JPS63278261A - Electronic component cooling device - Google Patents
Electronic component cooling deviceInfo
- Publication number
- JPS63278261A JPS63278261A JP61225341A JP22534186A JPS63278261A JP S63278261 A JPS63278261 A JP S63278261A JP 61225341 A JP61225341 A JP 61225341A JP 22534186 A JP22534186 A JP 22534186A JP S63278261 A JPS63278261 A JP S63278261A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- substrate
- riser
- electronic component
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 2
- WZZBNLYBHUDSHF-DHLKQENFSA-N 1-[(3s,4s)-4-[8-(2-chloro-4-pyrimidin-2-yloxyphenyl)-7-fluoro-2-methylimidazo[4,5-c]quinolin-1-yl]-3-fluoropiperidin-1-yl]-2-hydroxyethanone Chemical compound CC1=NC2=CN=C3C=C(F)C(C=4C(=CC(OC=5N=CC=CN=5)=CC=4)Cl)=CC3=C2N1[C@H]1CCN(C(=O)CO)C[C@@H]1F WZZBNLYBHUDSHF-DHLKQENFSA-N 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910001182 Mo alloy Inorganic materials 0.000 description 3
- 229910001080 W alloy Inorganic materials 0.000 description 3
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 3
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 3
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、電子部品特に集積回路の冷却に適した電子部
品冷却装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component cooling device suitable for cooling electronic components, particularly integrated circuits.
［従来の技術］
近年における集積回路の高密度化、高速化に伴い、かか
る集積回路の発熱量が増加してきており、いかに効率良
く冷却するかが問題とされ、従来より種々の電子部品冷
却装置が提案されている。[Prior Art] As integrated circuits have become denser and faster in recent years, the amount of heat generated by these integrated circuits has increased, and how to efficiently cool them has become a problem. is proposed.
ところで従来のこの種の電子部品冷却装置としては、例
えば特開昭５９−５６７４６や特開昭５９−６１９４３
に示すものがある。この電子部品冷却装置は、第３図に
示すように、絶縁性枠体１０２の上面に、銅−タングス
テン合金または銅−モリブデン合金製の熱伝導性基体１
０１を取付けて半導体素子１０３を熱伝導性基体１０１
に搭載して熱を大気中に放出させるようになっている。By the way, as a conventional electronic component cooling device of this type, for example, Japanese Patent Application Laid-Open No. 59-56746 and Japanese Patent Application Laid-Open No. 59-61943
There are some things shown below. As shown in FIG. 3, this electronic component cooling device has a thermally conductive base 1 made of copper-tungsten alloy or copper-molybdenum alloy on the top surface of an insulating frame 102.
01 and the semiconductor element 103 is attached to the thermally conductive substrate 101.
It is designed to be installed on a vehicle and release heat into the atmosphere.
熱伝導性基体１０１と、絶縁性枠体１０２は、固着させ
て一体としであることから、熱膨張率の違う材料を用い
るとクラックや欠けが生ずるため、両者とも同一の熱膨
張率を有する必要がある。Since the thermally conductive base 101 and the insulating frame 102 are fixed and integrated, cracks and chips will occur if materials with different coefficients of thermal expansion are used, so both need to have the same coefficient of thermal expansion. There is.
ところで、絶縁性枠体１０２は半導体素子１０３の電極
を外部に取出すために導電層を形成する必要があること
から、アルミナ等のセラミックを使用している。このア
ルミナ材は熱膨張率が小さく、通常放熱材として多く使
用されるものである。一方、熱伝導性基体１０１にアル
ミニウム等の熱膨張率の大きい材料を用いると熱膨張率
の小さい絶縁性枠体１０２との間で上述のようにクラッ
クや欠けが生じるので、絶縁性枠体１０２と同様に熱膨
張率の小さい材料である必要がある。Incidentally, the insulating frame 102 is made of ceramic such as alumina because it is necessary to form a conductive layer in order to take out the electrodes of the semiconductor element 103 to the outside. This alumina material has a small coefficient of thermal expansion and is commonly used as a heat dissipation material. On the other hand, if a material with a large coefficient of thermal expansion such as aluminum is used for the thermally conductive base 101, cracks or chips will occur between the insulating frame 102 and the insulating frame 102, which has a small coefficient of thermal expansion, as described above. Similarly, the material must have a low coefficient of thermal expansion.
