JPS6324063A - Device for preventing deposition of volatilized material on surface not to be vapor-deposited in physical vapor deposition equipment - Google Patents

Abstract

PURPOSE:To prevent the vapor deposition on one surface not to be vapor-deposited and to recover an ineffective vapor-deposited material by passing an endless belt through a vapor deposition region while bringing the belt into close contact with the one surface not to be vapor-deposited when a metal is vapor-deposited on the other surface of a strip metal by physical vapor deposition (PVD). CONSTITUTION:A strip metal 3 such as a silicon steel sheet is traveled above a vapor deposition source 2 consisting of a vapor deposition metal such as Al and Ti in the direction as shown by the arrow A in a vacuum deposition chamber 1, and the vapor of Al, Ti, etc., from the vapor deposition source 2 is deposited on the surface 3a. At this time, the endless belt 4 is traveled by auxiliary rolls 5a, 5b, and 5c at the same speed as the strip metal in the direction as shown by the arrow B while bringing the belt into close contact with the rear surface of the strip metal 3 to be vapor- deposited. The vapor deposition metal is not deposited on the rear surface of the strip metal 3 because of the presence of the endless belt 4, and the metal deposited on the endless belt 4 is scraped off by scrapers 6a and 6b and efficiently recovered in recovery boxes 7a and 7b.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) This invention involves a physical vapor deposition process (hereinafter referred to as PVD) on one side of a strip.
In particular, it relates to a device that prevents evaporated matter from adhering to the non-evaporated surface of a strip and also advantageously recovers ineffective evaporated matter.

PVD includes a vacuum evaporation method, a sputtering method, an ion blating method, and the like, all of which belong to dry processes for film formation.

(Prior art) Among PVD, for example, vacuum evaporation basically consists of a evaporation chamber for performing evaporation, an exhaust device for keeping the inside of the chamber in a vacuum, an evaporation source for accommodating the substance to be evaporated, and This is generally carried out using a heating device to heat and evaporate the substance.

By the way, when performing continuous vacuum evaporation treatment on a strip-shaped object, an important industrially or economically important issue is how much of the substance to be evaporated (hereinafter referred to as evaporated material) can be deposited on the strip-shaped object. be.

When vapor deposition is applied to the surface of a strip, the evaporated material also wraps around the back side of the non-evaporated surface and adheres mainly to the side edges of the strip, forming an unnecessary partial film on the back surface and causing product damage. This will adversely affect the quality, and if vapor deposition is subsequently performed on the back side, the thickness of the coating on the back side will be non-uniform.

On the other hand, invalid vapors that do not contribute to film formation may also be dispersed within the evaporation chamber, and this invalid thin air may accumulate within the evaporation chamber. Removal of deposited evaporated material is labor-intensive and, in extreme cases, the drive parts in the deposition chamber (e.g. the conveyor of the strip).
Form C also applies to the operation of .

Therefore, with the aim of improving vapor deposition efficiency, techniques have been proposed to improve the shape of the evaporation source, the relative position between the evaporated material and the material to be processed, or to introduce a shield into the vapor deposition chamber.

However, for example, if the evaporation source is placed very close to a target material having a large evaporation area, the evaporation efficiency will increase, but the uniformity of the coating, which is the most important characteristic during evaporation, will be impaired. In this way, since there is an appropriate relative position between the evaporated material and the material to be treated to obtain the desired coating characteristics, it is generally not possible to freely change their position.

As one of the solutions to this problem,
Publication No. 9 discloses that a shield is provided in the tank to prevent evaporated substances from scattering in unnecessary directions such as the wall of the vacuum tank.

There is also a method of improving the thin coating efficiency by providing a guide that comes into contact with the material to be treated, as disclosed in Japanese Patent Application Laid-Open No. 58-133375.

However, neither of these documents describes how to prevent evaporated materials from getting around and adhering to non-evaporated surfaces.

(Problems to be Solved by the Invention) Therefore, it is desirable to provide an apparatus that can prevent evaporated substances from adhering to non-evaporated surfaces and also recover ineffective evaporated substances when performing vapor deposition processing on a strip-shaped object. This is the object of the invention.

