上実現が困難
であつた。このため、従来は、第１図に示すよう
に発光素子７や受光素子８をそれぞれ個別にパツ
ケージ１２，１３に収納して１つの部品として形
成し、これらのパツケージ１２，１３をそれぞれ
の発光面と受光面が間隙部１１を介して対面する
ように配置し、接続端子を介して基板３に実装す
るか、または、発光素子と受光素子を１対として
１つのパツケージに収納して、このパツケージの
両素子間に間隙部を形成するための溝を設け、１
つの部品として接続端子を介して基板３に実装す
る方法が採られていた。 For example, as shown in FIG. 1, a resistor 1 and a conductor 2 are two-dimensionally formed on a substrate 3, a semiconductor chip 4 is die-bonded on the substrate 3, and is electrically connected to an electrode 6 using a very thin wire 5. It is connected. but,
On such a substrate 3, a chip-shaped light emitting element 7 is placed.
Even if an attempt is made to directly attach the light-emitting element 7 and the light-receiving element 8, the optical coupling interrupter 9 needs to be opposed to the light-emitting element 7 and the light-receiving element 8 through a gap 11 for the light shield 10 to pass between them. It was difficult to realize this. For this reason, conventionally, as shown in FIG. 1, the light emitting element 7 and the light receiving element 8 are individually housed in packages 12 and 13 to form one component, and these packages 12 and 13 are connected to their respective light emitting surfaces. and the light-receiving surfaces thereof face each other with the gap 11 interposed therebetween, and the light-emitting element and the light-receiving element are arranged as a pair and mounted on the board 3 via the connection terminals, or the light-emitting element and the light-receiving element are housed as a pair in one package. A groove is provided to form a gap between both elements of 1.
A method has been adopted in which the device is mounted as a single component on the board 3 via a connecting terminal.
このように、発光素子と受光素子とを個別又は
共通のパツケージに収納して部品を形成してから
基板に実装する生産プロセスは、３次元的な構成
となるため工程が煩雑でしかも周辺回路の集積化
が困難であることからコスト高を招き集積回路の
小型化を困難にするとともに、発光素子と受光素
子との相互の配置を正確に決めることが困難であ
ることから精度が悪かつた。 In this way, the production process in which a light-emitting element and a light-receiving element are housed individually or in a common package to form a component and then mounted on a board is a three-dimensional configuration, making the process complicated and requiring peripheral circuits. Difficulties in integration lead to high costs and make it difficult to miniaturize the integrated circuit, and the accuracy is poor because it is difficult to accurately determine the mutual arrangement of the light emitting element and the light receiving element.
本発明は上述の点に鑑みなされたもので、混成
集積回路の同一基板上に直接発光素子と受光素子
を搭載し、該発光素子の発光面と該受光素子の受
光面とに臨ませて両者間を光学的に結合する光の
屈折反射手段を設け、該屈折反射手段の途中に遮
光物を通過させるための間隙部を設け、該屈折反
射手段は該発光素子と受光素子の表面にそれぞれ
保護を兼ねてモールドした透明な合成樹脂から成
る第１および第２の凸レンズと、これら第１、第
２の凸レンズの間に、それぞれ一方の面を臨ま
せ、かつ他方の面の間に前記間隙部を有する第１
および第２のプリズムとからなり、該間隙部は該
第１、第２のプリズムの他方の面に臨設され、光
の通過する孔を穿設した２枚の遮光板の間に形成
してなるものである。このように同一基板上にチ
ツプ状態の発光素子と受光素子とを直接塔載する
ことにより、これらの素子と電極とのワイヤボン
デイング等の生産プロセスを簡易にするととも
に、素子の直ぐ近くの基板上に周辺回路等を形成
できるようにして混成集積回路の小型化を容易と
し、さらに発光素子と受光素子との相互の位置関
係を正確に決定し精度を高めるようにしたもので
ある。 The present invention has been made in view of the above points, and includes a light emitting element and a light receiving element directly mounted on the same substrate of a hybrid integrated circuit, and a light emitting element and a light receiving element facing the light emitting element and the light receiving surface of the light receiving element. A light refraction and reflection means is provided for optically coupling between the light emitting element and the light receiving element, and a gap is provided in the middle of the refraction and reflection means to allow a light shield to pass through, and the refraction and reflection means protects the surfaces of the light emitting element and the light receiving element, respectively. The first and second convex lenses made of a transparent synthetic resin molded to serve as the first with
and a second prism, and the gap is formed between two light shielding plates provided on the other side of the first and second prisms and having holes through which light passes. be. By directly mounting a chip-like light emitting element and a light receiving element on the same substrate in this way, it is possible to simplify the production process such as wire bonding between these elements and electrodes, and also to mount the chip state light emitting element and light receiving element directly on the same substrate. The present invention facilitates the miniaturization of the hybrid integrated circuit by allowing peripheral circuits to be formed in the semiconductor device, and further improves precision by accurately determining the mutual positional relationship between the light emitting element and the light receiving element.
