JPS6325339U - - Google Patents
Info
- Publication number
- JPS6325339U JPS6325339U JP11907586U JP11907586U JPS6325339U JP S6325339 U JPS6325339 U JP S6325339U JP 11907586 U JP11907586 U JP 11907586U JP 11907586 U JP11907586 U JP 11907586U JP S6325339 U JPS6325339 U JP S6325339U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- sensitive element
- wiring conductor
- sensitive
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第1図は本考案の一実施例による温度検出器を
示す図、第2図は従来の温度検出器を示す図であ
る。
5′……セラミツク支持基板、5a……開口部
、6……感熱素子、7……支持台、8……保護コ
ーテイング、9……配線導体、10……電極、1
1……感熱膜。
FIG. 1 is a diagram showing a temperature detector according to an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional temperature detector. 5'... Ceramic support substrate, 5a... Opening, 6... Heat sensitive element, 7... Support stand, 8... Protective coating, 9... Wiring conductor, 10... Electrode, 1
1...Thermosensitive film.
Claims (1)
を形成したチツプ状感熱素子と、この感熱素子を
保持固定する部分に開口部を有し、配線用導体が
印刷形成されたセラミツク支持基板を備え、上記
感熱素子の電極と上記配線用導体を導電性接着剤
にて接続する温度検出器。 It includes a chip-shaped heat-sensitive element with a pair of electrodes and a heat-sensitive film formed on one side of a ceramic substrate, and a ceramic support substrate with an opening in the part that holds and fixes the heat-sensitive element, and on which a wiring conductor is printed. , a temperature sensor in which the electrode of the heat-sensitive element and the wiring conductor are connected with a conductive adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11907586U JPS6325339U (en) | 1986-08-01 | 1986-08-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11907586U JPS6325339U (en) | 1986-08-01 | 1986-08-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6325339U true JPS6325339U (en) | 1988-02-19 |
Family
ID=31006114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11907586U Pending JPS6325339U (en) | 1986-08-01 | 1986-08-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6325339U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006112983A (en) * | 2004-10-18 | 2006-04-27 | Hitachi Ltd | Controller |
JP2012508870A (en) * | 2008-11-14 | 2012-04-12 | エプコス アクチエンゲゼルシャフト | Sensor element and method for manufacturing sensor element |
JP2012078253A (en) * | 2010-10-04 | 2012-04-19 | Semitec Corp | Non-contact type temperature sensor |
-
1986
- 1986-08-01 JP JP11907586U patent/JPS6325339U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006112983A (en) * | 2004-10-18 | 2006-04-27 | Hitachi Ltd | Controller |
JP2012508870A (en) * | 2008-11-14 | 2012-04-12 | エプコス アクチエンゲゼルシャフト | Sensor element and method for manufacturing sensor element |
JP2012078253A (en) * | 2010-10-04 | 2012-04-19 | Semitec Corp | Non-contact type temperature sensor |
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