JPS6327054U - - Google Patents
Info
- Publication number
- JPS6327054U JPS6327054U JP12276286U JP12276286U JPS6327054U JP S6327054 U JPS6327054 U JP S6327054U JP 12276286 U JP12276286 U JP 12276286U JP 12276286 U JP12276286 U JP 12276286U JP S6327054 U JPS6327054 U JP S6327054U
- Authority
- JP
- Japan
- Prior art keywords
- same pitch
- resin
- insulating sheet
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂは夫々本考案の一実施例であるホ
トカプラの内部構造を示す断面図及び上面図、第
２図は同実施例の一部を拡大した斜視図、第３図
は従来例のパツケージ構造を示す斜視図、第４図
は来例の一部を拡大した斜視図である。 １：第１リードフレーム、２：第２リードフレ
ーム、３：絶縁シート、７，８：樹脂。
トカプラの内部構造を示す断面図及び上面図、第
２図は同実施例の一部を拡大した斜視図、第３図
は従来例のパツケージ構造を示す斜視図、第４図
は来例の一部を拡大した斜視図である。 １：第１リードフレーム、２：第２リードフレ
ーム、３：絶縁シート、７，８：樹脂。
Claims (1)
- 同一ピツチの２枚のリードフレームを絶縁シー
トを介在させて上下に重ね合せ、樹脂モールドパ
ツケージ外部へ延びる同一ピツチのアウターリー
ドを形成してなることを特徴とする樹脂封止型半
導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12276286U JPS6327054U (ja) | 1986-08-07 | 1986-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12276286U JPS6327054U (ja) | 1986-08-07 | 1986-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6327054U true JPS6327054U (ja) | 1988-02-22 |
Family
ID=31013261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12276286U Pending JPS6327054U (ja) | 1986-08-07 | 1986-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6327054U (ja) |
-
1986
- 1986-08-07 JP JP12276286U patent/JPS6327054U/ja active Pending