以下、本発明の実施例を第２図以下の図面に基
づいて説明する。 Hereinafter, embodiments of the present invention will be described based on the drawings from FIG. 2 onwards.
１４はガラスやセラミツクなどで形成された基
板で、この基板１４上には抵抗体１５や導電体１
６等が印刷形成され、チツプ状に形成された
LED等の発光素子１７と、フオトダイオードや
フオトトランジスタ等の発光素子１８とが直接ダ
イボンデイングされている。これらの発光素子１
７と受光素子１８は極細線１９によつて電極２０
１，２０２に接続され、この電極２０１，２０２
は周辺回路（図示せず）に接続されている。ま
た、前記発光素子１７の発光面と受光素子１８の
受光面とに臨ませて光の屈折反射手段が設けられ
両者間を光学的に結合している。この光の屈折反
射手段は、例えば次のように構成されている。即
ち、発光素子１７と受光素子１８のそれぞれの上
部には、素子表面の保護材を兼ねた透明なシリコ
ン樹脂やエポキシ樹脂等で形成された第１と第２
の凸レンズ２１，２２とがその光軸をそれぞれの
素子１７，１８の発光面、受光面の中心軸に一致
して設けられている。これらの第１、第２の凸レ
ンズ２１，２２の外側面には、外部からの光の遮
光手段として黒色の樹脂層２３がスペーサーとし
て形成されている。なお、前記第１および第２の
凸レンズ２１，２２は、例えば基板１４の表面に
発光素子１７、受光素子１８を塔載してワイヤボ
ンデイングをした後、これらの素子１７，１８の
上部にレンズ形成用の段差のある円孔２４を残す
ように外部光の遮光手段としての黒色樹脂層２３
を形成し、つぎに、この円孔２４の中に定量注入
機により液体状の透明なシリコン樹脂等を注入し
その液体の表面張力の作用によつて形成される。
すなわち、透明なシリコン樹脂の液体量を、円孔
２４の小径部の体積に対してやや多めに注入する
と、表面張力によつて中央部が周囲よりも盛り上
がつて第１、第２の凸レンズ２１，２２が形成さ
れる。前記第１と第２の凸レンズ２１，２２のそ
れぞれの上部には、空間部２５と２６を介して光
の伝送路を略直角に屈折反射させるためのガラス
や透明アクリル樹脂等でできた第１の直角型のプ
リズム２７と第２の直角型のプリズム２８とが、
その水平面を前記第１と第２の凸レンズ２１，２
２の光軸と垂角となるように設けられている。前
記第１、第２のプリズム２７，２８のそれぞれの
垂直面は、２枚の遮光板２９，３０の間に、コン
ピユーターの穿孔テープのような遮光物３１を通
過させるための間隙部３２を介して対面するよう
に設けられている。前記遮光板２９，３０には、
発光素子１７から発射し、第１のプリズム２７で
屈折反射した光が第２のプリズム２８に入射でき
るようにするための孔３３，３４が穿設され、前
記第１および第２のプリズム２７，２８の斜面に
は、外部からの光を遮断するための手段として反
射膜３５，３６が塗布されている。 Reference numeral 14 denotes a substrate made of glass, ceramic, etc., and a resistor 15 and a conductor 1 are mounted on this substrate 14.
