JPS63283096A - 樹脂組成物 - Google Patents

樹脂組成物

Info

Publication number
JPS63283096A
JPS63283096A JP31293487A JP31293487A JPS63283096A JP S63283096 A JPS63283096 A JP S63283096A JP 31293487 A JP31293487 A JP 31293487A JP 31293487 A JP31293487 A JP 31293487A JP S63283096 A JPS63283096 A JP S63283096A
Authority
JP
Japan
Prior art keywords
plating
silane coupling
coupling agent
resin composition
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP31293487A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0413877B2 (https=
Inventor
Minoru Tsuda
津田　穰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPS63283096A publication Critical patent/JPS63283096A/ja
Publication of JPH0413877B2 publication Critical patent/JPH0413877B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP31293487A 1986-12-10 1987-12-09 樹脂組成物 Granted JPS63283096A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-294373 1986-12-10
JP29437386 1986-12-10

Publications (2)

Publication Number Publication Date
JPS63283096A true JPS63283096A (ja) 1988-11-18
JPH0413877B2 JPH0413877B2 (https=) 1992-03-11

Family

ID=17806875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31293487A Granted JPS63283096A (ja) 1986-12-10 1987-12-09 樹脂組成物

Country Status (1)

Country Link
JP (1) JPS63283096A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003504846A (ja) * 1999-07-03 2003-02-04 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング セラミック表面領域を選択的に被覆する方法
JP2012504705A (ja) * 2008-10-02 2012-02-23 マクダーミッド インコーポレーテッド 表面のはんだ付け性を向上させる方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003504846A (ja) * 1999-07-03 2003-02-04 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング セラミック表面領域を選択的に被覆する方法
JP2012504705A (ja) * 2008-10-02 2012-02-23 マクダーミッド インコーポレーテッド 表面のはんだ付け性を向上させる方法

Also Published As

Publication number Publication date
JPH0413877B2 (https=) 1992-03-11

Similar Documents

Publication Publication Date Title
JP3117386B2 (ja) 基板を選択的に金属被覆する方法
US4897118A (en) Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein
US5235139A (en) Method for fabricating printed circuits
JPH0645900B2 (ja) 表面上に付着する金属の接着性を改良するためのポリイミド表面の処理方法及びこれにより製造された物品
EP0066330B1 (en) Method of producing printed circuit boards
JP6814028B2 (ja) プリント配線基板の製造方法
WO1988008337A1 (en) Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
US3799816A (en) Metallizing insulating bases
JP4143262B2 (ja) 銅表面の前処理のための方法
US20050238812A1 (en) Method for electroless metalisation of polymer substrate
US4537799A (en) Selective metallization process
TW200407057A (en) Method for the manufacture of printed circuit boards with integral plated resistors
TW200403290A (en) Method for electroless metalisation of polymer substrate
JPS63283096A (ja) 樹脂組成物
EP0098472B1 (en) Method for decreasing plated metal defects by treating a metallic surface
JPH0322467B2 (https=)
TWI361461B (en) Method for manufacturing a composite of copper and resin
JPS63278296A (ja) プリント基板及びその製造方法
JPS638638B2 (https=)
US4714646A (en) Electrophoretic insulation of metal circuit board core
JPH10195214A (ja) 樹脂エッチング液及びエッチング方法
EP0239839B1 (en) Electrophoretic insulation of metal circuit board core
JPS63129692A (ja) プリント配線板の製法
EP0467199A2 (en) Preparation of printed circuit boards by metallization
JPH02285696A (ja) プリント配線板の製造方法