更に、半導体素子１０３にて発生する放熱路でもあるた
め、熱伝導率が高い材料を用いる必要がある。これら二
条性を満足する材料として前述した銅−タングステン合
金や銅−モリブデン合金を従来熱伝導性基体１０１に用
いていた。Furthermore, since it is also a heat dissipation path generated in the semiconductor element 103, it is necessary to use a material with high thermal conductivity. Conventionally, the above-mentioned copper-tungsten alloy and copper-molybdenum alloy have been used for the thermally conductive substrate 101 as materials that satisfy these double-stripe properties.
［解決すべき問題点コ
しかし、これらの材料は、比重が非常に大きいことから
かかる材料を用いた電子部品冷却装置をプリント基板に
多数半田付して組立てた場合、プリント基板の強度を強
くする部材が必要になったり、運搬、保守等に不都合が
生じていた。また、材料そのものが高価である上に加工
費も高くなるという問題点もあった。[Problems to be solved] However, since these materials have extremely high specific gravity, when an electronic component cooling device using such materials is assembled by soldering a large number of them to a printed circuit board, it is difficult to increase the strength of the printed circuit board. This required parts and caused inconvenience in transportation, maintenance, etc. In addition, there were also problems in that the material itself was expensive and the processing cost was also high.
本発明は、上記従来の問題点に鑑みなされたものであり
、プリント基板の強度を強くする部材を不要にし、運搬
、保守等が容易であって、且つ低価格で製造することが
できる電子部品冷却装置を提供することを目的とする。The present invention has been made in view of the above-mentioned conventional problems, and provides an electronic component that eliminates the need for members that strengthen the printed circuit board, is easy to transport, maintain, etc., and can be manufactured at a low cost. The purpose is to provide a cooling device.
［問題点の解決手段］
このため本発明では、電子部品搭載面に人出力ピンを有
する基板の他面に、枠体を介し上記基板との間に間隔を
あけて放熱フィンを有するヒートシンクを取付け、上記
枠体と上記ヒートシンクの間をゴム系接着剤にて固着し
、上記基板と上記ヒートシンクの間に高熱伝導性のコン
パウンドを充填するという構成を採用し、これによって
上記目的を達成しようとするものである。[Means for Solving Problems] Therefore, in the present invention, a heat sink having heat dissipation fins is attached to the other surface of the substrate having the human output pin on the electronic component mounting surface with a space between it and the above substrate via the frame. , the frame body and the heat sink are fixed with a rubber adhesive, and a highly thermally conductive compound is filled between the substrate and the heat sink, thereby attempting to achieve the above object. It is something.
［実施例］
以下、本発明の実施例を第１図及び第４図に基づいて説
明する。[Example] Hereinafter, an example of the present invention will be described based on FIGS. 1 and 4.
本実施例の電子部品冷却装置は、アルミナ製の基板１に
、枠体としてのライザー１０を介してヒートシンク２０
を取付け、基板１とヒートシンク２０の間にコンパウン
ド３０を充填してなる。In the electronic component cooling device of this embodiment, a heat sink 20 is attached to an alumina substrate 1 via a riser 10 serving as a frame.
is attached, and a compound 30 is filled between the substrate 1 and the heat sink 20.
基板１の下面には電子部品としての半導体素子２を搭載
してあり、この半導体素子２を保護し且つ気密性を保つ
ためにカバー３を取付けである。A semiconductor element 2 as an electronic component is mounted on the lower surface of the substrate 1, and a cover 3 is attached to protect the semiconductor element 2 and maintain airtightness.
また、この基板１の下面には入出力“ビン４，４を格子
状に設けてあり、この人出力ピン４，４は半導体チップ
２と電気的に接続しである。Further, input/output pins 4, 4 are provided in a grid pattern on the lower surface of the substrate 1, and the output pins 4, 4 are electrically connected to the semiconductor chip 2.