6th grade was printed and formed into a chip shape.
A light emitting element 17 such as an LED and a light emitting element 18 such as a photodiode or phototransistor are directly die bonded. These light emitting elements 1
7 and the light receiving element 18 are connected to an electrode 20 by a very fine wire 19.
1,202, and this electrode 201,202
are connected to peripheral circuits (not shown). Further, a light refraction/reflection means is provided facing the light emitting surface of the light emitting element 17 and the light receiving surface of the light receiving element 18 to optically couple the two. This light refraction/reflection means is configured as follows, for example. That is, on top of each of the light emitting element 17 and the light receiving element 18, there are first and second electrodes made of transparent silicone resin, epoxy resin, etc., which also serve as a protective material for the surface of the element.
Convex lenses 21 and 22 are provided so that their optical axes coincide with the central axes of the light emitting and light receiving surfaces of the elements 17 and 18, respectively. A black resin layer 23 is formed as a spacer on the outer surface of the first and second convex lenses 21 and 22 as a means for blocking light from the outside. The first and second convex lenses 21 and 22 are formed by, for example, mounting the light emitting element 17 and the light receiving element 18 on the surface of the substrate 14 and performing wire bonding, and then forming lenses on top of these elements 17 and 18. The black resin layer 23 as a means of shielding external light is left so as to leave a circular hole 24 with a step.
Next, a transparent liquid silicone resin or the like is injected into the circular hole 24 using a metering injection machine, and the hole is formed by the action of the surface tension of the liquid.
In other words, when a transparent silicone resin liquid is injected in an amount slightly larger than the volume of the small diameter portion of the circular hole 24, the center portion bulges out from the periphery due to surface tension, forming the first and second convex lenses. 21 and 22 are formed. Above each of the first and second convex lenses 21 and 22, there is a first lens made of glass, transparent acrylic resin, etc., for refracting and reflecting the light transmission path approximately at right angles through the spaces 25 and 26. The right-angled prism 27 and the second right-angled prism 28 are
The horizontal plane is connected to the first and second convex lenses 21 and 2.
It is provided so as to form a perpendicular angle to the optical axis of No. 2. The respective vertical surfaces of the first and second prisms 27 and 28 are formed with a gap 32 between the two light shielding plates 29 and 30 for passing a light shielding material 31 such as perforated tape of a computer. They are set up so that they face each other. The light shielding plates 29 and 30 include
Holes 33 and 34 are provided to allow light emitted from the light emitting element 17 and refracted and reflected by the first prism 27 to enter the second prism 28, and the first and second prisms 27, Reflective films 35 and 36 are coated on the slopes 28 as means for blocking light from the outside.
つぎに作用を説明する。 Next, the effect will be explained.
第２図において、発光素子１７から発射した光
は矢印で示すように放射状に拡がり、第１の凸レ
ンズ２１で集光され、その光軸と略平行な光線と
なつて第１のプリズム２７の水平面に垂直に入射
する。この入射光は第１のプリズム２７の斜面で
反射し略水平な光線となつて、第１のプリズム２
７の垂直面、遮光板２９の孔３３、間隔部３２、
遮光板３０の孔３４を経て第２のプリズム２８の
垂直面に略垂直に入射する。この入射光は、第２
のプリズム２８の斜面で直角に反射し、その水平
面を経て第２の凸レンズ２２で集光され受光素子
１８の受光面に入射する。このようにして発光素
子１７から出た光を受光素子１８で感知できるよ
うにして、間隙部３２を通過する遮光物３１とし
ての例えばテープ等の穿孔の有無を検出する。 In FIG. 2, the light emitted from the light emitting element 17 spreads radially as shown by the arrows, is condensed by the first convex lens 21, becomes a ray approximately parallel to the optical axis, and is directed to the horizontal surface of the first prism 27. is incident perpendicularly to This incident light is reflected on the slope of the first prism 27 and becomes a substantially horizontal light beam.
