JPS6324857U - - Google Patents
Info
- Publication number
- JPS6324857U JPS6324857U JP1986118584U JP11858486U JPS6324857U JP S6324857 U JPS6324857 U JP S6324857U JP 1986118584 U JP1986118584 U JP 1986118584U JP 11858486 U JP11858486 U JP 11858486U JP S6324857 U JPS6324857 U JP S6324857U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- mask plate
- display
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986118584U JPH0416468Y2 (US07923587-20110412-C00022.png) | 1986-07-31 | 1986-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986118584U JPH0416468Y2 (US07923587-20110412-C00022.png) | 1986-07-31 | 1986-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6324857U true JPS6324857U (US07923587-20110412-C00022.png) | 1988-02-18 |
| JPH0416468Y2 JPH0416468Y2 (US07923587-20110412-C00022.png) | 1992-04-13 |
Family
ID=31005173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986118584U Expired JPH0416468Y2 (US07923587-20110412-C00022.png) | 1986-07-31 | 1986-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416468Y2 (US07923587-20110412-C00022.png) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0415037A (ja) * | 1990-05-08 | 1992-01-20 | Sony Corp | 脈診装置 |
| JP2004259958A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
| KR100496066B1 (ko) * | 2002-06-04 | 2005-06-16 | 에이피전자 주식회사 | 엘이디전광판의 기판에 정밀한 실링제의 주사를 위한 선캡 |
| JP2006120691A (ja) * | 2004-10-19 | 2006-05-11 | Matsushita Electric Ind Co Ltd | 線状光源装置 |
| JP2006517738A (ja) * | 2003-02-07 | 2006-07-27 | 松下電器産業株式会社 | 発光体用金属ベース基板、発光光源、照明装置及び表示装置 |
| JP2006210624A (ja) * | 2005-01-27 | 2006-08-10 | Toshiba Lighting & Technology Corp | 発光装置 |
| JP2007123939A (ja) * | 2007-01-29 | 2007-05-17 | Kyocera Corp | 発光装置 |
| JP2007142477A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
| JP2007142476A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
| JP2008182271A (ja) * | 2003-01-09 | 2008-08-07 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
| JP2008294309A (ja) * | 2007-05-25 | 2008-12-04 | Showa Denko Kk | 発光装置、表示装置 |
| JP2012178581A (ja) * | 2006-03-03 | 2012-09-13 | Lg Innotek Co Ltd | 発光ダイオードパッケージ |
| JP2013120840A (ja) * | 2011-12-07 | 2013-06-17 | Shin Etsu Chem Co Ltd | 積層基板 |
| WO2014061555A1 (ja) * | 2012-10-19 | 2014-04-24 | シャープ株式会社 | 発光装置および発光装置のヒートシンクへの取付構造 |
| JP2014146653A (ja) * | 2013-01-28 | 2014-08-14 | Dainippon Printing Co Ltd | 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体、樹脂付きリードフレーム、光半導体装置 |
| JP2014235212A (ja) * | 2013-05-31 | 2014-12-15 | 三菱電機株式会社 | 映像表示装置 |
| JP2014236175A (ja) * | 2013-06-05 | 2014-12-15 | 日亜化学工業株式会社 | 発光装置 |
| JP2015096875A (ja) * | 2013-11-15 | 2015-05-21 | 三菱電機株式会社 | 表示装置 |
| JP2017187710A (ja) * | 2016-04-08 | 2017-10-12 | 三菱電機株式会社 | 表示装置 |
| JP2017188589A (ja) * | 2016-04-06 | 2017-10-12 | 日亜化学工業株式会社 | 発光装置 |
| JP2019075552A (ja) * | 2017-10-12 | 2019-05-16 | ルーメンス カンパニー リミテッド | ディスプレイ用ｌｅｄモジュール組立体 |
-
1986
- 1986-07-31 JP JP1986118584U patent/JPH0416468Y2/ja not_active Expired
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0415037A (ja) * | 1990-05-08 | 1992-01-20 | Sony Corp | 脈診装置 |
| KR100496066B1 (ko) * | 2002-06-04 | 2005-06-16 | 에이피전자 주식회사 | 엘이디전광판의 기판에 정밀한 실링제의 주사를 위한 선캡 |
| JP4574694B2 (ja) * | 2003-01-09 | 2010-11-04 | 京セラ株式会社 | 発光素子収納用パッケージおよび発光装置 |
| JP2008182271A (ja) * | 2003-01-09 | 2008-08-07 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
| JP2006517738A (ja) * | 2003-02-07 | 2006-07-27 | 松下電器産業株式会社 | 発光体用金属ベース基板、発光光源、照明装置及び表示装置 |
| JP2004259958A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
| JP2006120691A (ja) * | 2004-10-19 | 2006-05-11 | Matsushita Electric Ind Co Ltd | 線状光源装置 |
| JP2006210624A (ja) * | 2005-01-27 | 2006-08-10 | Toshiba Lighting & Technology Corp | 発光装置 |
| US8796717B2 (en) | 2006-03-03 | 2014-08-05 | Lg Innotek Co., Ltd. | Light-emitting diode package and manufacturing method thereof |
| JP2012178581A (ja) * | 2006-03-03 | 2012-09-13 | Lg Innotek Co Ltd | 発光ダイオードパッケージ |
| JP2007123939A (ja) * | 2007-01-29 | 2007-05-17 | Kyocera Corp | 発光装置 |
| JP2007142476A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
| JP2007142477A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
| JP2008294309A (ja) * | 2007-05-25 | 2008-12-04 | Showa Denko Kk | 発光装置、表示装置 |
| JP2013120840A (ja) * | 2011-12-07 | 2013-06-17 | Shin Etsu Chem Co Ltd | 積層基板 |
| WO2014061555A1 (ja) * | 2012-10-19 | 2014-04-24 | シャープ株式会社 | 発光装置および発光装置のヒートシンクへの取付構造 |
| JP2014146653A (ja) * | 2013-01-28 | 2014-08-14 | Dainippon Printing Co Ltd | 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体、樹脂付きリードフレーム、光半導体装置 |
| JP2014235212A (ja) * | 2013-05-31 | 2014-12-15 | 三菱電機株式会社 | 映像表示装置 |
| JP2014236175A (ja) * | 2013-06-05 | 2014-12-15 | 日亜化学工業株式会社 | 発光装置 |
| US10429011B2 (en) | 2013-06-05 | 2019-10-01 | Nichia Corporation | Method of manufacturing light emitting device |
| JP2015096875A (ja) * | 2013-11-15 | 2015-05-21 | 三菱電機株式会社 | 表示装置 |
| JP2017188589A (ja) * | 2016-04-06 | 2017-10-12 | 日亜化学工業株式会社 | 発光装置 |
| US10026718B2 (en) | 2016-04-06 | 2018-07-17 | Nichia Corporation | Light emitting device |
| JP2017187710A (ja) * | 2016-04-08 | 2017-10-12 | 三菱電機株式会社 | 表示装置 |
| JP2019075552A (ja) * | 2017-10-12 | 2019-05-16 | ルーメンス カンパニー リミテッド | ディスプレイ用ｌｅｄモジュール組立体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416468Y2 (US07923587-20110412-C00022.png) | 1992-04-13 |