ライザー１０は、基板１の上面周縁部に接着剤１１にて
固着しである。このライザー１０は、アルミナ製の基板
１と略同−の熱膨張率を有するコバールや４２合金等鉄
ニッケル合金を用いて構成しである。The riser 10 is fixed to the upper peripheral edge of the substrate 1 with an adhesive 11. The riser 10 is made of an iron-nickel alloy such as Kovar or 42 alloy, which has substantially the same coefficient of thermal expansion as the alumina substrate 1.
ヒートシンク２０は、くし歯状に多数の放熱フィン２０
ａ、２０ａを上部に突出させ、下面にライザー１０と同
一高さの凸部２０ｂを有している。このヒートシンク２
０は、押出し工法等により成形されたアルミニウム製で
あり、凸部２０ｂをライザー１０の開口部に挿入し、ゴ
ム系接着剤２１にてその下面周縁部をライザー１０に取
付けである。また、ライザー１０と凸部２０ｂは同一の
高さを有していることから、接着剤１１とゴム系接着剤
２１の寸法分、基板１とヒートシンク２０の凸部２０ｂ
の下面との間に間隔が形成されている。なお、ゴム系接
着剤２１は、硬化後ゴムのような弾性を有するようにな
るものである。The heat sink 20 has a large number of heat dissipation fins 20 in a comb-like shape.
a, 20a protrudes upward, and has a convex portion 20b at the same height as the riser 10 on the lower surface. This heat sink 2
0 is made of aluminum molded by an extrusion method or the like, and the protrusion 20b is inserted into the opening of the riser 10, and the lower peripheral edge of the riser 10 is attached to the riser 10 with a rubber adhesive 21. Furthermore, since the riser 10 and the convex portion 20b have the same height, the height of the convex portion 20b of the substrate 1 and the heat sink 20 is increased by the dimensions of the adhesive 11 and the rubber adhesive 21.
A space is formed between the lower surface of the Note that the rubber adhesive 21 becomes elastic like rubber after being cured.
上記基板１とヒートシンク２０の凸部２０ｂの間には高
熱伝導性のコンパウンド３０を充填しである。このコン
パウンド３０は、本実施例ではシリコーン樹脂に酸化金
属粉末を混合して形成してある。A highly thermally conductive compound 30 is filled between the substrate 1 and the convex portion 20b of the heat sink 20. In this embodiment, the compound 30 is formed by mixing silicone resin with metal oxide powder.
上記アルミニウム製のヒートシンク２０は、基板１やラ
イザー１０に比較して熱膨張率が３〜４倍であるが、ラ
イザー１０との間にて発生する熱応力はゴム系接着剤２
１により吸収される。そして、基板１に対しては、前述
したようにコンパウンド３０を介しているのみで、互い
に影響を与えないことから、熱膨張率に差があってもク
ラックや欠は等が発生することがない。一方、半導体素
子２からの熱は、基板１、高熱伝導性を有するコンパウ
ンド３０を介してヒートシンク２０に伝導し、このヒー
トシンク２０から放熱が行われるようになっている。The heat sink 20 made of aluminum has a coefficient of thermal expansion 3 to 4 times that of the substrate 1 and the riser 10, but the thermal stress generated between it and the riser 10 is reduced by the rubber adhesive 2.
Absorbed by 1. As described above, the substrate 1 is only connected to the compound 30 and does not affect each other, so even if there is a difference in thermal expansion coefficient, cracks, chips, etc. will not occur. . On the other hand, heat from the semiconductor element 2 is conducted to the heat sink 20 via the substrate 1 and the compound 30 having high thermal conductivity, and the heat is radiated from the heat sink 20.