7, the hole 33 of the light shielding plate 29, the interval part 32,
The light enters the vertical surface of the second prism 28 almost perpendicularly through the hole 34 of the light shielding plate 30 . This incident light is
The light is reflected at right angles from the slope of the prism 28 , passes through its horizontal surface, is focused by the second convex lens 22 , and enters the light-receiving surface of the light-receiving element 18 . In this way, the light emitted from the light emitting element 17 can be sensed by the light receiving element 18, and the presence or absence of a hole in the light shielding material 31, such as a tape, passing through the gap 32 is detected.
前記実施例では、発光素子と受光素子各１個づ
つで形成した光結合インタラプタの場合を説明し
たが、第３、第４および第５図に示すように複数
個の発光素子１７1，１７2，１７3…と受光素子
１８1，１８2，１８3…とをそれぞれ１個づつ対
として並列的に使用する多チヤンネル式の光結合
インタラプタを基板に形成する場合についても同
様である。 In the above embodiment, the optical coupling interrupter is formed with one light emitting element and one light receiving element, but as shown in FIGS. 3, 4 and 5, a plurality of light emitting elements 17 1 , 17 2 are used. , 17 3 . . . and light receiving elements 18 1 , 18 2 , 18 3 .
これらの図において、２７Ａ，２８Ａは光の屈
折反射手段としての第１、第２のプリズムで、こ
れらのプリズム２７Ａ，２８Ａの下部には、発光
素子１７1，１７2，１７3…からなる発光素子群
と、受光素子１８1，１８2，１８3…からなる受
光素子群とが形成されている。前記第１、第２の
プリズム２７Ａ，２８Ａの上部には、対とならな
い発光素子と受光素子との間で光の相互干渉が起
こるのを防止するためのスリツト３７，３７，３
７…が設けられ、これらのスリツト３７，３７，
３７…の表面には外部の光を遮断するための手段
として反射膜３８が塗布されている。 In these figures, 27A and 28A are first and second prisms as light refraction and reflection means, and below these prisms 27A and 28A are light emitting elements 17 1 , 17 2 , 17 3 . . . An element group and a light receiving element group consisting of light receiving elements 18 1 , 18 2 , 18 3 . . . are formed. Slits 37, 37, 3 are provided at the tops of the first and second prisms 27A, 28A to prevent mutual interference of light between light emitting elements and light receiving elements that are not paired.
7... are provided, and these slits 37, 37,
A reflective film 38 is coated on the surface of 37 as a means for blocking external light.
本発明は上記のように混成集積回路の同一基板
上に直接発光素子と受光素子とをチツプ状態で塔
載して光結合インタラプタを形成するようにした
ので、発光素子および受光素子と電極とのワイヤ
ボンデイング等の生産プロセスが簡易になるとと
もに、発光素子や受光素子の直ぐ近くの基板上に
抵抗体や導電体または周辺回路を形成できるので
混成集積回路の小型化が可能である。さらに、発
光素子と受光素子との相互の位置決めが略同一平
面上でできるので、従来と比較して、より精度の
高い位置決めができるので、光結合インタラプタ
としての精度が高い。 In the present invention, as described above, the light-emitting element and the light-receiving element are directly mounted in chip form on the same substrate of the hybrid integrated circuit to form an optical coupling interrupter. In addition to simplifying production processes such as wire bonding, it is possible to form a resistor, a conductor, or a peripheral circuit on a substrate immediately adjacent to a light emitting element or a light receiving element, thereby making it possible to miniaturize the hybrid integrated circuit. Furthermore, since the mutual positioning of the light emitting element and the light receiving element can be performed on substantially the same plane, the positioning can be performed with higher precision than in the past, so that the optical coupling interrupter has high precision.