(Means for Solving the Problems) The present invention provides a physical vapor deposition treatment facility for continuously depositing evaporated material on the surface of a strip-shaped material introduced into a vapor deposition chamber. Per covered area,
A device for preventing evaporated matter from adhering to a non-evaporated surface in a physical vapor deposition processing facility, comprising an endless belt that moves closely with the back surface of the strip, and a scraper that collects evaporated matter adhering to the front and back surfaces of the endless belt. It is.

Now, a back side adhesion prevention device according to the present invention is shown in FIGS. 1 and 2.

In the figure, 1 is a vapor deposition chamber, and 2 is an evaporation source provided at the inner bottom of the vapor deposition chamber 1, which accommodates evaporated substances such as Ti and Al. This evaporated material is evaporated by a heating device such as an electron beam gun or a high-frequency heating device (not shown), and continuously coats the surface 3a of the strip 3 such as a silicon steel plate.

4 is an endless belt that prevents evaporated matter from adhering to the back surface of the strip 3, and includes a plurality of rotatable auxiliary rolls 5a, 5.
b and 5c are wound endlessly. Furthermore, the endless belt 4 moves together with the strip 3 in close contact with at least the region of the strip 3 to be coated. Therefore, when the strip 3 moves in the direction of the arrow, the endless belt 4 moves in the direction of the arrow B. As shown in FIG. 2, the endless belt 4 is desirably made sufficiently wider than the strip 3 so as to cover the entire evaporated region.

Also, 6a and 6b are scrapers provided in contact with the front and back surfaces of the endless belt 4, and 7a and 7b are collection boxes for evaporated matter scraped off by the scrapers. 8a and 8b are screws, and by adjusting these screws, the deflection of the endless belt 4 is absorbed.

(Function) As described above, when performing vapor deposition treatment on the surface of the strip 3, the endless belt 4 moves closely with the back surface of the strip 3, so the width is sufficiently wider than that of the strip 3. By using the endless belt 4, it is possible to prevent the evaporated matter from the evaporation source 2 from going around to the back surface of the strip 3.

Furthermore, even if a small amount of evaporated matter may get around to the back surface of the strip 3, since the endless belt 4 is in close contact with the back surface, the evaporated material will adhere to the endless belt 4.

Then, the evaporated matter adhering to the front and back surfaces of the endless belt 4 is scraped off using scrapers 6a and 6b, and placed in a collection box. a
, collect to 7b.

(Example) After final annealing of a unidirectional silicon steel plate (0.23 mm thick), the annealing separator on the surface of the steel plate was removed, and a coil (approximately 7.5 tons) was wound up and passed through a vacuum evaporation treatment facility. 0.6μm thick TiN on the surface of the steel plate at a speed of 30m/min.
When the tension film was formed using the evaporated matter adhesion prevention device shown in FIG. 1, no adhesion of TiN to the back surface of the steel plate was observed.

(Effects of the Invention) According to the present invention, when performing vapor deposition treatment on one side of a strip, it is possible to prevent evaporated matter from wrapping around and adhering to the non-evaporation surface on the back side,
In addition, ineffective vapor can be recovered advantageously, and when both sides of a strip are continuously vapor-deposited one side at a time, the thickness of the coating in the width direction due to the evaporated material wrapping around and adhering to the back side before the evaporated material side vapor deposition treatment is reduced. can be made uniform.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the evaporated matter adhesion prevention device according to the present invention. FIG. 2 is a view taken along the line nn in FIG. 1.

Claims (1)

[Scope of Claims] 1. In a physical vapor deposition treatment facility that continuously coats the surface of a strip-like material introduced into a vapor deposition chamber with evaporated material, at least the evaporated material-covered area of the strip-like material is A device for preventing evaporated matter from adhering to a non-evaporated surface in a physical vapor deposition processing facility, comprising an endless belt that moves in close contact with the back surface of a strip, and a scraper that collects evaporated matter adhering to the front and back surfaces of the endless belt.