本実施例によればコンパウンド３０を介して大量の熱が
ヒートシンク２０に伝導するので、ライザー１０を熱流
路にする必要がないことから熱膨張率さえ基板１と同一
であれば良く、必ずしも高熱伝導性を有する必要はない
。従って、コバール等の比較的安価な材料が選択でき、
使用量も枠であるため少量で済む。また、ヒートシンク
２０は、上述のように熱膨張率による制限を受けないの
で、ヒートシンクとして一般的に用いられる。押し出し
成形が可能であるため加工が容易で、比重が小さく、し
かも安価なアルミニウムを使用できる。この結果、従来
のように加工が困難で、比重が大きく、しかも高価な銅
−タングステン合金や銅−モリブデン合金を用いる必要
がなくなっている。According to this embodiment, a large amount of heat is conducted to the heat sink 20 via the compound 30, so there is no need to use the riser 10 as a heat flow path, so it is sufficient that the coefficient of thermal expansion is the same as that of the substrate 1, and it is not necessary to use a high thermal conductor. It doesn't have to be sexual. Therefore, relatively inexpensive materials such as Kovar can be selected,
Since the amount used is limited, only a small amount is required. Further, the heat sink 20 is not limited by the coefficient of thermal expansion as described above, and therefore is generally used as a heat sink. Since it can be extruded, it is easy to process, has a low specific gravity, and can use inexpensive aluminum. As a result, it is no longer necessary to use copper-tungsten alloys or copper-molybdenum alloys that are difficult to process, have a high specific gravity, and are expensive.
なお、本実施例の電子部品冷却装置は、図示せぬプリン
ト基板に入出力ビン４，４を介して搭載されるようにな
っている。The electronic component cooling device of this embodiment is mounted on a printed circuit board (not shown) via input/output bins 4, 4.
［発明の効果］
以上説明したように本発明は、基板に、枠体を介し基板
との間に間隔をあけてヒートシンクを取付け、ヒートシ
ンクと枠体間をゴム系接着剤にて固着し、基板とヒート
シンクの間に高熱伝導性のコンパウンドを充填したので
、ヒートシンクと枠体の間に発生する熱応力はゴム系接
着剤により吸収され、またヒートシンクは基板に対して
コンパウンドを介しており基板に影響を与えないことか
ら、基板とヒートシンクの間に熱膨張率の差があっても
クラックや欠は等の発生を防止できる。[Effects of the Invention] As explained above, the present invention includes attaching a heat sink to a substrate with a space between the frame and the substrate, fixing the heat sink and the frame with a rubber adhesive, and attaching the heat sink to the substrate with a space between the heat sink and the frame. Since a highly thermally conductive compound is filled between the heat sink and the heat sink, the thermal stress generated between the heat sink and the frame is absorbed by the rubber adhesive, and since the heat sink is connected to the board through the compound, there is no effect on the board. Therefore, even if there is a difference in thermal expansion coefficient between the substrate and the heat sink, cracks and chips can be prevented from occurring.
したがって、ヒートシンクに、比重が小さく、加工が容
易でしかも安価なアルミニウム等の材料を使用できるこ
とから、電子部品冷却装置を多数搭載する場合でもプリ
ント基板の強度を強くする部材が不要となる。更に、運
搬、保守等が容易になると共に、低価格で製造すること
ができる効果を奏する。Therefore, since a material such as aluminum, which has a low specific gravity, is easy to process, and is inexpensive, can be used for the heat sink, there is no need for a member to strengthen the printed circuit board even when a large number of electronic component cooling devices are mounted. Furthermore, transportation, maintenance, etc. can be facilitated, and it can be manufactured at low cost.