第１、第２の凸レンズは、発光素子と受光素子
の表面に透明な合成樹脂モールドしてなるもので
あるから、これら発光素子と受光素子が充分保護
されるばかりでなく、特別に凸レンズを構成しな
くとも樹脂の表面張力で形成されるものである。
また、間隙部は光の通過する孔を穿設した２枚の
遮光板の間に形成したので、光を発光側から受光
側へ正しく導き、しかも、間隙部の寸法も正確に
なり、より正確な制御が可能となる。 Since the first and second convex lenses are formed by molding transparent synthetic resin onto the surfaces of the light emitting element and light receiving element, not only are these light emitting elements and light receiving elements sufficiently protected, but the convex lenses are specially constructed. Even if it is not, it is formed by the surface tension of the resin.
In addition, since the gap is formed between two light shielding plates with holes for light to pass through, the light is guided correctly from the light emitting side to the light receiving side, and the dimensions of the gap are also accurate, allowing for more accurate control. becomes possible.
以上の効果は、発光素子と受光素子の対を多数
個設けた多チヤンネル方式の光結合インタラプタ
を形成する場合も同様である。 The above effects are the same when forming a multi-channel optical coupling interrupter in which a large number of pairs of light emitting elements and light receiving elements are provided.
また、発光素子と発光面と受光素子の受光面と
を光学的に結合するための光の屈折反射手段を凸
レンズと第１、第２のプリズムとで構成したの
で、発光素子から発射される光を有効に受光素子
に伝送することができる。さらに、多チヤンネル
方式の光結合インタラプタの場合に、第１、第２
プリズムの上部にスリツトを設け、各スリツトに
遮光手段を設けると、外部の光からの干渉を防止
する効果が付加される。 In addition, since the light refraction and reflection means for optically coupling the light emitting element, the light emitting surface, and the light receiving surface of the light receiving element is composed of a convex lens and the first and second prisms, the light emitted from the light emitting element is can be effectively transmitted to the light receiving element. Furthermore, in the case of a multi-channel optical coupling interrupter, the first and second
By providing slits in the upper part of the prism and providing a light shielding means for each slit, the effect of preventing interference from external light is added.
第１図は従来例を示す側面図、第２図は本発明
による光結合インタラプタの一実施例を示す拡大
断面図、第３図は本発明による光結合インタラプ
タを多チヤンネル方式に形成した場合の正面図、
第４図は同上平面図、第５図は同上側面図であ
る。
３，１４……基板、４……半導体チツプ、５，
１９……極細線、６，２０１，２０２……電極、
７，１７，１７1，１７2，１７3……発光素子、
８，１８，１８1，１８2，１８3……受光素子、
９……光結合インタラプタ、１０，３１……遮光
物、１１，３２……間隙部、２１，２２……凸レ
ンズ、２３……遮光手段としての黒色樹脂層、２
４……段差のある円孔、２５，２６……空間部、
２７，２７Ａ，２８，２８Ａ……プリズム、２
９，３０……遮光板、３３，３４……孔、３５，
３６……遮光手段としての反射膜、３７……スリ
ツト、３８……遮光手段としての反射膜。
FIG. 1 is a side view showing a conventional example, FIG. 2 is an enlarged sectional view showing an embodiment of the optical coupling interrupter according to the present invention, and FIG. Front view,
FIG. 4 is a plan view of the same, and FIG. 5 is a side view of the same. 3, 14...Substrate, 4...Semiconductor chip, 5,
19... Ultrafine wire, 6,201,202... Electrode,
7, 17, 17 1 , 17 2 , 17 3 ... light emitting element,
8, 18, 18 1 , 18 2 , 18 3 ... light receiving element,
9... Optical coupling interrupter, 10, 31... Light blocking object, 11, 32... Gap, 21, 22... Convex lens, 23... Black resin layer as light blocking means, 2
4... Circular hole with a step, 25, 26... Space part,
27, 27A, 28, 28A... Prism, 2
9, 30... Light shielding plate, 33, 34... Hole, 35,
36... Reflective film as a light shielding means, 37... Slit, 38... Reflective film as a light shielding means.
Claims (1)
受光素子を搭載し、該発光素子の発光面と該受光
素子の受光面とに臨ませて両者間を光学的に結合
する光の屈折反射手段を設け、該屈折反射手段の
途中に遮光物を通過させるための間〓部を設け、
該屈折反射手段は該発光素子と受光素子の表面に
それぞれ保護を兼ねてモールドした透明な合成樹
脂から成る第１および第２の凸レンズと、これら
第１、第２の凸レンズの間に、それぞれ一方の面
を臨ませ、かつ他方の面の間に前記間〓部を有す
る第１および第２のプリズムとからなり、該間〓
部は該第１、第２のプリズムの他方の面に臨設さ
れ、光の通過する孔を穿設した２枚の遮光板の間
に形成してなる光結合インタラプタ。 ２ 特許請求の範囲第１項記載において、同一基
板上に搭載する発光素子と受光素子は複数個の対
としたものからなり、該発光素子群の上部に設け
た第１プリズムと、該受光素子群の上部に設けた
第２プリズムは、該第１プリズムおよび第２プリ
ズムに個々の素子を区切るためのスリツトを設
け、該スリツトに外部からの光の遮光手段を設け
たものからなる光結合インタラプタ。[Scope of Claims] 1. A light-emitting element and a light-receiving element are directly mounted on the same substrate of a hybrid integrated circuit, and the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element face each other, and the two are optically coupled. providing a refraction and reflection means for the light to be reflected, and providing an intermediate part in the middle of the refraction and reflection means for allowing the light to pass through a light blocking object;
The refractive/reflective means includes first and second convex lenses made of transparent synthetic resin that are molded on the surfaces of the light emitting element and the light receiving element for protection, respectively, and one side between the first and second convex lenses. comprising first and second prisms that face the surface of the prism and have the gap between the other surfaces, and the gap between the two prisms.
The optical coupling interrupter is formed between two light-shielding plates provided on the other side of the first and second prisms and having holes through which light passes. 2. In claim 1, the light-emitting element and the light-receiving element mounted on the same substrate consist of a plurality of pairs, and the first prism provided above the light-emitting element group and the light-receiving element The second prism provided at the top of the group is an optical coupling interrupter in which the first prism and the second prism are provided with slits for separating individual elements, and the slits are provided with means for blocking light from the outside. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17049580A JPS5793586A (en) | 1980-12-03 | 1980-12-03 | Photocoupling interrupter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17049580A JPS5793586A (en) | 1980-12-03 | 1980-12-03 | Photocoupling interrupter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5793586A JPS5793586A (en) | 1982-06-10 |
| JPS6328353B2 true JPS6328353B2 (en) | 1988-06-08 |
Family
ID=15906018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17049580A Granted JPS5793586A (en) | 1980-12-03 | 1980-12-03 | Photocoupling interrupter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5793586A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3009379U (en) * | 1994-08-05 | 1995-04-04 | 船井電機株式会社 | Reel sensor |
| JP2006269777A (en) * | 2005-03-24 | 2006-10-05 | Rohm Co Ltd | Plate mounting photointerrupter and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4969095A (en) * | 1972-11-08 | 1974-07-04 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4893777U (en) * | 1972-02-15 | 1973-11-09 | ||
| JPS55132971U (en) * | 1979-03-14 | 1980-09-20 |
-
1980
- 1980-12-03 JP JP17049580A patent/JPS5793586A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4969095A (en) * | 1972-11-08 | 1974-07-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5793586A (en) | 1982-06-10 |
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