第１図は本実施例の斜視図、第２図は第１図の縦断面図
、第３図は従来例の縦断面図である。
１：基板
１０：ライザー
２０：ヒートシンク
２０ａ：放熱フィン
２１：ゴム系接着剤
３０：コンパウンドFIG. 1 is a perspective view of this embodiment, FIG. 2 is a vertical sectional view of FIG. 1, and FIG. 3 is a vertical sectional view of the conventional example. 1: Substrate 10: Riser 20: Heat sink 20a: Radiation fin 21: Rubber adhesive 30: Compound
Claims (1)
体を介し上記基板との間に間隔をあけて放熱フィンを有
するヒートシンクを取付け、上記枠体と上記ヒートシン
クの間をゴム系接着剤にて固着し、 上記基板と上記ヒートシンクの間に高熱伝導性のコンパ
ウンドを充填してなることを特徴とする電子部品冷却装
置。[Claims] A heat sink having radiation fins is attached to the other surface of the substrate having input/output pins on the electronic component mounting surface with a space between the substrate and the frame body, and the frame body and the heat sink What is claimed is: 1. An electronic component cooling device, characterized in that the substrate and the heat sink are fixed with a rubber adhesive, and a highly thermally conductive compound is filled between the substrate and the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61225341A JPH07112029B2 (en) | 1986-09-24 | 1986-09-24 | Electronic component cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61225341A JPH07112029B2 (en) | 1986-09-24 | 1986-09-24 | Electronic component cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63278261A true JPS63278261A (en) | 1988-11-15 |
| JPH07112029B2 JPH07112029B2 (en) | 1995-11-29 |
Family
ID=16827824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61225341A Expired - Lifetime JPH07112029B2 (en) | 1986-09-24 | 1986-09-24 | Electronic component cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07112029B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993016883A1 (en) * | 1992-02-26 | 1993-09-02 | Seiko Epson Corporation | Additional electronic device and electronic system |
| WO1993016882A1 (en) * | 1992-02-26 | 1993-09-02 | Seiko Epson Corporation | Additional electronic device and electronic system |
| US6025993A (en) * | 1992-05-20 | 2000-02-15 | Seiko Epson Corporation | Cartridge for electronic devices |
| WO2019107106A1 (en) * | 2017-11-28 | 2019-06-06 | 株式会社オートネットワーク技術研究所 | Circuit board and circuit board manufacturing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6036894B2 (en) | 2015-03-26 | 2016-11-30 | 日本電気株式会社 | Cooling device and equipment |
| JP2016184658A (en) | 2015-03-26 | 2016-10-20 | 日本電気株式会社 | Cooling device, and device |
-
1986
- 1986-09-24 JP JP61225341A patent/JPH07112029B2/en not_active Expired - Lifetime
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993016883A1 (en) * | 1992-02-26 | 1993-09-02 | Seiko Epson Corporation | Additional electronic device and electronic system |
| WO1993016882A1 (en) * | 1992-02-26 | 1993-09-02 | Seiko Epson Corporation | Additional electronic device and electronic system |
| US5437041A (en) * | 1992-02-26 | 1995-07-25 | Seiko Epson Corporation | Device and method for exerting force on circuit mounted on board through opening of the board to facilitate the thermal conduction between circuit and housing |
| US5615085A (en) * | 1992-02-26 | 1997-03-25 | Seiko Epson Corporation | Temperature control for add-on electronic devices |
| US6025993A (en) * | 1992-05-20 | 2000-02-15 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6404639B1 (en) | 1992-05-20 | 2002-06-11 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6515864B2 (en) | 1992-05-20 | 2003-02-04 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6608753B2 (en) | 1992-05-20 | 2003-08-19 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6845014B2 (en) | 1992-05-20 | 2005-01-18 | Seiko Epson Corporation | Cartridge for electronic devices |
| US7035108B2 (en) | 1992-05-20 | 2006-04-25 | Seiko Epson Corporation | Information processing device |
| US7345883B2 (en) | 1992-05-20 | 2008-03-18 | Seiko Epson Corporation | Processing device |
| US7359202B2 (en) | 1992-05-20 | 2008-04-15 | Seiko Epson Corporation | Printer apparatus |
| US7583505B2 (en) | 1992-05-20 | 2009-09-01 | Seiko Epson Corporation | Processor apparatus |
| WO2019107106A1 (en) * | 2017-11-28 | 2019-06-06 | 株式会社オートネットワーク技術研究所 | Circuit board and circuit board manufacturing method |
| JP2019102489A (en) * | 2017-11-28 | 2019-06-24 | 株式会社オートネットワーク技術研究所 | Circuit board and method for manufacturing circuit board |
| CN111345118A (en) * | 2017-11-28 | 2020-06-26 | 株式会社自动网络技术研究所 | Circuit board and method for manufacturing circuit board |
| CN111345118B (en) * | 2017-11-28 | 2023-07-18 | 株式会社自动网络技术研究所 | Circuit board and method for manufacturing circuit board |
| US11924960B2 (en) | 2017-11-28 | 2024-03-05 | Autonetworks Technologies, Ltd. | Circuit board and method for manufacturing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07112029B2 (en) | 1995-11-29 |
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